AMD XCKU115-3FLVB2104E

Overview

XCKU115-3FLVB2104E from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,935 DSP slices, and 84.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 up to 2400 Mbps, and includes hardened 10/25/100G Ethernet MACs. It is deployed in high-bandwidth data center acceleration and 5G radio unit processing.

For engineers reviewing the XCKU115-3FLVB2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (56 GTY), I/O voltage support (1.2V/1.35V/1.8V), thermal design power (55W typical), and package pin compatibility with FLVB2104 footprint.

Technical Context

The XCKU115-3FLVB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe, Ethernet, memory controllers), and multi-rate transceivers. It integrates 56 GTY transceivers operating up to 32.75 Gbps and supports AMBA AXI4 interconnect for subsystem integration.

It delivers deterministic timing closure for designs targeting ≤3.0 ns clock-to-out and ≤1.2 ns setup time on critical paths. The device uses 20nm bulk CMOS process and supports partial reconfiguration via ICAP and PCIe-based configuration interfaces.

Key Specifications

Pinout & Package

FLVB2104 package is a 35 mm × 35 mm, 2104-ball flip-chip BGA with 0.8 mm ball pitch and standard thermal pad layout per AMD UG575 v1.15.1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU115-2FLVB2104I and XCKU085-3FLVA1156E, the XCKU115-3FLVB2104E provides highest transceiver density and logic capacity in the Kintex UltraScale family, making it optimal for full-featured 5G RU and SmartNIC designs requiring maximum I/O bandwidth and deterministic timing closure.

Availability

XCKU115-3FLVB2104E is available at Aetrix Electronics and suitable for 5G infrastructure, data center acceleration, and high-frequency trading systems requiring stable component supply across multi-year production cycles.

Supply support for XCKU115-3FLVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for data center, communications, and embedded markets.

The Kintex UltraScale family targets high-throughput, low-latency applications including wireless infrastructure, network acceleration, and test equipment-designed to balance performance, power, and cost for mid-tier FPGA use cases.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCKU115-3FLVB2104E?

The XCKU115-3FLVB2104E supports GTY transceivers operating up to 32.75 Gbps per lane. This rate is validated for protocols including 100G Ethernet (4×25G), CPRI Option 10, and JESD204C. Operation at this speed requires proper PCB stackup, controlled impedance routing, and compliance with AMD UG578 AC specifications for transmitter eye opening and jitter tolerance.

Does the XCKU115-3FLVB2104E support partial reconfiguration?

Yes, the XCKU115-3FLVB2104E fully supports partial reconfiguration via ICAP and PCIe-based configuration interfaces. This capability allows runtime swapping of logic modules without resetting the entire device. Implementation requires Vivado 2022.2 or later, proper Pblock constraints, and adherence to AMD UG903 guidelines for frame-level bitstream generation and validation.

What I/O standards are supported by the XCKU115-3FLVB2104E for DDR4 memory interfacing?

The XCKU115-3FLVB2104E supports DDR4 SDRAM interfacing using SSTL12 I/O standard in dedicated memory interface banks. It complies with JEDEC DDR4-2400 specifications and integrates hardened memory controller IP supporting up to 8 banks, 16-bit or 32-bit data widths, and on-die termination calibration. VCCO must be set to 1.2V for these banks.

Is the XCKU115-3FLVB2104E pin-compatible with other Kintex UltraScale devices in the FLVB2104 package?

No, the XCKU115-3FLVB2104E is not pin-compatible with other Kintex UltraScale devices in the FLVB2104 package. While the physical footprint matches, ball function mapping differs significantly between speed grades and logic densities. For example, VCCINT and VCCAUX ball assignments vary between -2 and -3 speed grades, and GTY transceiver locations differ across device variants.

What thermal management guidance applies to the XCKU115-3FLVB2104E in continuous operation?

The XCKU115-3FLVB2104E has a typical TDP of 55 W and requires a heatsink with thermal resistance ≤0.5°C/W under full load. AMD UG575 specifies junction temperature limits of 100°C maximum and recommends maintaining case temperature below 85°C. Thermal vias beneath the thermal pad and 2 oz copper planes are mandatory for reliable long-term operation.