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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCKU11P-2FFVA1156E

Name: XCKU11P-2FFVA1156E
Brand: AMD
SKU: XCKU11P-2FFVA1156E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCKU11P-2FFVA1156E

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 1156-BBGA, FCBGA

Datasheet:: XCKU11P-2FFVA1156E.pdf

Description:: IC FPGA 464 I/O 1156FCBGA

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Product details

Overview

XCKU11P-2FFVA1156E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145K logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets high-bandwidth data processing in radar signal chains and 5G baseband units.

For engineers reviewing the XCKU11P-2FFVA1156E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O bank voltage flexibility (1.2V/1.35V/1.8V), and hardened IP for PCIe/DDR4/100G Ethernet.

Technical Context

The XCKU11P-2FFVA1156E implements a heterogeneous architecture with programmable logic fabric, 2,880 DSP slices, and integrated hard IP including dual 100G Ethernet MACs, PCIe Gen4 x16 root port/endpoint, and DDR4 memory controllers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data flow control.

Its FFVA1156 package provides 652 user I/Os across 22 I/O banks with selectable VCCO per bank and dedicated configuration pins (INIT_B, PROGRAM_B, CCLK). Configuration is performed via quad-SPI or JTAG using 1.8V or 3.3V interface levels.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	1,145,280 - determines maximum combinational/sequential logic capacity for complex algorithm implementation
Block RAM	72.5 Mb - enables large on-die buffering for video frame storage or packet buffering in networking
UltraScale+ Transceivers	64 lanes @ 25.8 Gb/s - supports 100G Ethernet (4×25G), CPRI, or JESD204B/C high-speed serial links
PCIe Interface	Gen4 x16 hard IP - delivers 32 GB/s bidirectional bandwidth without consuming PL resources
DDR4 Memory Controller	Hardened controller for up to DDR4-2400 @ 72-bit width - eliminates need for soft controller IP and timing closure effort
I/O Banks	22 banks with independent VCCO - allows mixed-voltage I/O interfacing (e.g., 1.2V MIPI + 1.8V LVDS on same device)

Pinout & Package

Package: FFVA1156 - 1156-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
MIO[0:15]	Multiplexed I/O	Configurable as SDIO, UART, SPI, I2C, or GPIO; used for boot and peripheral control
HP[0:651]	High-Performance I/O	User-programmable single-ended/differential I/O supporting LVDS, SSTL, HSTL, MIPI D-PHY
GTH[0:63]	Transceiver Lane	25.8 Gb/s serial I/O with built-in CDR, PRBS generator/checker, and gearbox logic
VRP/VRN	Reference Voltage	Provides internal reference for differential I/O standards like LVDS and TMDS
CONFIG_IO	Configuration Interface	Dedicated pins for mode selection (JTAG/SPI), programming (PROGRAM_B), status (INIT_B), clock (CCLK)

Key Features

Feature	Design Value
Hardened 100G Ethernet MAC	Two integrated 100G Ethernet MACs reduce latency and resource usage versus soft IP implementations
Partial Reconfiguration Support	Enables dynamic function swapping in deployed systems without full FPGA reset or downtime
AXI4-Stream Interconnect	Standardized high-throughput streaming interface between IP blocks, simplifying data path integration
Secure Boot with AES-GCM	Hardware-accelerated encryption ensures authenticated, tamper-resistant configuration loading
Thermal Monitoring Diode	On-die sensor enables real-time junction temperature measurement for thermal management

Applications

Radar Signal Processing	5G Massive MIMO Baseband
Use Scenario: Real-time beamforming and pulse-Doppler processing in airborne AESA radar systems. IC Role / Device Role / Timing Role: Primary compute engine handling FFT, CFAR, and digital down-conversion with deterministic latency. Use Value: 2,880 DSP slices and 25.8 Gb/s transceivers enable >100 GSPS real-time throughput with sub-microsecond latency.	Use Scenario: Channel coding, precoding, and layer mapping in 5G NR gNodeB units supporting 64T64R configurations. IC Role / Device Role / Timing Role: Baseband processor interfacing with multiple RFICs via JESD204C and managing massive parallel data streams. Use Value: Hardened JESD204C support and 64 transceiver lanes allow direct connection to 16× RFICs at 24.33 Gb/s per lane.
High-Frequency Trading Acceleration	Test & Measurement Equipment
Use Scenario: Low-latency order matching and market data parsing in co-located trading engines. IC Role / Device Role / Timing Role: Deterministic packet processing unit with hardware timestamping and ultra-low jitter clocking. Use Value: Sub-10 ns input-to-output latency and PCIe Gen4 x16 host interface enable <500 ns round-trip transaction times.	Use Scenario: Real-time waveform generation and analysis in 100 GHz+ oscilloscopes and vector signal analyzers. IC Role / Device Role / Timing Role: High-speed data acquisition controller synchronizing ADC/DAC arrays and managing DMA transfers. Use Value: 72.5 Mb block RAM and DDR4-2400 controller support multi-gigasample deep memory buffers with burst transfer rates >19 GB/s.

Radar Signal Processing

5G Massive MIMO Baseband

Use Scenario: Real-time beamforming and pulse-Doppler processing in airborne AESA radar systems.

IC Role / Device Role / Timing Role: Primary compute engine handling FFT, CFAR, and digital down-conversion with deterministic latency.

Use Value: 2,880 DSP slices and 25.8 Gb/s transceivers enable >100 GSPS real-time throughput with sub-microsecond latency.

Use Scenario: Channel coding, precoding, and layer mapping in 5G NR gNodeB units supporting 64T64R configurations.

