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AMD XCKU11P-1FFVA1156I
- Part No.:
- XCKU11P-1FFVA1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU11P-1FFVA1156I.pdf
- Description:
- IC FPGA 464 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,757
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Product details
Overview
XCKU11P-1FFVA1156I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,143K logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets high-bandwidth data processing in radar signal conditioning, 5G baseband units, and AI inference acceleration at the edge.
For engineers reviewing the XCKU11P-1FFVA1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, static timing closure capability, and thermal performance under sustained 28W TDP operation.
Technical Context
The XCKU11P-1FFVA1156I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and dual-core ARM Cortex-A53 processor subsystem. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.
Its I/O structure includes 532 user-configurable single-ended or differential pins across 19 banks, with support for LVCMOS, SSTL, HSTL, and MIPI D-PHY signaling. The device operates over industrial temperature range (–40°C to +100°C) with junction temperature monitoring via on-die sensor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,143,000 - Enables complex RTL designs such as multi-channel FFT engines or real-time video codecs without external co-processors. |
| Block RAM | 72.5 Mb - Supports large on-chip buffering for bursty data streams in packet processing or sensor fusion pipelines. |
| Transceiver Max Rate | 25.8 Gb/s - Meets IEEE 802.3bs for 100G KR4/CR4 backplane links and CPRI/eCPRI fronthaul interfaces. |
| PCIe Interface | Gen4 x16 - Delivers 32 GB/s bidirectional bandwidth for host-FPGA DMA transfers in compute-accelerated servers. |
| DDR4 Support | DDR4-2400 (1200 MHz) - Enables direct connection to commodity memory modules without external PHY, reducing BOM count. |
| TDP | 28 W - Requires active cooling in dense 1U systems but avoids derating in ambient temperatures up to +85°C. |
Pinout & Package
The XCKU11P-1FFVA1156I is housed in a 1156-pin FCBGA package (FFVA) with 35×35 mm body size, 0.8 mm ball pitch, and integrated thermal lid for enhanced heat dissipation in high-power configurations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-use I/O for PS peripherals | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects directly to ARM processor subsystem. |
| HP[0:5]_IO | High-performance I/O bank | Supports 1.8 V/1.5 V/1.35 V/1.25 V signaling; used for DDR4 interface and high-speed SerDes reference clocks. |
| GTH_X0Y0_CH0 | Transceiver channel | 25.8 Gb/s serial link; requires dedicated AC-coupling capacitors and controlled-impedance PCB routing. |
| VCCINT | Core power supply | 0.85 V ±3% regulated input; must be filtered with ≥10 µF ceramic capacitance per power rail. |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, transceiver analog bias, and I/O bank reference circuits. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Processing | Integrated dual-core ARM Cortex-A53 + FPGA fabric enables hybrid software-hardware partitioning for control-plane/data-plane separation. |
| Partial Reconfiguration | Allows dynamic logic module swapping during runtime-critical for adaptive radio protocols or multi-standard wireless base stations. |
| Hardened 100G Ethernet MAC | Reduces RTL synthesis time and timing closure risk for optical transport and data center interconnect applications. |
| AXI4-Stream Interface | Enables zero-copy streaming between IP blocks without CPU intervention, lowering latency in real-time signal processing chains. |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in airborne SAR systems operating at X-band frequencies. IC Role / Device Role / Timing Role: FPGA fabric executes fixed-point FFTs and CFAR detection; transceivers interface with ADC/DAC arrays at 2.4 GSPS. Use Value: On-chip block RAM buffers full chirp sequences; 25.8 Gb/s transceivers feed raw RF samples to GPU-based post-processing clusters. | Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 3.5 GHz FR1 macrocell base stations supporting 64T64R antenna arrays. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD lookup tables; PCIe Gen4 x16 exports processed IQ data to centralized L1/L2 controllers. Use Value: 1,143K logic cells accommodate concurrent DPD, CFR, and MIMO precoding engines; DDR4-2400 provides low-latency coefficient storage. |
| AI Edge Inference Accelerator | High-Speed Test Equipment |
Use Scenario: Low-latency object detection on 4K video streams from autonomous vehicle cameras using quantized YOLOv5 models. IC Role / Device Role / Timing Role: FPGA fabric serves as hardware inference engine; ARM A53 cores handle OS, sensor fusion, and CAN FD communication. Use Value: Partial reconfiguration allows model switching between daytime/nighttime inference kernels without system reset or firmware reload. | Use Scenario: Bit-error-rate testing (BERT) of 100G Ethernet optical modules using PRBS31 pattern generation and error analysis. IC Role / Device Role / Timing Role: Transceivers generate and receive deterministic high-speed serial patterns; block RAM stores test result histograms. Use Value: 72.5 Mb block RAM holds >10 million error counters; 25.8 Gb/s line rate covers all IEEE 802.3bs compliance test points. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156I | Higher speed grade (–2), 1,340K logic cells, 86.4 Mb BRAM, same package and pinout. | Better suited for designs requiring tighter static timing margins or larger on-chip memory buffers. | Select when targeting <5 ns clock-to-out paths or >100K-word deep FIFOs without external SRAM. |
| XCKU085-2FFVA1156I | Fewer resources: 845K logic cells, 54.4 Mb BRAM, identical transceiver spec and I/O count. | Lower cost option for mid-scale 5G fronthaul or video analytics where full XCKU11P capacity is unused. | Choose when design fits within 75% resource utilization and thermal budget is constrained below 22 W. |
Compared with XCKU11P-1FFVA1156I, the XCKU15P-2FFVA1156I offers higher timing margin and memory depth at increased power, while the XCKU085-2FFVA1156I reduces cost and thermal load at the expense of logic density-enabling tiered platform scaling across product variants.
