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AMD XCKU115-2FLVF1924E
- Part No.:
- XCKU115-2FLVF1924E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XCKU115-2FLVF1924E.pdf
- Description:
- IC FPGA 728 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,927
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Product details
Overview
XCKU115-2FLVF1924E from AMD is a high-performance Kintex UltraScale FPGA with 1,174,000 logic cells, 6,840 DSP slices, and 72.5 Mb of block RAM. It features 580 GTY transceivers supporting up to 32.75 Gb/s, integrated PCIe Gen3 x16 endpoint, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-bandwidth data acquisition systems requiring deterministic low-latency processing.
For engineers reviewing the XCKU115-2FLVF1924E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, DSP slice count, block RAM depth, PCIe Gen3 endpoint integration, and FLVF1924 package thermal performance.
Technical Context
The XCKU115-2FLVF1924E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MAC, DDR4 PHY), and adaptive compute resources. Its GTY transceivers support PAM4 and NRZ modulation, and the device includes dual 100G MACs with RS-FEC for optical transport applications.
Configuration is performed via quad-SPI or BPI flash, JTAG, or SelectMAP interface. The device supports partial reconfiguration and dynamic function exchange, enabling runtime hardware adaptation without full system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,174,000 - total configurable LUTs and flip-flops for complex digital logic implementation |
| DSP Slices | 6,840 - fixed-point and floating-point arithmetic units optimized for signal processing pipelines |
| Block RAM | 72.5 Mb - distributed and block memory resources supporting deep buffering and FIFOs |
| GTY Transceivers | 580 - serial I/O capable of 32.75 Gb/s per lane with built-in PRBS generation and error detection |
| PCIe Interface | Gen3 x16 endpoint - hard IP supporting root complex or endpoint mode with AXI4 streaming interface |
| DDR4 Support | Up to 2,400 MT/s - integrated PHY with calibration engine for 16-bit and 32-bit interfaces |
| Speed Grade | -2 - guaranteed timing closure at industrial temperature with 10% higher frequency margin than -1 grade |
Pinout & Package
The XCKU115-2FLVF1924E is housed in a 1924-ball Flip-Chip Fine-Pitch Ball Grid Array (FLVF) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation in air-cooled systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable bank for SDIO, UART, SPI, I2C, and GPIO with internal pull-up/down |
| HP[0:63] | High-Performance I/O | 1.8 V / 1.5 V / 1.35 V / 1.25 V banks supporting SSTL, HSTL, and differential signaling |
| HR[0:95] | High-Density I/O | 1.8 V / 2.5 V / 3.3 V banks with programmable slew rate and drive strength |
| GTY_TX/RX[0:579] | Transceiver Lane | Differential pairs supporting 10–32.75 Gb/s with embedded clock recovery and equalization |
| PCIE_CLK/MGTREFCLK | Reference Clock Input | Dedicated differential inputs for PCIe and GTY reference clocks with jitter tolerance ≤1.5 ps RMS |
| VCCINT/VCCAUX/VCCO | Power Rails | Separate 0.85 V core, 1.8 V auxiliary, and programmable I/O supply domains |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 Endpoint | Reduces RTL integration effort and guarantees compliance with PCIe 3.0 electrical and protocol requirements |
| Dual 100G Ethernet MAC + RS-FEC | Enables line-rate packet processing for OTN and CPRI without external FEC ICs |
| Partial Reconfiguration Support | Allows dynamic swapping of logic partitions during operation, reducing system downtime |
| Integrated DDR4 PHY with Calibration | Eliminates need for external memory controller IP and simplifies timing closure for 2400 MT/s interfaces |
| UltraScale+ SelectIO Technology | Supports 33 I/O standards including MIPI D-PHY, LVDS, and RSDS with programmable input delay |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and STAP algorithms; GTY transceivers interface with ADC/DAC FMC modules. Use Value: 6,840 DSP slices enable concurrent multi-channel processing at <10 µs latency with deterministic timing. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel processing in active antenna units. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD lookup tables and inverse FFT; PCIe Gen3 x16 connects to host CPU for control plane. Use Value: Hardened PCIe endpoint enables real-time DPD coefficient updates at 100 kHz rate with sub-100 ns jitter. |
| High-Speed Test Equipment | Optical Transport Line Cards |
Use Scenario: Bit-error-rate testing and protocol validation for 100G/400G client interfaces. IC Role / Device Role / Timing Role: GTY transceivers generate and analyze PRBS patterns; block RAM buffers test traffic for jitter tolerance analysis. Use Value: On-chip PRBS generators and error detectors eliminate need for external pattern generators in loopback validation. | Use Scenario: OTU4 framing, FEC decoding, and ODUk switching in metro DWDM line cards. IC Role / Device Role / Timing Role: Dual 100G MACs handle parallel OTU4 streams; RS-FEC engines correct burst errors on fiber links. Use Value: Integrated RS-FEC reduces power by 3.2 W versus discrete FEC ASIC while maintaining <10⁻¹⁵ BER. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924E | Same logic capacity and transceiver count, but FLVD1924 package (0.8 mm pitch, different ball map and thermal pad) | Designed for conduction-cooled modules; lower junction-to-board thermal resistance (0.28°C/W vs. 0.41°C/W) | Select when board-level thermal management uses cold plate contact instead of forced-air cooling. |
| XCKU085-2FLVA1156E | Reduced scale: 871K logic cells, 5,520 DSP slices, 54.8 Mb BRAM, 420 GTY lanes | Targeted at cost-optimized 100G line cards and mid-tier test equipment with lower bandwidth density | Choose when application requires <100 Gb/s aggregate I/O and budget constraints limit die size. |
Compared with XCKU115-2FLVD1924E, the XCKU115-2FLVF1924E offers superior airflow-compatible thermal performance; compared with XCKU085-2FLVA1156E, it delivers 35% more DSP throughput and 32% higher transceiver bandwidth for scalable infrastructure upgrades.
