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AMD XCKU115-2FLVD1517I
- Part No.:
- XCKU115-2FLVD1517I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU115-2FLVD1517I.pdf
- Description:
- IC FPGA 338 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,492
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Product details
Overview
XCKU115-2FLVD1517I from AMD (formerly Xilinx) is a high-performance Kintex UltraScale FPGA featuring 1,124,000 logic cells, 6,930 DSP slices, and 84.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). Used in high-bandwidth data acquisition systems requiring deterministic latency and real-time processing.
For engineers reviewing the XCKU115-2FLVD1517I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V/1.35 V/1.8 V), transceiver line rates up to 16.3 Gb/s, and configuration via Quad-SPI or BPI.
Technical Context
The XCKU115-2FLVD1517I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and multi-gigabit transceivers. It uses 20nm bulk CMOS process and supports partial reconfiguration for dynamic function swapping.
Configuration occurs through Master SPI, Slave SelectMAP, or JTAG; bitstream encryption and HMAC authentication are supported for secure boot. The device integrates 24 GTY transceivers with built-in PRBS generators and error detectors for serial link validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,124,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 6,930 - enables parallel fixed/floating-point arithmetic for radar, AI inference, or digital filtering |
| Block RAM | 84.5 Mb - provides on-die memory for FIFOs, buffers, or lookup tables without external DRAM |
| Transceiver Max Rate | 16.3 Gb/s - supports 25G Ethernet, CPRI, and JESD204B interface compliance |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - enables direct interfacing with ADCs, DACs, FPGAs, and processors |
| Speed Grade | -2 - guarantees timing closure at highest operating frequencies for critical paths |
| Temp Range | -40°C to +100°C - qualified for industrial and outdoor embedded deployments without derating |
Pinout & Package
Package: 1517-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, thermally enhanced with integrated heat spreader. Dimensions: 49.0 mm × 49.0 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-use I/O bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS peripherals in Zynq UltraScale+ MPSoC hybrid mode |
| GTY_TX/RX_[0:23] | High-speed transceiver pair | Supports 10–16.3 Gb/s serial protocols; requires AC-coupling and precise PCB trace length matching |
| VRP/VRN | Reference voltage pins | Provide termination reference for differential I/O standards (e.g., LVDS, TMDS); must be decoupled per bank |
| CONFIG_M[2:0] | Configuration mode select | Determines boot source (SPI, BPI, JTAG); hardwired during power-up before configuration begins |
| VCCINT | Core supply | Supplies 0.85 V ±3% to programmable logic and routing; requires low-noise, high-PSSR regulation |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 controller | Reduces RTL integration effort and ensures protocol compliance without soft-core overhead |
| UltraScale+ architecture with ASIC-like clocking | Enables sub-100 ps clock skew across large designs for synchronous high-speed signal processing |
| Integrated 10/25G Ethernet MAC | Eliminates need for external PHY or MAC logic, accelerating network interface development |
| Secure boot with AES-256 & HMAC-SHA2-256 | Prevents unauthorized bitstream loading and runtime tampering in mission-critical systems |
| Partial reconfiguration support | Allows dynamic module swapping in operational systems-e.g., switching between radar waveform engines |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; GTY transceivers interface with high-speed ADC/DACs. Use Value: 1,124K logic cells and 6,930 DSP slices enable concurrent multi-channel processing at ≤1 μs latency. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel processing in active antenna units (AAUs). IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD algorithms; PCIe Gen3 x16 links to host CPU for control plane communication. Use Value: 16.3 Gb/s GTY transceivers support JESD204B subclass 1 for deterministic framer-to-FPGA data transfer. |
| Medical Imaging Acceleration | Test & Measurement Equipment |
Use Scenario: Real-time image reconstruction in MRI and CT scanners using iterative algorithms and back-projection. IC Role / Device Role / Timing Role: Block RAM and DSP slices accelerate matrix operations; DDR4-2400 interface feeds high-throughput sensor data streams. Use Value: 84.5 Mb on-chip RAM reduces external memory bandwidth bottlenecks and improves reconstruction frame rate. | Use Scenario: High-resolution oscilloscopes and protocol analyzers capturing multi-GHz analog/digital signals. IC Role / Device Role / Timing Role: Logic fabric performs real-time pattern matching and trigger generation; GTY lanes stream captured data to host PC. Use Value: -2 speed grade ensures reliable operation at 500+ MHz system clocks required for 10 GS/s sampling control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-1FLVD1517I | Slower -1 speed grade; lower max frequency and higher timing margin requirement | Suitable for cost-sensitive designs where full -2 performance is unused | Select when design meets timing with relaxed constraints and lower power consumption is prioritized |
| XCKU15P-2FLVD1517I | Higher logic density (1,375K LC), more DSP slices (7,200), same package and I/O count | Better suited for next-generation systems requiring additional compute headroom | Choose when migrating from XCKU115 with minimal PCB change but higher algorithmic complexity |
Compared with XCKU115-1FLVD1517I, the XCKU115-2FLVD1517I delivers tighter timing closure for high-frequency control loops; versus XCKU15P-2FLVD1517I, it offers proven maturity and lower unit cost while meeting most current 25G and radar workloads.
