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AMD XCKU115-2FLVD1924E
- Part No.:
- XCKU115-2FLVD1924E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XCKU115-2FLVD1924E.pdf
- Description:
- IC FPGA 832 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,245
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Product details
Overview
XCKU115-2FLVD1924E from AMD is a high-performance Kintex UltraScale FPGA with 1,174,000 logic cells, 6,840 DSP slices, and 72.5 Mb of block RAM. It features 1924-pin flip-chip land grid array (FC-LGA) packaging, supports up to 24.8 Gb/s GTY transceivers, and targets high-bandwidth data processing in radar signal conditioning and 5G baseband subsystems.
For engineers reviewing the XCKU115-2FLVD1924E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, thermal performance under sustained 28W TDP, and configuration interface compatibility with SPIx4 or BPI.
Technical Context
The XCKU115-2FLVD1924E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x16, 10/25/100G Ethernet MAC), and memory controllers for DDR4-2400. Its UltraScale+ interconnect fabric enables deterministic timing closure across multi-gigabit serial lanes and wide parallel buses.
Configuration occurs via dual-mode fallback support (master SPI/BPI) with AES-256 bitstream encryption and HMAC authentication. The device operates across industrial temperature range (–40°C to +100°C junction) and requires precise power sequencing across VCCINT, VCCAUX, and VRP rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,174,000 - Enables complex algorithm acceleration with >10k LUT-based pipeline stages |
| DSP Slices | 6,840 - Supports concurrent 27×18 multiply-accumulate operations at 500 MHz |
| Block RAM | 72.5 Mb - Provides on-die buffering for 4K60 video frame stores or packet reassembly buffers |
| GTY Transceivers | 40 channels @ 24.8 Gb/s - Meets IEEE 802.3bs for 100G CAUI-4 and CPRI Option 10 links |
| I/O Standards | LVDS, SSTL, HSTL, MIPI D-PHY - Allows direct interfacing to ADCs, DDR4, and image sensors |
| Configuration Interface | Quad-SPI x4 or BPI x16 - Enables secure boot from encrypted flash with <500 ms startup time |
| Thermal Design Power | 28 W - Requires heatsink + forced airflow per UG578 thermal guidelines |
Pinout & Package
Package: 1924-pin Flip-Chip Land Grid Array (FC-LGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to programmable logic and CLB fabric; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, PCIe hard IP, and clock management tiles |
| MIO[0:7] | Multi-use I/O bank | Configurable as SDIO, UART, I2C, or GPIO; supports 1.8 V/3.3 V I/O standards |
| GTYP[0:39] | Transceiver differential pair | Each pair supports 24.8 Gb/s PAM4 or NRZ; requires AC-coupled 100 Ω differential routing |
| CONFIG_DONE | Configuration status output | Drives high after successful bitstream load and CRC check; used for system reset synchronization |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 controller | Reduces RTL integration effort by eliminating PHY layer design and link training logic |
| UltraScale+ memory controller | Supports DDR4-2400 with ECC, enabling reliable 64-bit wide memory interfaces up to 128 GB capacity |
| AES-256 + HMAC security | Prevents unauthorized bitstream cloning and ensures runtime integrity verification |
| Dynamic function exchange (DFX) | Allows partial reconfiguration of logic regions without disrupting active transceiver or memory operations |
| Integrated 10/25/100G Ethernet MAC | Offloads TCP/IP stack processing and reduces host CPU overhead in network accelerator designs |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler filtering in airborne SAR systems. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and STAP algorithms; GTY transceivers stream ADC samples from 12-bit 2.6 GSPS RF front-ends. Use Value: 6,840 DSP slices enable 128-channel simultaneous Doppler processing at <10 µs latency. | Use Scenario: Distributed unit (DU) processing for 3GPP Release 15/16 compliant 5G NR infrastructure. IC Role / Device Role / Timing Role: Implements Layer 1 PHY functions including LDPC encoding/decoding, OFDM modulation, and channel estimation. Use Value: Hardened 100G Ethernet MAC and 24.8 Gb/s GTY links support fronthaul CPRI/eCPRI transport with sub-100 ns jitter. |
| High-Performance Computing Acceleration | Medical Imaging Reconstruction |
Use Scenario: Co-processing engine for financial risk modeling using Monte Carlo simulation kernels. IC Role / Device Role / Timing Role: Configurable logic accelerates double-precision floating-point reduction and random number generation. Use Value: 1,174,000 logic cells and 72.5 Mb block RAM sustain >256 concurrent simulation threads with zero external memory stalls. | Use Scenario: Real-time iterative reconstruction of PET/CT volumetric datasets. IC Role / Device Role / Timing Role: Executes back-projection and statistical noise filtering pipelines while streaming data from 256-channel detector arrays. Use Value: DDR4-2400 memory controller and 40 GTY lanes enable 8 GB/s sustained bandwidth for 512×512×256 voxel updates at 30 fps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVA2104I | 2104-pin FC-LGA, higher I/O count (832), lower max transceiver speed (16.3 Gb/s GTY) | Better suited for I/O-bound protocols like PCIe Gen4 x8 + DDR4-2666 dual-channel | Select when pin count and parallel bus width outweigh serial line rate requirements |
| XCVU13P-2FLGA2577E | Virtex UltraScale+ family, 1,322,000 logic cells, 2577-pin package, 32 GTY lanes @ 25.8 Gb/s | Targeted at AI inference acceleration with higher DSP density and HBM2 integration capability | Choose for memory-bandwidth-intensive workloads requiring >1 TB/s on-package memory access |
Compared with XCKU115-2FLVD1924E, the XCKU115-2FLVA2104I trades transceiver speed for I/O scalability, while the XCVU13P-2FLGA2577E adds HBM2 support and higher logic density at increased cost and power-making XCKU115-2FLVD1924E optimal for balanced serial+parallel throughput in radar and 5G DU deployments.
