AMD XCKU11P-1FFVE1517E

Overview

XCKU11P-1FFVE1517E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145,472 logic cells, 7,220 DSP slices, and 84.2 Mb of block RAM. It supports PCIe Gen4 x16, 25.8 Gb/s GTY transceivers, and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in 5G radio units and high-throughput data acceleration systems.

For engineers reviewing the XCKU11P-1FFVE1517E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic density, thermal envelope, power delivery requirements, and package I/O count for high-speed SerDes routing.

Technical Context

The XCKU11P-1FFVE1517E implements a heterogeneous architecture integrating programmable logic, hardened IP (PCIe Gen4, DDR4 PHY, 100G Ethernet MAC), and multi-rate transceivers. Its GTY transceivers support protocols including CPRI, JESD204B/C, and 100GbE with PMA rates up to 25.8 Gb/s.

It uses 16nm FinFET process technology, includes integrated configuration security (AES-256, HMAC-SHA-256), and supports partial reconfiguration. The device targets deterministic latency and high I/O bandwidth in real-time signal processing pipelines.

Key Specifications

Pinout & Package

Package: FFVE1517 - 1517-ball flip-chip BGA with 0.8 mm pitch, 49.0 × 49.0 mm footprint, and industrial-grade thermal performance (θ_JA = 3.5°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU11P-1FFVE1517E, the XCKU15P-2FFVE1517I offers higher timing margin and logic capacity in identical packaging, while the XCKU085-2FFVA1156E reduces cost and power at the expense of transceiver count and DSP resources-enabling tiered system scalability.

Availability

XCKU11P-1FFVE1517E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace data concentrators, and high-throughput computing accelerators requiring stable component supply across extended product lifecycles.

Supply support for XCKU11P-1FFVE1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets with focus on performance-per-watt efficiency.

The Kintex UltraScale+ family delivers high logic density and transceiver bandwidth for real-time signal processing, wireless infrastructure, and compute acceleration-designed to replace ASICs in evolving protocol environments.

FAQ

What is the maximum supported data rate for GTY transceivers in XCKU11P-1FFVE1517E?

The XCKU11P-1FFVE1517E supports GTY transceiver data rates up to 25.8 Gb/s per lane. This enables native JESD204C, PCIe Gen4, and 100GbE compliance. The actual achievable rate depends on PCB stackup, trace length, and reference clock jitter-designs must follow AMD's UltraScale+ GTY IBIS-AMI models and layout guidelines to maintain signal integrity at full rate.

Does XCKU11P-1FFVE1517E support partial reconfiguration?

Yes, XCKU11P-1FFVE1517E fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of logic modules without resetting the entire device-essential for applications like adaptive waveform generation in electronic warfare or protocol agility in 5G NR base stations. Configuration security features remain active during partial bitstream loads.

What power supply rails are required for XCKU11P-1FFVE1517E operation?

XCKU11P-1FFVE1517E requires four primary supply rails: VCCINT (0.85 V), VCCAUX (1.8 V), VCCO (1.2–1.8 V, bank-dependent), and MGTAVCC (1.0 V). Each rail has strict voltage tolerance (±2–3%) and sequencing requirements defined in the device data sheet. Failure to meet sequencing or ripple specs may cause configuration failure or transceiver lock loss.

Is XCKU11P-1FFVE1517E qualified for industrial temperature operation?

Yes, XCKU11P-1FFVE1517E is rated for industrial temperature range (-40°C to +100°C) as indicated by the "E" suffix in the part number. Thermal performance is validated per JEDEC JESD51 standards, with θ_JA = 3.5°C/W. System-level thermal design must ensure junction temperature remains within limits under worst-case power dissipation.

What hardened IP blocks are integrated into XCKU11P-1FFVE1517E?

XCKU11P-1FFVE1517E integrates multiple hardened IP blocks including PCIe Gen4 x16 root port/endpoint, DDR4 memory controller with ECC, 100G Ethernet MAC (with RS-FEC), and dual 100G Interlaken cores. These blocks operate independently of fabric logic, reducing resource usage and improving timing predictability for high-speed interconnect applications.