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AMD XCKU115-2FLVF1924I
- Part No.:
- XCKU115-2FLVF1924I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XCKU115-2FLVF1924I.pdf
- Description:
- IC FPGA 728 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,238
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Product details
Overview
XCKU115-2FLVF1924I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,840 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU115-2FLVF1924I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (520 HP I/Os), transceiver line rate (16.3 Gb/s), power delivery requirements, thermal management for FLVF1924 package, and configuration interface compatibility.
Technical Context
The XCKU115-2FLVF1924I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and multi-rate transceivers. Its UltraScale architecture uses 20nm process technology and supports partial reconfiguration and clock gating for dynamic power optimization.
It integrates 520 user I/Os across HP (High Performance) and HR (High Range) banks, each supporting selectable I/O standards including LVDS, SSTL, HSTL, and MIPI. Configuration is performed via quad-SPI, BPI, or JTAG interfaces with AES-256 bitstream encryption support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,174,000 - determines maximum combinational and sequential logic capacity for complex RTL implementation |
| DSP Slices | 6,840 - enables parallel arithmetic-intensive workloads such as FFT, filtering, and matrix operations |
| Block RAM | 48.5 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external memory latency |
| Transceiver Line Rate | 16.3 Gb/s - supports 10G/25G Ethernet, CPRI, and high-speed serial links with built-in PRBS generation/checking |
| I/O Count | 520 - delivers high pin density for interfacing with multiple memory, sensor, and host subsystems |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade, critical for high-throughput pipelines |
| Operating Temp | -40°C to +100°C - qualifies for industrial and extended-temperature embedded deployments |
Pinout & Package
The XCKU115-2FLVF1924I is housed in a 1924-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal and mechanical design requires controlled PCB stack-up and thermal vias under the die area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS peripherals in Zynq UltraScale+ MPSoC hybrid use cases |
| HP[0:519] | High-Performance I/O Bank | Supports 1.8V/1.5V/1.35V/1.2V signaling; enables DDR4, LPDDR4, and high-speed SerDes interfaces |
| GTH[0:63] | Multi-Gigabit Transceiver | 64 lanes operating up to 16.3 Gb/s; includes TX/RX termination, CDR, and gearbox logic |
| CONFIG_IO | Configuration Interface | Dedicated pins for Quad-SPI, BPI, or JTAG configuration; supports fallback and dual-boot modes |
| VCCINT/VCCAUX/VCCO | Power Supply Rails | Separate domains for core logic (0.85V), auxiliary (1.8V), and I/O (1.2–1.8V); require independent regulation and decoupling |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale Architecture | Enables scalable logic density and routing efficiency through column-based tile structure and dedicated interconnect resources |
| Hardened PCIe Gen3 x16 | Reduces integration effort and latency versus soft IP; supports root complex and endpoint roles with AXI4 streaming interface |
| DDR4 Memory Controller | Manages up to 8 banks per controller with ECC support, enabling reliable high-bandwidth memory access for compute-intensive tasks |
| AES-256 Bitstream Encryption | Protects intellectual property against reverse engineering and unauthorized configuration loading in field-deployed systems |
| Partial Reconfiguration | Allows dynamic logic module swapping without full device reset, enabling runtime adaptation in radar, comms, and test equipment |
Applications
| Radar Signal Processing | 5G Baseband Unit |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; transceivers interface with ADC/DACs at 1.2–3.2 GSPS. Use Value: 6,840 DSP slices and 16.3 Gb/s transceivers enable sub-microsecond latency loop closure for adaptive RF control. | Use Scenario: Layer 1 PHY processing in massive MIMO 5G gNodeB baseband units. IC Role / Device Role / Timing Role: Implements channel coding (LDPC/Polar), OFDM modulation, and precoding using hardened IP and programmable logic. Use Value: 1,174,000 logic cells and DDR4-2400 memory controller support concurrent processing of 64+ antenna streams. |
| High-Frequency Trading Engine | Medical Imaging Accelerator |
Use Scenario: Low-latency order matching and market data parsing in co-located financial trading hardware. IC Role / Device Role / Timing Role: Configured as deterministic packet processor with PCIe Gen3 host interface and ultra-low jitter clocking. Use Value: -2 speed grade and 520 HP I/Os ensure <50 ns end-to-end latency from NIC to algorithm execution. | Use Scenario: Real-time reconstruction pipeline for MRI and CT scanners requiring parallel back-projection and denoising. IC Role / Device Role / Timing Role: Offloads GPU-hosted compute kernels; interfaces with high-speed image sensors and display subsystems. Use Value: 48.5 Mb block RAM buffers full-frame volumetric datasets while DSP slices accelerate iterative reconstruction algorithms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-1FLVF1924I | Slower -1 speed grade; lower max frequency and higher timing margin requirement | Suitable for cost-sensitive designs where full -2 performance headroom is unused | Select when target clock frequencies stay below 350 MHz and thermal budget is constrained |
| XCKU15P-2FLVD1924I | Higher logic density (1,375,000 LC), additional GTY transceivers (up to 32.75 Gb/s), same package footprint | Required for next-generation 400G Ethernet and AI inference acceleration with wider datapaths | Choose when migrating beyond 16.3 Gb/s serial bandwidth or needing >1.2M logic cells |
Compared with XCKU115-1FLVF1924I, the XCKU115-2FLVF1924I delivers tighter timing closure for high-frequency control loops; compared with XCKU15P-2FLVD1924I, it offers identical packaging and thermal profile but trades transceiver speed and logic capacity for lower power and cost in mature 25G deployments.
