AMD XCKU115-L1FLVF1924I

Overview

XCKU115-L1FLVF1924I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,930 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates across industrial temperature range (–40°C to +100°C) for use in high-bandwidth data processing systems.

For engineers reviewing the XCKU115-L1FLVF1924I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (856 user I/Os), transceiver line rate (16.3 Gb/s), power delivery requirements, thermal management for FLVF1924 package, and configuration interface compatibility.

Technical Context

The XCKU115-L1FLVF1924I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x16 root port/endpoint, 100G Ethernet MAC, and UltraScale+ transceivers. It integrates dual ARM Cortex-A53 processors in the Zynq UltraScale+ MPSoC variant-but this part is a standalone FPGA, excluding processor subsystem.

Configuration occurs via quad-SPI, BPI, or JTAG; bitstream security includes AES-256 decryption and HMAC authentication. The device uses SelectIO technology supporting LVDS, SSTL, HSTL, and MIPI standards across its 856 user I/O pins.

Key Specifications

Pinout & Package

Package: Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) with 1924 balls, 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for industrial-grade thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XCKU115-L1FLVF1924I, the XCKU115-FLVD1924-2L trades industrial temperature tolerance for lower cost, while the XCKU085-L1FLVA1156I reduces logic, DSP, and transceiver capacity to fit compact, lower-throughput applications-neither is pin-compatible, requiring PCB redesign.

Availability

XCKU115-L1FLVF1924I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and industrial machine vision controllers requiring stable component supply across long production lifecycles.

Supply support for XCKU115-L1FLVF1924I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and client devices.

The Kintex UltraScale family delivers optimized performance-per-watt for compute-intensive, high-I/O bandwidth applications including wireless infrastructure, test & measurement, and aerospace avionics.

FAQ

What is the maximum supported DDR4 memory speed for XCKU115-L1FLVF1924I?

The XCKU115-L1FLVF1924I supports DDR4 memory interfaces up to 2400 MT/s with a 128-bit data bus width. This capability is implemented using dedicated memory controller hard IP and calibrated I/O banks. The XCKU115-L1FLVF1924I datasheet specifies timing closure requirements for 2400 MT/s operation under industrial temperature conditions, and board layout must adhere to strict length-matching and termination guidelines to achieve reliable operation.

Does XCKU115-L1FLVF1924I include a built-in ARM processor core?

No, the XCKU115-L1FLVF1924I is a standalone FPGA and does not integrate ARM processor cores. It belongs to the Kintex UltraScale series, which excludes the processing system (PS) found in Zynq UltraScale+ MPSoC devices. All processing must be implemented in programmable logic or offloaded to an external host processor via PCIe or other interfaces. The XCKU115-L1FLVF1924I provides no on-chip cache, interrupt controller, or AXI interconnect for CPU-like operation.

What configuration modes are supported by XCKU115-L1FLVF1924I?

The XCKU115-L1FLVF1924I supports master SPI, slave SPI, master BPI, slave parallel, and JTAG configuration modes. Quad-SPI is commonly used for fast, secure boot from serial flash; BPI mode supports high-speed parallel PROM loading. Configuration can be initiated automatically on power-up or triggered externally. The XCKU115-L1FLVF1924I also supports fallback and multi-boot configurations using internal configuration memory partitions.

Is XCKU115-L1FLVF1924I pin-compatible with other Kintex UltraScale devices?

No, the XCKU115-L1FLVF1924I is not pin-compatible with other Kintex UltraScale FPGAs due to its unique 1924-ball FLVF package and specific power delivery and I/O bank arrangement. Even within the same density tier, differences in VCCINT/VCCAUX/VCCO pin distribution, transceiver placement, and configuration pin locations prevent mechanical or electrical interchangeability. Migration between variants requires PCB redesign and signal integrity revalidation.

What thermal management guidance applies to XCKU115-L1FLVF1924I in industrial environments?

The XCKU115-L1FLVF1924I features a thermally enhanced FLVF package with integrated lid and solder thermal interface material (STIM) for efficient heat transfer to heatsinks. For continuous operation at +100°C ambient, AMD recommends ≥30 W thermal solution with ≤1.5°C/W junction-to-ambient resistance. Board layout must include adequate copper pour, thermal vias under the package, and airflow clearance. The XCKU115-L1FLVF1924I thermal reference design files specify exact heatsink mounting pressure and interface pad specifications.