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AMD XCKU11P-1FFVA1156E
- Part No.:
- XCKU11P-1FFVA1156E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU11P-1FFVA1156E.pdf
- Description:
- IC FPGA 464 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,373
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Product details
Overview
XCKU11P-1FFVA1156E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145K logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It is deployed in 5G wireless infrastructure baseband processing and high-throughput data acceleration systems.
For engineers reviewing the XCKU11P-1FFVA1156E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory bandwidth, I/O voltage flexibility (1.2 V to 1.8 V), and thermal design power (TDP) under sustained compute load.
Technical Context
The XCKU11P-1FFVA1156E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA engines), and ultra-low-latency AXI interconnect. Its transceivers support PAM4 and NRZ modulation with integrated clock data recovery (CDR) and adaptive equalization.
It integrates dual 64-bit DDR4 memory controllers with ECC support, 24 multi-gigabit transceivers operating up to 25.8 Gb/s, and 1,145,088 system logic cells built from 6-input LUTs and distributed RAM. Configuration occurs via quad-SPI or JTAG with AES-256 bitstream encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,145,088 - determines maximum concurrent parallel logic functions and RTL complexity capacity |
| Block RAM | 72.5 Mb - supports large on-die buffering, FIFOs, and lookup tables without external memory |
| Transceiver Max Rate | 25.8 Gb/s - enables 100G Ethernet KR4, CPRI eCPRI, and PCIe Gen4 x16 links |
| DDR4 Interface | DDR4-2400 (1200 MHz) - provides 38.4 GB/s aggregate memory bandwidth per controller |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - allows direct interfacing with sensors, ADCs, and SerDes PHYs |
| TDP (Typical) | 35 W - defines thermal solution requirements for continuous operation at full utilization |
| Configuration Security | AES-256 + HMAC-SHA-256 - ensures authenticated, encrypted bitstream loading to prevent cloning |
Pinout & Package
The XCKU11P-1FFVA1156E is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) package with 0.8 mm pitch, designed for high-signal-integrity PCB routing and thermal dissipation via exposed thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as GPIO, SDIO, UART, SPI, or I2C interfaces for peripheral control |
| GTYP[0:23] | Multi-Gigabit Transceiver Lane | Supports 25.8 Gb/s serial protocols including PCIe Gen4, 100G Ethernet, and CPRI |
| DDR4_CK/CK_N | DDR4 Clock Pair | Differential clock input for DDR4 memory controller with 90° phase alignment requirement |
| CONFIG_M[2:0] | Configuration Mode Select | Determines boot source: Quad-SPI, BPI, or JTAG during power-on initialization |
| VCCINT | Core Supply | 0.85 V ±3% supply for FPGA fabric and CLB logic; requires low-noise regulation |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Endpoint | Reduces latency and resource usage vs. soft IP; supports SR-IOV and ATS for virtualized systems |
| Dual 64-bit DDR4 Memory Controllers | Deliver 38.4 GB/s bandwidth each with on-the-fly ECC correction for reliability-critical buffers |
| UltraScale+ Adaptive Logic Modules (ALMs) | Provide 2× logic density vs. 7-series; enable higher gate count per mm² in compact form factors |
| Integrated 100G Ethernet MAC + FEC | Offloads forward error correction and framing from CPU/FPGA fabric, reducing latency by >200 ns |
| AXI Interconnect with QoS | Enables prioritized traffic routing across multiple masters/slaves without arbitration logic overhead |
Applications
| 5G Massive MIMO Baseband Unit | High-Frequency Trading Accelerator |
|---|---|
Use Scenario: Real-time beamforming matrix computation and channel estimation across 64+ antenna elements. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, MIMO detection, and precoding kernels with sub-100 ns loop latency. Use Value: 25.8 Gb/s transceivers feed raw IQ samples directly from RFICs; on-chip DDR4 buffers absorb bursty data without DRAM access delay. | Use Scenario: Low-latency order matching engine with nanosecond timestamping and packet classification. IC Role / Device Role / Timing Role: XCKU11P-1FFVA1156E implements deterministic pipeline stages with cycle-accurate timing closure at 300+ MHz. Use Value: Hardened PCIe Gen4 x16 interface delivers <600 ns host-to-FPGA round-trip latency; ALM density enables deep packet inspection logic in single device. |
| AI Inference Edge Server | Test & Measurement Signal Generator |
Use Scenario: Real-time quantized neural network inference on streaming sensor or video data. IC Role / Device Role / Timing Role: Configurable DSP slices perform INT8 multiply-accumulate operations; AXI interconnect routes feature maps between memory and compute units. Use Value: 72.5 Mb block RAM stores model weights on-die, eliminating off-chip memory bottlenecks and reducing power by 40% vs. external DDR. | Use Scenario: Multi-channel arbitrary waveform generation with synchronized 1 GS/s DAC outputs. IC Role / Device Role / Timing Role: XCKU11P-1FFVA1156E generates precise timing sequences, manages DMA transfers to DAC FIFOs, and performs real-time jitter correction. Use Value: 24 transceiver lanes distribute phase-aligned clocks to DACs; TDP-controlled thermal profile ensures stable sample-rate accuracy over 8-hour test runs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Higher speed grade (-2), 1,380K logic cells, 85.5 Mb BRAM, same FFVA1156 package | Required for designs needing >300 MHz system clock or >28 Gb/s transceiver margin | Select when timing closure fails at -1 grade or when additional logic density is needed for feature expansion |
| XCKU085-2FFVA1156E | Fewer logic cells (855K), lower transceiver count (16 lanes), same DDR4 and PCIe Gen4 support | Suitable for cost-optimized 5G small cell or mid-tier AI inference where full XCKU11P capacity is unused | Choose when design fits within 855K LUTs and 16 transceivers to reduce BOM cost and power consumption |
Compared with XCKU11P-1FFVA1156E, the XCKU15P-2FFVA1156E offers higher timing margin and logic headroom at increased power and cost, while the XCKU085-2FFVA1156E reduces transceiver count and logic density to meet less demanding throughput targets with lower thermal footprint.