Availability
XCKU115-2FLVF1924I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and high-frequency trading engines requiring stable component supply across long production lifecycles.
Supply support for XCKU115-2FLVF1924I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies for data centers, embedded systems, and client devices.
The Kintex UltraScale family targets high-performance, cost-optimized applications demanding balanced logic, memory, and I/O resources - especially in communications infrastructure, test & measurement, and aerospace systems.
FAQ
What is the maximum supported DDR4 memory interface speed for the XCKU115-2FLVF1924I?
The XCKU115-2FLVF1924I supports DDR4-2400 (1200 MHz) with a 64-bit wide interface per memory controller. It includes built-in calibration, write leveling, and read-leveling circuitry, and supports ECC for single-bit error correction. This capability is implemented in hardened logic and verified across industrial temperature range.
Does the XCKU115-2FLVF1924I support partial reconfiguration?
Yes, the XCKU115-2FLVF1924I fully supports partial reconfiguration through Vivado Design Suite. It allows dynamic swapping of logical modules without resetting the entire device, enabling runtime adaptation in applications like software-defined radio and real-time protocol translation. Bitstream encryption remains active during reconfiguration.
What configuration modes are supported by the XCKU115-2FLVF1924I?
The XCKU115-2FLVF1924I supports Quad-SPI, BPI, and JTAG configuration modes. Quad-SPI enables fast boot from serial flash; BPI supports parallel NOR flash for high-throughput bitstream loading; JTAG is used for debugging and programming during development. All modes support fallback and dual-boot functionality.
How many GTY transceivers does the XCKU115-2FLVF1924I include?
The XCKU115-2FLVF1924I does not include GTY transceivers. It features 64 GTH transceivers rated up to 16.3 Gb/s. GTY transceivers (up to 32.75 Gb/s) are available in higher-tier Kintex UltraScale+ devices such as the XCKU15P, not in the XCKU115 family.
Is the XCKU115-2FLVF1924I qualified for automotive applications?
No, the XCKU115-2FLVF1924I is specified for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and enhanced ESD protection required for automotive ECUs. For automotive use, AMD offers Zynq UltraScale+ MPSoC derivatives with automotive qualification.
XCKU115-2FLVF1924I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 728
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XCKU115-2FLVF1924I FAQ
1.How can I place an order for XCKU115-2FLVF1924I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-2FLVF1924I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-2FLVF1924I reliable?
The price and inventory of XCKU115-2FLVF1924I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-2FLVF1924I is usually 5 days.
3.What payment methods are accepted for XCKU115-2FLVF1924I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-2FLVF1924I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-2FLVF1924I?
XCKU115-2FLVF1924I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-2FLVF1924I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-2FLVF1924I?
For technical support, including XCKU115-2FLVF1924I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-2FLVF1924I requirements.
6.How does Aetrix verify that XCKU115-2FLVF1924I is sourced from the original manufacturer or authorized distributors?
All XCKU115-2FLVF1924I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-2FLVF1924I meets industry standards.
7.What is the process for return or replacement of XCKU115-2FLVF1924I?
All XCKU115-2FLVF1924I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-2FLVF1924I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-2FLVF1924I part is unused and in its original packaging.
Return procedure for XCKU115-2FLVF1924I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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