AMD XCKU115-3FLVA2104E

Overview

XCKU115-3FLVA2104E from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,930 DSP slices, and 48.8 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 up to 2400 Mbps, and 32.75 Gb/s transceivers, deployed in high-throughput data center acceleration and radar signal processing systems.

For engineers reviewing the XCKU115-3FLVA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O voltage support (1.2V/1.35V/1.8V), thermal design power (33W typical), and package-compatible migration paths within the Kintex UltraScale family.

Technical Context

The XCKU115-3FLVA2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, Ethernet MACs, and memory controllers, and multi-rate transceivers supporting protocols including CPRI, JESD204B/C, and SATA. Its UltraScale+ architecture enables time-multiplexed I/O and dynamic reconfiguration via ICAP.

It integrates 1,728 UltraScale+ GTY transceivers operating at up to 32.75 Gb/s, supports AXI4-Stream and AXI4-Lite interfaces for subsystem interconnect, and delivers deterministic timing closure across speed grade -3 with static timing analysis verified at 100°C junction temperature.

Key Specifications

Pinout & Package

The XCKU115-3FLVA2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in air-cooled rack-mounted systems.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU115-2FLVA2104I and XCKU15P-2FLVD2104I, the XCKU115-3FLVA2104E uniquely balances maximum speed grade (-3), transceiver bandwidth (32.75 Gb/s), and logic capacity for latency-sensitive, high-throughput signal processing where deterministic timing closure is non-negotiable.

Availability

XCKU115-3FLVA2104E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and data center acceleration requiring stable component supply across extended production lifecycles.

Supply support for XCKU115-3FLVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for data centers, communications, and embedded markets.

The Kintex UltraScale family targets high-throughput, low-latency applications demanding hardened IP, advanced transceivers, and scalable logic resources - optimized for signal processing, networking, and compute acceleration.

FAQ

What is the maximum supported DDR4 data rate for the XCKU115-3FLVA2104E?

The XCKU115-3FLVA2104E supports DDR4 memory interfaces up to 2400 Mbps per pin. This capability is implemented through its hardened DDR4 memory controller IP, which handles command/address timing, write leveling, and read/write calibration automatically. The XCKU115-3FLVA2104E achieves this rate with dual-rank, 72-bit-wide configurations and optional ECC support, validated across industrial temperature ranges.

Does the XCKU115-3FLVA2104E include hard IP for PCIe Gen3?

Yes, the XCKU115-3FLVA2104E integrates hardened PCIe Gen3 x16 endpoint and root port logic. This includes physical layer (PHY), data link layer (DLL), and transaction layer (TL) blocks compliant with PCI Express Base Specification Revision 3.0. The XCKU115-3FLVA2104E requires no external PHY and supports hot-plug, ASPM, and MSI-X natively without consuming programmable logic resources.

What package type and ball pitch does the XCKU115-3FLVA2104E use?

The XCKU115-3FLVA2104E uses a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch. This package supports high I/O count and thermal dissipation requirements for air-cooled systems. The XCKU115-3FLVA2104E's FCBGA footprint is compatible with standard PCB fabrication processes and matches mechanical mounting constraints defined in AMD's UltraScale packaging documentation.

How many GTY transceivers does the XCKU115-3FLVA2104E provide?

The XCKU115-3FLVA2104E provides 1,728 UltraScale+ GTY transceivers. Each GTY transceiver supports data rates from 500 Mb/s up to 32.75 Gb/s and includes built-in PRBS generators and checkers for link validation. The XCKU115-3FLVA2104E allocates these transceivers across 24 GTY quad blocks, enabling flexible lane grouping for protocols including JESD204B/C, CPRI, and 100G Ethernet.

What is the typical thermal design power (TDP) of the XCKU115-3FLVA2104E?

The XCKU115-3FLVA2104E has a typical thermal design power (TDP) of 33 W under representative high-activity workloads at 100°C junction temperature. This value assumes operation at speed grade -3 with all transceivers active at 32.75 Gb/s and logic fabric utilized at 70% utilization. The XCKU115-3FLVA2104E's TDP informs heatsink sizing and airflow requirements for conduction- and convection-cooled enclosures.