Availability
XCKU115-2FLVF1924E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and optical transport line cards requiring stable component supply across extended product lifecycles.
Supply support for XCKU115-2FLVF1924E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Kintex UltraScale family targets high-throughput, low-latency applications in communications infrastructure, test & measurement, and aerospace where deterministic timing and hardened IP integration are critical.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCKU115-2FLVF1924E?
The XCKU115-2FLVF1924E supports up to 32.75 Gb/s per GTY transceiver lane using NRZ encoding. This rate is guaranteed across the industrial temperature range and includes built-in clock data recovery, transmitter pre-emphasis, and receiver equalization. The XCKU115-2FLVF1924E achieves this performance without requiring external retimers in most backplane or optical module interconnects.
Does XCKU115-2FLVF1924E include a hard PCIe Gen3 controller?
Yes, the XCKU115-2FLVF1924E integrates a hardened PCIe Gen3 x16 endpoint controller with AXI4 streaming interface and TLP parsing logic. It supports both endpoint and root complex modes, and the XCKU115-2FLVF1924E's implementation complies fully with PCI Express Base Specification Revision 3.0. No external PCIe switch or bridge IC is required for host interface connectivity.
What I/O standards are supported by the HP I/O banks in XCKU115-2FLVF1924E?
The HP I/O banks in XCKU115-2FLVF1924E support SSTL-18, SSTL-15, HSTL-I, HSTL-II, DIFF_HSTL_I_18, and DIFF_SSTL15_T_DCI. Each HP bank operates at 1.8 V, 1.5 V, 1.35 V, or 1.25 V and includes programmable input termination and output drive strength. These capabilities allow the XCKU115-2FLVF1924E to directly interface with DDR4, LPDDR4, and high-speed SerDes PHYs.
Can XCKU115-2FLVF1924E perform partial reconfiguration?
Yes, the XCKU115-2FLVF1924E supports partial reconfiguration through its ICAP and FRAME_ECC interfaces. Users can dynamically reload specific logic partitions without resetting the entire device or disrupting active I/O operations. This capability is validated in the XCKU115-2FLVF1924E silicon and documented in UG570 and PG120. The XCKU115-2FLVF1924E enables field-upgradable functions such as waveform changes in SDR radios or protocol adaptation in test equipment.
What is the block RAM capacity of XCKU115-2FLVF1924E in megabits?
The XCKU115-2FLVF1924E provides 72.5 Mb of total block RAM, composed of 1,824 BRAM primitives each offering 36 Kb (dual-port, true dual-clock operation). This includes 1,248 dedicated 36 Kb BRAMs and 576 additional 18 Kb BRAMs usable as 36 Kb when combined. The XCKU115-2FLVF1924E's block RAM architecture supports byte-write enable and ECC protection for safety-critical applications.
XCKU115-2FLVF1924E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 728
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XCKU115-2FLVF1924E FAQ
1.How can I place an order for XCKU115-2FLVF1924E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-2FLVF1924E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-2FLVF1924E reliable?
The price and inventory of XCKU115-2FLVF1924E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-2FLVF1924E is usually 5 days.
3.What payment methods are accepted for XCKU115-2FLVF1924E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-2FLVF1924E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-2FLVF1924E?
XCKU115-2FLVF1924E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-2FLVF1924E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-2FLVF1924E?
For technical support, including XCKU115-2FLVF1924E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-2FLVF1924E requirements.
6.How does Aetrix verify that XCKU115-2FLVF1924E is sourced from the original manufacturer or authorized distributors?
All XCKU115-2FLVF1924E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-2FLVF1924E meets industry standards.
7.What is the process for return or replacement of XCKU115-2FLVF1924E?
All XCKU115-2FLVF1924E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-2FLVF1924E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-2FLVF1924E part is unused and in its original packaging.
Return procedure for XCKU115-2FLVF1924E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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