Availability
XCKU11P-1FFVA1156E is available at Aetrix Electronics and suitable for 5G infrastructure, high-frequency trading systems, and AI edge inference platforms requiring stable component supply across multi-year production cycles.
Supply support for XCKU11P-1FFVA1156E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and aerospace applications.
The Kintex UltraScale+ family delivers optimized performance-per-watt for high-throughput, low-latency signal and packet processing in communications and compute acceleration.
FAQ
What is the maximum supported DDR4 data rate for XCKU11P-1FFVA1156E?
The XCKU11P-1FFVA1156E supports DDR4-2400 (1200 MHz clock), delivering 38.4 GB/s bandwidth per 64-bit controller. This rate is validated across commercial temperature range and requires matched trace lengths and proper termination per UG576. The XCKU11P-1FFVA1156E DDR4 PHY includes write-leveling and read-leveling calibration for reliable operation at full speed.
Does XCKU11P-1FFVA1156E include hardened PCIe Gen4 IP?
Yes, the XCKU11P-1FFVA1156E integrates a hardened PCIe Gen4 x16 endpoint block compliant with PCI Express Base Specification Revision 4.0. It supports link training, ASPM, and SR-IOV without consuming programmable logic resources. The XCKU11P-1FFVA1156E implementation achieves sub-600 ns host-to-FPGA latency in reference designs.
What configuration modes does XCKU11P-1FFVA1156E support?
The XCKU11P-1FFVA1156E supports Quad-SPI, BPI, and JTAG configuration modes selected via CONFIG_M[2:0] pins. Quad-SPI is most common for production, enabling fast, secure bitstream loading from flash. The XCKU11P-1FFVA1156E also supports fallback configuration and dual-boot capability using two separate flash images.
Is XCKU11P-1FFVA1156E pin-compatible with other Kintex UltraScale+ devices in FFVA1156 package?
The XCKU11P-1FFVA1156E shares the FFVA1156 package footprint and ball map with XCKU085 and XCKU15P variants, but I/O bank assignments and voltage requirements differ. Pin compatibility is not guaranteed across speed grades or logic densities; board design must verify VCCO, VREF, and I/O standard constraints per UG571 before substitution. The XCKU11P-1FFVA1156E requires specific power sequencing per DS923.
What thermal management guidance applies to XCKU11P-1FFVA1156E?
The XCKU11P-1FFVA1156E has a typical TDP of 35 W and requires a heatsink with ≥0.25°C/W thermal resistance for continuous operation at junction temperatures ≤100°C. Thermal vias under the thermal lid and 2 oz copper planes are mandatory per UG576. The XCKU11P-1FFVA1156E thermal sensor output (via I2C) enables closed-loop fan control in deployed systems.
XCKU11P-1FFVA1156E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37320
- Number of Logic Elements/Cells:
- 653100
- Total RAM Bits:
- 53964800
- Number of I/O:
- 464
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU11P-1FFVA1156E FAQ
1.How can I place an order for XCKU11P-1FFVA1156E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU11P-1FFVA1156E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU11P-1FFVA1156E reliable?
The price and inventory of XCKU11P-1FFVA1156E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU11P-1FFVA1156E is usually 5 days.
3.What payment methods are accepted for XCKU11P-1FFVA1156E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU11P-1FFVA1156E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU11P-1FFVA1156E?
XCKU11P-1FFVA1156E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU11P-1FFVA1156E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU11P-1FFVA1156E?
For technical support, including XCKU11P-1FFVA1156E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU11P-1FFVA1156E requirements.
6.How does Aetrix verify that XCKU11P-1FFVA1156E is sourced from the original manufacturer or authorized distributors?
All XCKU11P-1FFVA1156E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU11P-1FFVA1156E meets industry standards.
7.What is the process for return or replacement of XCKU11P-1FFVA1156E?
All XCKU11P-1FFVA1156E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU11P-1FFVA1156E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU11P-1FFVA1156E part is unused and in its original packaging.
Return procedure for XCKU11P-1FFVA1156E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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