Availability
XCKU115-2FLVD1924E is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband units, and medical imaging reconstruction requiring stable component supply and long-term industrial lifecycle support.
Supply support for XCKU115-2FLVD1924E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets through its FPGA, adaptive SoC, and GPU product lines.
The Kintex UltraScale family delivers optimized price-performance for high-throughput, low-latency applications including wireless infrastructure, test & measurement, and aerospace avionics.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCKU115-2FLVD1924E?
The XCKU115-2FLVD1924E supports GTY transceivers operating at up to 24.8 Gb/s per lane in NRZ mode, validated per UG578 and compatible with IEEE 802.3bs 100GBASE-CR4 and CPRI Option 10 specifications. This rate is achievable across all 40 GTY quads under industrial temperature conditions with proper PCB stackup and AC coupling.
Does the XCKU115-2FLVD1924E support PCIe Gen4?
No, the XCKU115-2FLVD1924E integrates a hardened PCIe Gen3 x16 endpoint/root port controller, not Gen4. It achieves 8 GT/s per lane with full link training and ASPM support. For PCIe Gen4 compliance, AMD recommends the Virtex UltraScale+ VU13P or Versal ACAP families.
What configuration modes does the XCKU115-2FLVD1924E support?
The XCKU115-2FLVD1924E supports master SPI x4, slave SPI x1/x2/x4, and BPI x8/x16 configuration modes. Dual-boot fallback is enabled via dedicated M[2:0] pins, allowing seamless recovery from corrupted bitstreams. Configuration security includes AES-256 decryption and HMAC-256 authentication.
Is the XCKU115-2FLVD1924E qualified for automotive applications?
No, the XCKU115-2FLVD1924E is rated for industrial temperature range (–40°C to +100°C junction) and is not AEC-Q100 qualified. For automotive ADAS or infotainment applications, AMD offers the XCKU15P-2FFVD1156I with extended qualification and safety features including SEU mitigation and ISO 26262 ASIL-B support.
What is the total block RAM capacity of the XCKU115-2FLVD1924E?
The XCKU115-2FLVD1924E provides 72.5 Mb of total block RAM, distributed across 2,880 BRAM primitives (each 36 Kb). This capacity supports dual-port configurations, true dual-port operation, and cascade chaining for deep FIFOs or large lookup tables-verified in UG574 Table 1-10 and applicable across all speed grades.
XCKU115-2FLVD1924E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XCKU115-2FLVD1924E FAQ
1.How can I place an order for XCKU115-2FLVD1924E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-2FLVD1924E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-2FLVD1924E reliable?
The price and inventory of XCKU115-2FLVD1924E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-2FLVD1924E is usually 5 days.
3.What payment methods are accepted for XCKU115-2FLVD1924E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-2FLVD1924E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-2FLVD1924E?
XCKU115-2FLVD1924E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-2FLVD1924E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-2FLVD1924E?
For technical support, including XCKU115-2FLVD1924E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-2FLVD1924E requirements.
6.How does Aetrix verify that XCKU115-2FLVD1924E is sourced from the original manufacturer or authorized distributors?
All XCKU115-2FLVD1924E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-2FLVD1924E meets industry standards.
7.What is the process for return or replacement of XCKU115-2FLVD1924E?
All XCKU115-2FLVD1924E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-2FLVD1924E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-2FLVD1924E part is unused and in its original packaging.
Return procedure for XCKU115-2FLVD1924E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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