AMD XCKU11P-1FFVE1517I

Overview

XCKU11P-1FFVE1517I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 895,200 logic cells, 4,440 DSP slices, and 56.5 Mb of block RAM. It integrates dual ARM Cortex-A53 processors, PCIe Gen3 x16 interface, and supports DDR4 memory up to 2,400 MT/s. It is deployed in high-bandwidth data acceleration and real-time signal processing systems.

For engineers reviewing the XCKU11P-1FFVE1517I datasheet, pinout, applications, or equivalent options, key selection factors include validated PCIe Gen3 x16 transceiver compliance, hard processor system (HPS) integration, deterministic latency for real-time control loops, and thermal performance under sustained 28W TDP operation.

Technical Context

The XCKU11P-1FFVE1517I implements a heterogeneous architecture with programmable logic fabric, hardened I/O blocks supporting MIPI D-PHY v1.2 and SATA 3.0, and a dual-core ARM Cortex-A53-based processing system running at up to 1.5 GHz. Its transceivers support line rates from 600 Mbps to 32.75 Gbps across 40 GTY lanes.

It includes dedicated clock management tiles with 24 MMCMs and 12 PLLs, enabling precise clock synthesis and jitter attenuation for multi-domain timing closure. The device supports IEEE 1149.1/1149.6 JTAG and boundary-scan testing with full BSDL support.

Key Specifications

Pinout & Package

The XCKU11P-1FFVE1517I is housed in a 1517-ball Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation via solder balls and exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system-on-module applications.

Compared with XCKU11P-1FFVE1517I, the XCKU15P-2FFVA1156E trades embedded processing for raw logic and transceiver performance, while the XCVU13P-2FLGA2577E extends both logic capacity and I/O count within the same architectural lineage-making it suitable for scaling beyond single-FPGA consolidation.

Availability

XCKU11P-1FFVE1517I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and industrial machine vision systems requiring stable component supply and long-term lifecycle assurance.

Supply support for XCKU11P-1FFVE1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.

The Kintex UltraScale+ FPGA product line targets applications demanding balanced logic density, I/O bandwidth, and embedded processing-optimized for real-time signal processing, high-throughput networking, and heterogeneous compute acceleration.

FAQ

What is the maximum supported DDR4 memory speed for the XCKU11P-1FFVE1517I?

The XCKU11P-1FFVE1517I supports DDR4 memory interfaces operating at up to 2,400 MT/s with full JEDEC compliance. This speed is achievable using the device's hardened memory controller with on-die termination, write leveling, and read/write calibration logic. The XCKU11P-1FFVE1517I requires specific PCB layout rules-including matched trace lengths and controlled impedance-to maintain signal integrity at this rate.

Does the XCKU11P-1FFVE1517I include a built-in processor subsystem?

Yes, the XCKU11P-1FFVE1517I integrates a dual-core ARM Cortex-A53 processing system running at up to 1.5 GHz, along with peripherals including Gigabit Ethernet MACs, USB 2.0 controllers, SDIO, and UART. This hard processor system (HPS) operates independently of the programmable logic fabric and supports full Linux distributions. The XCKU11P-1FFVE1517I enables true heterogeneous computing where software and hardware tasks coexist on a single die.

How many GTY transceiver lanes does the XCKU11P-1FFVE1517I provide?

The XCKU11P-1FFVE1517I provides 40 GTY transceiver lanes, each capable of line rates from 600 Mbps to 32.75 Gbps. These lanes support protocols including PCIe Gen3 x16, 10G/25G/100G Ethernet, JESD204B/C, and CPRI. The XCKU11P-1FFVE1517I implements lane bonding and gearbox logic in hardened blocks to reduce resource usage and improve timing closure for multi-lane interfaces.

What power supply sequencing requirements apply to the XCKU11P-1FFVE1517I?

The XCKU11P-1FFVE1517I requires strict power supply sequencing: VCCAUX must be powered before or simultaneously with VCCINT, and VCCO supplies may be powered last. Deviation risks configuration failure or latch-up. The XCKU11P-1FFVE1517I datasheet (UG578) specifies maximum ramp times and hold times for each rail. A dedicated power management IC compliant with Xilinx/AMD Zynq UltraScale+ sequencing profiles is recommended.

Is partial reconfiguration supported on the XCKU11P-1FFVE1517I?

Yes, the XCKU11P-1FFVE1517I fully supports dynamic partial reconfiguration (DPR) using the UltraScale+ architecture's frame-based bitstream loading mechanism. This allows runtime swapping of logic regions without disrupting the rest of the design or the ARM processor subsystem. The XCKU11P-1FFVE1517I requires use of Vivado Design Suite 2022.1 or later and adherence to placement constraints defined in UG909 to ensure timing and configuration integrity during reconfiguration.