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AMD XCKU115-L1FLVA1517I
- Part No.:
- XCKU115-L1FLVA1517I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU115-L1FLVA1517I.pdf
- Description:
- IC FPGA 624 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,619
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Product details
Overview
XCKU115-L1FLVA1517I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,935 DSP slices, and 72.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates across industrial temperature range (–40°C to +100°C) for use in radar signal processing systems.
For engineers reviewing the XCKU115-L1FLVA1517I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V/1.35 V/1.8 V), transceiver line rates up to 16.3 Gb/s, and configuration via dual BPI or SPIx4.
Technical Context
The XCKU115-L1FLVA1517I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC), and multi-rate transceivers. It integrates 24 GTY transceivers supporting protocols including CPRI, JESD204B/C, and 10GBASE-R.
Configuration is performed through dedicated configuration pins (INIT_B, PROGRAM_B, CCLK, etc.) and supports fallback mechanisms. Power delivery requires separate VCCINT (0.85 V), VCCAUX (1.8 V), and VCCO rails per I/O bank, with thermal management enabled by on-die temperature sensors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,174,000 - determines maximum combinational and sequential logic capacity for complex digital signal processing pipelines |
| DSP Slices | 6,935 - enables parallel execution of multiply-accumulate operations for real-time radar FFT and beamforming |
| Block RAM | 72.5 Mb - provides on-chip memory for buffering high-throughput sensor data streams without external DRAM latency |
| Transceiver Max Rate | 16.3 Gb/s - supports JESD204C interface for direct ADC/DAC connectivity in wideband RF systems |
| I/O Standards | LVDS, SSTL, HSTL, MIPI - allows interfacing with diverse peripherals including image sensors, memory, and high-speed serdes |
| Operating Temp | –40°C to +100°C - qualified for deployment in uncooled outdoor radar enclosures and industrial control cabinets |
| Package | FLVA1517 - 1517-ball flip-chip BGA with 0.8 mm pitch, optimized for thermal dissipation and signal integrity in dense PCB layouts |
Pinout & Package
FLVA1517 is a 1517-ball flip-chip BGA package with 0.8 mm ball pitch, thermal lid, and power/ground ball optimization for low-inductance supply delivery. Pin functions are defined per bank and include dedicated configuration, clock, and transceiver lanes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MRCC_L12P | Multi-Region Clock Capable Input | Accepts differential 100 MHz reference clock for transceiver PLLs and fabric timing domains |
| IO_L12P_T1_MRCC_34 | Bank 34 I/O with MRCC | Configurable as LVDS input for high-speed serial data acquisition from ADCs |
| GTYRXN0_Y13 | GTY Transceiver Receive N | Part of differential pair supporting 16.3 Gb/s JESD204C receiver channel |
| PROGRAM_B | Active-Low Configuration Initiate | Triggers reconfiguration from flash or host processor; synchronous with INIT_B assertion |
| VCCINT | Core Logic Supply | 0.85 V ±3% regulated rail powering CLBs, interconnect, and routing resources |
| INIT_B | Configuration Status Output | Open-drain signal indicating successful bitstream loading or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 Endpoint | Reduces RTL integration effort and ensures protocol compliance for host-facing data offload subsystems |
| 24 GTY Transceivers | Enables 24 independent high-speed serial links for multi-channel RF front-end synchronization |
| UltraScale+ Architecture | Delivers 1.5× higher logic density and 2× DSP throughput versus previous generation Kintex-7 devices |
| Partial Reconfiguration Support | Allows dynamic swapping of functional modules (e.g., filter banks) without system reset or downtime |
| On-Die Temperature Sensor | Provides real-time die temperature monitoring for adaptive thermal throttling in sealed radar housings |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and CFAR detection in ground-based surveillance radar. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, beamforming, and tracking algorithms at 100+ GOPS sustained throughput. Use Value: On-chip DSP slices and block RAM eliminate external memory bottlenecks, enabling sub-millisecond latency response to fast-moving targets. | Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 5G NR base station radio units. IC Role / Device Role / Timing Role: Real-time adaptive signal conditioning core synchronized to 30.72 MHz or 122.88 MHz reference clocks. Use Value: GTY transceivers directly interface with 12-bit 2.56 GSPS RF DACs using JESD204C, reducing board-level routing complexity. |
| High-Performance Test Equipment | Avionics Data Concentrators |