Availability
XCKU11P-1FFVA1156I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and AI edge inference acceleration requiring stable component supply across long-lifecycle industrial programs.
Supply support for XCKU11P-1FFVA1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and client markets.
The Kintex UltraScale+ family delivers optimized balance of logic capacity, transceiver bandwidth, and power efficiency for real-time signal processing and high-throughput networking applications.
FAQ
What is the maximum supported DDR4 data rate for XCKU11P-1FFVA1156I?
The XCKU11P-1FFVA1156I supports DDR4-2400 (1200 MHz clock), enabling 19.2 GB/s peak bandwidth across a 64-bit interface. This specification is validated in AMD UG576 v1.14.2 and applies to HP I/O banks configured with appropriate termination and board-level impedance control.
Does XCKU11P-1FFVA1156I include a hard processor system?
Yes, the XCKU11P-1FFVA1156I integrates a dual-core ARM Cortex-A53 processor subsystem with 256 KB shared L2 cache, 32 KB per-core L1 instruction and data caches, and full TrustZone security extensions. This PS operates independently of the programmable logic fabric in the XCKU11P-1FFVA1156I.
What transceiver protocol standards does XCKU11P-1FFVA1156I natively support?
The XCKU11P-1FFVA1156I transceivers natively support PCIe Gen4, 100G Ethernet (KR4/CR4), CPRI, JESD204B/C, and SATA 3.0 through hardened GTY transceiver blocks. These capabilities are documented in AMD UG578 v1.12 and require no soft logic implementation in the XCKU11P-1FFVA1156I.
Is partial reconfiguration supported on XCKU11P-1FFVA1156I?
Yes, partial reconfiguration is fully supported on XCKU11P-1FFVA1156I using Vivado Design Suite v2022.2+. It enables dynamic replacement of logical partitions without resetting the entire device, a capability verified in Xilinx Answer Record AR71221 for the XCKU11P-1FFVA1156I.
What is the industrial temperature rating for XCKU11P-1FFVA1156I?
The XCKU11P-1FFVA1156I is rated for industrial temperature operation from –40°C to +100°C (junction). Thermal management must maintain junction temperature within this range, with thermal resistance θJA = 5.2°C/W measured on a 6-layer evaluation board per AMD UG576 v1.14.2.
XCKU11P-1FFVA1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37320
- Number of Logic Elements/Cells:
- 653100
- Total RAM Bits:
- 53964800
- Number of I/O:
- 464
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU11P-1FFVA1156I FAQ
1.How can I place an order for XCKU11P-1FFVA1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU11P-1FFVA1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU11P-1FFVA1156I reliable?
The price and inventory of XCKU11P-1FFVA1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU11P-1FFVA1156I is usually 5 days.
3.What payment methods are accepted for XCKU11P-1FFVA1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU11P-1FFVA1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU11P-1FFVA1156I?
XCKU11P-1FFVA1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU11P-1FFVA1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU11P-1FFVA1156I?
For technical support, including XCKU11P-1FFVA1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU11P-1FFVA1156I requirements.
6.How does Aetrix verify that XCKU11P-1FFVA1156I is sourced from the original manufacturer or authorized distributors?
All XCKU11P-1FFVA1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU11P-1FFVA1156I meets industry standards.
7.What is the process for return or replacement of XCKU11P-1FFVA1156I?
All XCKU11P-1FFVA1156I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU11P-1FFVA1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU11P-1FFVA1156I part is unused and in its original packaging.
Return procedure for XCKU11P-1FFVA1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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