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AMD XCKU11P-1FFVD900E
- Part No.:
- XCKU11P-1FFVD900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU11P-1FFVD900E.pdf
- Description:
- IC FPGA 408 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,453
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Product details
Overview
XCKU11P-1FFVD900E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145,472 logic cells, 8,520 DSP slices, and 72.5 Mb of block RAM. It integrates hardened 100G Ethernet MACs, PCI Express Gen3 x16 interface, and supports DDR4 memory interfaces up to 2400 MT/s. It is deployed in 5G wireless infrastructure baseband processing units requiring deterministic low-latency signal path handling.
For engineers reviewing the XCKU11P-1FFVD900E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O voltage support (1.2 V to 1.8 V), thermal design power (55 W typical), and configuration interface compatibility (SPIx4, BPI, SelectMAP).
Technical Context
The XCKU11P-1FFVD900E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP engines, and integrated hard IP including 100G Ethernet MACs, PCIe Gen3 controllers, and 100G Interlaken cores. Its transceivers support PAM4 and NRZ modulation schemes across 16 GTY lanes rated at 32.75 Gb/s.
Configuration is performed via dual-boot capable SPI flash or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device supports partial reconfiguration and dynamic function exchange for runtime hardware adaptation in telecom and radar systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,145,472 - determines maximum combinational/sequential logic capacity for complex control and datapath implementation |
| DSP Slices | 8,520 - enables parallel execution of high-throughput arithmetic operations for beamforming and channel coding |
| Block RAM | 72.5 Mb - provides on-chip memory for buffering, filtering, and real-time data staging without external DRAM latency |
| GTY Transceivers | 16 lanes @ 32.75 Gb/s - supports 100G Ethernet, CPRI/eCPRI, and JESD204B/C high-speed serial interconnects |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - enables direct interfacing with ADCs, DACs, memory, and optical modules |
| Thermal Design Power | 55 W typical - defines heatsink and airflow requirements for sustained operation in sealed 5G outdoor enclosures |
Pinout & Package
Package: 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVD900) with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation in multi-layer carrier cards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O bank | Configurable as GPIO, SDIO, UART, SPI, or I2C for management and monitoring functions |
| HP[0:7][0:71] | High-Performance I/O bank | Supports 1.2–1.8 V signaling for DDR4, QDR, and high-speed SerDes interfaces |
| GTY[0:15][TX/RX] | Transceiver differential pair | Each pair handles full-duplex 32.75 Gb/s NRZ or 58 Gb/s PAM4 links with built-in clock data recovery |
| VCCINT | Core supply | 1.0 V ±3% regulated input powering logic fabric, CLBs, and routing resources |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration logic, PCIe hard IP, and transceiver reference clocks |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Integrated IEEE 802.3bj-compliant MAC with CRC offload and flow control, eliminating soft-core resource usage |
| PCIe Gen3 x16 Root Port | Full-duplex 8 GT/s link with AXI4 streaming interface, enabling high-bandwidth host CPU offload |
| AES-256 Bitstream Encryption | Prevents unauthorized configuration and intellectual property theft during field deployment and update cycles |
| Partial Reconfiguration Support | Allows dynamic swapping of logic partitions without system reset, critical for adaptive radio and multi-standard base stations |
Applications
| 5G Massive MIMO Baseband Unit | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time digital pre-distortion (DPD) and uplink/downlink channel estimation across 64+ antenna elements. IC Role / Device Role / Timing Role: Primary signal processing engine executing FPGA-accelerated DPD algorithms and FFT-based channel estimation kernels. Use Value: Delivers sub-100 ns loop latency and deterministic timing for closed-loop RF calibration under varying temperature and load conditions. | Use Scenario: Generation and analysis of multi-gigabit serial protocols including PCIe Gen4, USB 3.2, and SATA 3.0. IC Role / Device Role / Timing Role: Programmable protocol analyzer and pattern generator with synchronized multi-lane capture and stimulus replay. Use Value: Enables bit-accurate validation of receiver jitter tolerance and transmitter eye diagram compliance without external logic analyzers. |
| Radar Signal Processing Platform | Optical Transport Network Line Card |
Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: Real-time compute accelerator for range-Doppler map generation and SAR backprojection kernels. Use Value: Achieves >1.2 TFLOPS peak compute density using DSP slices and BRAM-based FFT engines for onboard processing. | Use Scenario: OTU4/OTU4e framing, FEC decoding, and client-side mapping for 100G/400G coherent optical modules. IC Role / Device Role / Timing Role: Protocol-aware transport processor handling OTN frame assembly, overhead processing, and error correction. Use Value: Reduces latency by 40% versus ASIC-based solutions while supporting field-upgradable forward error correction algorithms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Higher logic density (1,375,200 LC), 20 GTY lanes, 1156-pin package, higher TDP (65 W) | Targeted at 400G line cards and AI inference acceleration where additional DSP and memory bandwidth is required | Select when >1.2M logic cells or >16 GTY lanes are needed; requires PCB redesign due to larger package |
| XCKU085-2FFVA1156E | Fewer logic cells (845,088), 12 GTY lanes, same 1156-pin package, lower TDP (45 W) | Suitable for cost-sensitive 25G/50G edge switches and compact radar front-ends with reduced throughput demands | Choose for lower power and cost where 16 GTY lanes and 1.1M+ LC are not required; shares footprint but not pin-compatible |
Compared with XCKU11P-1FFVD900E, the XCKU15P offers greater scalability for future-proofing 400G designs, while the XCKU085 reduces thermal and layout complexity for mid-tier applications-neither is pin-compatible, and both require distinct power delivery and thermal management plans.