Use Scenario: Multi-channel arbitrary waveform generation and real-time spectrum analysis in PXIe modular instruments. IC Role / Device Role / Timing Role: Central deterministic timing controller coordinating DAC/ADC sampling, trigger distribution, and PCIe data streaming. Use Value: Hardened PCIe Gen3 x16 interface sustains 16 GB/s sustained host transfer bandwidth for raw IQ data capture. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Deterministic packet switching and time-triggered scheduling engine with <1 μs jitter. Use Value: Dual-clock domain support isolates safety-critical AFDX traffic from non-critical maintenance bus traffic on shared hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-FLVA1517I | Lack of speed grade 'L1' - rated for commercial temp (0°C to +85°C); same logic capacity and I/O count | Suitable only for controlled-environment lab equipment or indoor telecom infrastructure | Select when industrial temperature operation is not required and cost sensitivity outweighs thermal margin needs |
| XCVU13P-FLGA2577E | Higher logic density (1,524K LC), 32 GTY transceivers, but lower max transceiver rate (12.5 Gb/s) | Better suited for AI inference acceleration; less optimal for JESD204C-based RF systems requiring >15 Gb/s | Choose for compute-bound workloads over serial I/O bandwidth; verify thermal envelope compatibility with FLGA2577 package |
Compared with XCKU115-FLVA1517I, the XCKU115-L1FLVA1517I delivers guaranteed industrial temperature operation and tighter timing margins, while the XCVU13P-FLGA2577E offers greater logic scale at the expense of transceiver speed - critical for JESD204C and CPRI deployments.
Availability
XCKU115-L1FLVA1517I is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XCKU115-L1FLVA1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and aerospace applications.
The Kintex UltraScale family targets high-throughput, low-latency signal processing in radar, wireless infrastructure, and test instrumentation where performance-per-watt and deterministic timing are critical.
FAQ
What is the maximum supported transceiver line rate for XCKU115-L1FLVA1517I?
The XCKU115-L1FLVA1517I supports a maximum transceiver line rate of 16.3 Gb/s using its GTY transceivers. This enables compliance with JESD204C and CPRI v7.0 standards. The rate is achievable across all 24 GTY channels under industrial temperature conditions when powered with specified VCCINT and VCCAUX rails.
Does XCKU115-L1FLVA1517I support partial reconfiguration?
Yes, XCKU115-L1FLVA1517I supports partial reconfiguration through Vivado Design Suite tools. This capability allows runtime swapping of logical partitions - such as adaptive filter banks or modulation schemes - without resetting the entire device or disrupting active I/O channels.
What configuration modes are supported by XCKU115-L1FLVA1517I?
XCKU115-L1FLVA1517I supports master SPIx4, slave SPI, and master BPI configuration modes. It also supports fallback configuration from dual-flash devices. Configuration is initiated via PROGRAM_B and monitored using INIT_B and DONE signals, all compatible with industrial-grade flash memory components.
Is XCKU115-L1FLVA1517I pin-compatible with other Kintex UltraScale devices?
No, XCKU115-L1FLVA1517I is not pin-compatible with other Kintex UltraScale FPGAs due to unique FLVA1517 package ball map and bank-specific I/O voltage assignments. Migration requires PCB redesign even within the same family, especially for transceiver and clock-capable pin placement.
What is the operating voltage for the core logic supply of XCKU115-L1FLVA1517I?
The core logic supply (VCCINT) for XCKU115-L1FLVA1517I is 0.85 V ±3%. This rail powers the programmable logic fabric, interconnect, and CLB resources. Stable regulation within this tolerance is required for reliable operation across the full –40°C to +100°C industrial temperature range.
XCKU115-L1FLVA1517I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.880V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU115-L1FLVA1517I FAQ
1.How can I place an order for XCKU115-L1FLVA1517I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-L1FLVA1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-L1FLVA1517I reliable?
The price and inventory of XCKU115-L1FLVA1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-L1FLVA1517I is usually 5 days.
3.What payment methods are accepted for XCKU115-L1FLVA1517I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-L1FLVA1517I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-L1FLVA1517I?
XCKU115-L1FLVA1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-L1FLVA1517I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-L1FLVA1517I?
For technical support, including XCKU115-L1FLVA1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-L1FLVA1517I requirements.
6.How does Aetrix verify that XCKU115-L1FLVA1517I is sourced from the original manufacturer or authorized distributors?
All XCKU115-L1FLVA1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-L1FLVA1517I meets industry standards.
7.What is the process for return or replacement of XCKU115-L1FLVA1517I?
All XCKU115-L1FLVA1517I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-L1FLVA1517I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-L1FLVA1517I part is unused and in its original packaging.
Return procedure for XCKU115-L1FLVA1517I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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