Availability
XCKU115-2FLVD1517I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband infrastructure, and medical imaging acceleration requiring stable component supply across long production lifecycles.
Supply support for XCKU115-2FLVD1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Kintex UltraScale family targets high-performance, cost-optimized applications in wired communications, test equipment, and aerospace systems where power efficiency and I/O bandwidth are critical.
FAQ
What is the maximum supported DDR4 memory interface speed for the XCKU115-2FLVD1517I?
The XCKU115-2FLVD1517I supports DDR4-2400 (1200 MHz) with 64-bit data bus width and integrated memory controller. This enables sustained bandwidth up to 19.2 GB/s per interface, validated across industrial temperature range and compatible with JEDEC-compliant DIMMs and discrete components.
Does the XCKU115-2FLVD1517I support partial reconfiguration?
Yes, the XCKU115-2FLVD1517I fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of logical modules-such as different filter banks or modulation schemes-without resetting the entire device or interrupting active I/O channels.
What transceiver protocols are natively supported by the GTY transceivers in the XCKU115-2FLVD1517I?
The GTY transceivers in the XCKU115-2FLVD1517I natively support PCIe Gen3, 10/25G Ethernet, CPRI, JESD204B, and DisplayPort 1.4. Protocol support is implemented in hardened logic, eliminating the need for soft transceiver cores and ensuring deterministic latency.
Is the XCKU115-2FLVD1517I pin-compatible with other Kintex UltraScale devices in the same package?
The XCKU115-2FLVD1517I shares the 1517-pin FCBGA package footprint with XCKU040, XCKU060, and XCKU085 variants, but pin functions differ significantly across densities. Direct replacement requires verification of I/O banking, voltage assignments, and transceiver placement-not guaranteed across models.
What configuration modes does the XCKU115-2FLVD1517I support?
The XCKU115-2FLVD1517I supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Configuration mode is selected via CONFIG_M[2:0] pins at power-up; Quad-SPI is most common for fast, single-image boot with small flash footprint.
XCKU115-2FLVD1517I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU115-2FLVD1517I FAQ
1.How can I place an order for XCKU115-2FLVD1517I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-2FLVD1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-2FLVD1517I reliable?
The price and inventory of XCKU115-2FLVD1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-2FLVD1517I is usually 5 days.
3.What payment methods are accepted for XCKU115-2FLVD1517I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-2FLVD1517I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-2FLVD1517I?
XCKU115-2FLVD1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-2FLVD1517I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-2FLVD1517I?
For technical support, including XCKU115-2FLVD1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-2FLVD1517I requirements.
6.How does Aetrix verify that XCKU115-2FLVD1517I is sourced from the original manufacturer or authorized distributors?
All XCKU115-2FLVD1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-2FLVD1517I meets industry standards.
7.What is the process for return or replacement of XCKU115-2FLVD1517I?
All XCKU115-2FLVD1517I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-2FLVD1517I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-2FLVD1517I part is unused and in its original packaging.
Return procedure for XCKU115-2FLVD1517I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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