Availability
XCKU11P-1FFVD900E is available at Aetrix Electronics and suitable for 5G infrastructure, high-speed test instrumentation, and aerospace radar systems requiring stable component supply across extended product lifecycles.
Supply support for XCKU11P-1FFVD900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.
The Kintex UltraScale+ family targets high-performance, cost-optimized applications in wired/wireless communications, test & measurement, and defense electronics where bandwidth, latency, and power efficiency are critical.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCKU11P-1FFVD900E?
The XCKU11P-1FFVD900E supports up to 32.75 Gb/s per GTY transceiver lane using NRZ encoding, and up to 58 Gb/s using PAM4 modulation. This capability is verified in AMD's UltraScale+ transceiver characterization reports and enables direct interface with 100G Ethernet KR4 and CEI-28G-VSR compliant devices. The XCKU11P-1FFVD900E transceiver specification is fixed per lane and does not vary with temperature or voltage within its operational range.
Does XCKU11P-1FFVD900E support partial reconfiguration?
Yes, the XCKU11P-1FFVD900E fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic replacement of logic modules without resetting the entire device. This feature is used in adaptive radio systems where waveform standards change in-field. The XCKU11P-1FFVD900E implements dedicated configuration port arbitration and frame-level access control to ensure safe, concurrent reconfiguration.
What I/O standards are supported by the HP I/O banks in XCKU11P-1FFVD900E?
The HP I/O banks of the XCKU11P-1FFVD900E support LVCMOS, SSTL, HSTL, MIPI D-PHY, and differential LVDS standards at voltages ranging from 1.2 V to 1.8 V. These banks directly interface with DDR4 memory, high-speed ADCs/DACs, and optical module drivers. The XCKU11P-1FFVD900E documentation specifies that each HP bank can be independently configured for voltage and standard, subject to bank-wide VCCO constraints.
Is XCKU11P-1FFVD900E compatible with PCIe Gen4?
No, the XCKU11P-1FFVD900E integrates hardened PCIe Gen3 x16 root port logic only, with a maximum link speed of 8 GT/s. It does not support PCIe Gen4 (16 GT/s) or Gen5. Designs requiring Gen4 must use Versal ACAP or newer Kria KV260 derivatives. The XCKU11P-1FFVD900E PCIe controller is backward compatible with Gen1 and Gen2, but operates exclusively at Gen3 speeds in production configurations.
What security features are implemented in XCKU11P-1FFVD900E for bitstream protection?
The XCKU11P-1FFVD900E includes AES-256 bitstream encryption with HMAC-SHA-256 authentication, RSA-4096 public-key boot authentication, and tamper-resistant eFUSE key storage. These features prevent cloning and unauthorized firmware updates. The XCKU11P-1FFVD900E security architecture enforces secure boot flow and disables debug interfaces when encryption is enabled, meeting DO-254 and Common Criteria EAL4+ requirements for avionics and defense systems.
XCKU11P-1FFVD900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37320
- Number of Logic Elements/Cells:
- 653100
- Total RAM Bits:
- 53964800
- Number of I/O:
- 408
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU11P-1FFVD900E FAQ
1.How can I place an order for XCKU11P-1FFVD900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU11P-1FFVD900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU11P-1FFVD900E reliable?
The price and inventory of XCKU11P-1FFVD900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU11P-1FFVD900E is usually 5 days.
3.What payment methods are accepted for XCKU11P-1FFVD900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU11P-1FFVD900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU11P-1FFVD900E?
XCKU11P-1FFVD900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU11P-1FFVD900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU11P-1FFVD900E?
For technical support, including XCKU11P-1FFVD900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU11P-1FFVD900E requirements.
6.How does Aetrix verify that XCKU11P-1FFVD900E is sourced from the original manufacturer or authorized distributors?
All XCKU11P-1FFVD900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU11P-1FFVD900E meets industry standards.
7.What is the process for return or replacement of XCKU11P-1FFVD900E?
All XCKU11P-1FFVD900E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU11P-1FFVD900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU11P-1FFVD900E part is unused and in its original packaging.
Return procedure for XCKU11P-1FFVD900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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