AMD XCKU115-2FLVD1924I

Overview

XCKU115-2FLVD1924I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,840 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 Mbps, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-bandwidth data acceleration and real-time signal processing systems.

For engineers reviewing the XCKU115-2FLVD1924I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (856), transceiver line rate (16.3 Gb/s), power delivery requirements, thermal management for FLVD1924 package, and configuration interface compatibility (e.g., Quad-SPI, BPI, JTAG).

Technical Context

The XCKU115-2FLVD1924I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and multi-rate transceivers. Its UltraScale+ architecture enables time-multiplexed I/O and dynamic reconfiguration via partial reconfiguration support.

It integrates 24 GTY transceivers capable of 16.3 Gb/s line rates, dual 12-bit 1MSPS ADCs for system monitoring, and supports configuration via Master SPI, Slave SelectMAP, or JTAG. The -2 speed grade guarantees timing closure at maximum operating frequencies under industrial thermal conditions.

Key Specifications

Pinout & Package

The XCKU115-2FLVD1924I is housed in a 1924-ball Flip-Chip Land Grid Array (FLGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in high-power FPGA applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA acceleration applications.

Compared with XCKU115-2FLVD1924I, the XCKU115-2FLVA2104I offers more I/O and routing flexibility at the expense of board area and thermal design complexity, while the XCKU085-2FLVA1156I delivers 35% lower logic capacity and 20% fewer transceivers but reduces power consumption and system cost for scaled-down workloads.

Availability

XCKU115-2FLVD1924I is available at Aetrix Electronics and suitable for 5G infrastructure, defense electronics, and industrial AI edge computing requiring stable component supply across extended product lifecycles.

Supply support for XCKU115-2FLVD1924I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA, GPU, and CPU design.

The Kintex UltraScale family targets high-performance, cost-sensitive applications demanding high logic density, advanced I/O, and hardened IP - especially in communications, test & measurement, and aerospace systems.

FAQ

What is the maximum supported DDR4 data rate for the XCKU115-2FLVD1924I?

The XCKU115-2FLVD1924I supports DDR4 memory interfaces up to 2400 Mbps per pin. This capability is implemented through its hardened memory controller IP, which handles address/command timing, read/write leveling, and calibration sequences. The XCKU115-2FLVD1924I achieves this rate across multiple memory banks with configurable burst lengths and refresh modes, and it requires proper PCB layout adherence to JEDEC DDR4 specifications for signal integrity.

Does the XCKU115-2FLVD1924I include integrated transceivers, and what is their maximum line rate?

Yes, the XCKU115-2FLVD1924I integrates 24 GTY transceivers. Each supports a maximum line rate of 16.3 Gb/s, enabling protocols such as 25G Ethernet, CPRI, and PCIe Gen4. These transceivers include built-in PRBS generators and checkers, clock/data recovery circuits, and programmable equalization. The XCKU115-2FLVD1924I uses them for high-speed serial interconnects without requiring external retimers or SerDes ICs.

What configuration modes does the XCKU115-2FLVD1924I support?

The XCKU115-2FLVD1924I supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Master SPI is commonly used for fast single-image boot from flash; Slave SelectMAP enables high-speed parallel loading from microcontrollers or processors. JTAG is used for debugging and boundary-scan testing. The XCKU115-2FLVD1924I's configuration logic validates bitstream CRC and supports fallback mechanisms for field reliability.

Is the XCKU115-2FLVD1924I qualified for industrial temperature operation?

Yes, the XCKU115-2FLVD1924I is rated for industrial temperature operation from -40°C to +100°C. This qualification applies to the full device functionality including logic, transceivers, memory controllers, and configuration circuitry. The XCKU115-2FLVD1924I undergoes extended burn-in and characterization across this range, and its -2 speed grade guarantees timing closure under worst-case thermal and voltage conditions within this envelope.

How many DSP slices does the XCKU115-2FLVD1924I contain, and what arithmetic functions do they support?

The XCKU115-2FLVD1924I contains 6,840 DSP48E2 slices. Each supports 27×18 signed multiplication, pre-addition, pattern detect, and cascade chaining for wide accumulator chains. They natively execute multiply-accumulate (MAC), sum-of-products, and complex number arithmetic. The XCKU115-2FLVD1924I leverages these for high-throughput signal processing tasks including FIR filtering, FFT butterflies, and matrix-vector multiplication.