IC Role / Device Role / Timing Role: Baseband processor interfacing with multiple RFICs via JESD204C and managing massive parallel data streams.

Use Value: Hardened JESD204C support and 64 transceiver lanes allow direct connection to 16× RFICs at 24.33 Gb/s per lane.

High-Frequency Trading Acceleration

Test & Measurement Equipment

Use Scenario: Low-latency order matching and market data parsing in co-located trading engines.

IC Role / Device Role / Timing Role: Deterministic packet processing unit with hardware timestamping and ultra-low jitter clocking.

Use Value: Sub-10 ns input-to-output latency and PCIe Gen4 x16 host interface enable <500 ns round-trip transaction times.

Use Scenario: Real-time waveform generation and analysis in 100 GHz+ oscilloscopes and vector signal analyzers.

IC Role / Device Role / Timing Role: High-speed data acquisition controller synchronizing ADC/DAC arrays and managing DMA transfers.

Use Value: 72.5 Mb block RAM and DDR4-2400 controller support multi-gigasample deep memory buffers with burst transfer rates >19 GB/s.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCKU15P-2FFVA1156E	1,380K logic cells, 86.6 Mb BRAM, identical transceiver spec and package	Higher gate count required for larger protocol stacks or wider FFTs	Select when additional logic density or BRAM is needed without changing PCB layout
XCKU085-2FFVA1156E	862K logic cells, 54.5 Mb BRAM, same I/O and transceiver count	Suitable for cost-optimized 5G small cells or mid-tier test equipment	Choose for reduced BOM cost where logic/BRAM headroom is sufficient

Compared with XCKU11P-2FFVA1156E, the XCKU15P offers higher logic density for scaling complex control planes, while the XCKU085 reduces cost and power at the expense of on-chip memory and compute capacity-both share identical pinout and thermal profile.

Availability

XCKU11P-2FFVA1156E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-frequency trading infrastructure requiring stable component supply and long-term industrial availability.

Supply support for XCKU11P-2FFVA1156E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration solutions for data centers, communications, and embedded markets.

The Kintex UltraScale+ family delivers optimized performance-per-watt for high-throughput, low-latency applications including wireless infrastructure, aerospace avionics, and real-time instrumentation.

FAQ

What is the maximum supported DDR4 data rate for XCKU11P-2FFVA1156E?

The XCKU11P-2FFVA1156E integrates a hardened DDR4 memory controller supporting up to DDR4-2400 (1200 MHz) with 72-bit data bus width and ECC capability. This enables sustained memory bandwidth exceeding 19 GB/s in burst mode, verified in AMD UG575 v1.14. The controller includes calibration logic and supports both RDIMM and LRDIMM topologies.

Does XCKU11P-2FFVA1156E support partial reconfiguration?

Yes, XCKU11P-2FFVA1156E fully supports partial reconfiguration as defined in AMD UG909. It allows dynamic swapping of logical partitions during operation without resetting the entire device. This capability is implemented in the UltraScale+ architecture using frame-based bitstream loading and isolation primitives, enabling field-upgradable functions in radar and telecom systems.

What transceiver protocols are natively supported by XCKU11P-2FFVA1156E?

XCKU11P-2FFVA1156E natively supports PCIe Gen4, 100G Ethernet (CAUI-4), CPRI, JESD204B/C, and SATA/SAS through its 64 GTH transceiver lanes. Protocol support is implemented in hardened transceiver PMA/PMD layers and configurable PCS blocks, with no soft logic overhead required for standard compliance.

Is XCKU11P-2FFVA1156E pin-compatible with other Kintex UltraScale+ devices in FFVA1156 package?

Yes, XCKU11P-2FFVA1156E shares identical pinout and package footprint with XCKU085-2FFVA1156E and XCKU15P-2FFVA1156E. All three devices use the same 1156-ball FCBGA mechanical outline, I/O bank arrangement, and power/ground ball mapping, enabling drop-in replacement within the same speed grade and temperature range.

What configuration modes does XCKU11P-2FFVA1156E support?

XCKU11P-2FFVA1156E supports master SPI, slave SPI, JTAG, and BPI configuration modes. Quad-SPI mode enables fast parallel configuration from flash memory, while JTAG is used for debugging and boundary scan. Configuration voltage options include 1.8V and 3.3V for CONFIG_IO, as specified in AMD UG570 v1.15.

XCKU11P-2FFVA1156E Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Kintex® UltraScale+™

Package/Case:: 1156-BBGA, FCBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 37320

Number of Logic Elements/Cells:: 653100

Total RAM Bits:: 53964800

Number of I/O:: 464

Number of Gates:: -

Voltage - Supply:: 0.825V ~ 0.876V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 1156-FCBGA (35x35)

XCKU11P-2FFVA1156E FAQ

1.How can I place an order for XCKU11P-2FFVA1156E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU11P-2FFVA1156E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU11P-2FFVA1156E reliable?

The price and inventory of XCKU11P-2FFVA1156E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU11P-2FFVA1156E is usually 5 days.

3.What payment methods are accepted for XCKU11P-2FFVA1156E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU11P-2FFVA1156E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU11P-2FFVA1156E?

XCKU11P-2FFVA1156E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU11P-2FFVA1156E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU11P-2FFVA1156E?

For technical support, including XCKU11P-2FFVA1156E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU11P-2FFVA1156E requirements.

6.How does Aetrix verify that XCKU11P-2FFVA1156E is sourced from the original manufacturer or authorized distributors?

All XCKU11P-2FFVA1156E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU11P-2FFVA1156E meets industry standards.

7.What is the process for return or replacement of XCKU11P-2FFVA1156E?

All XCKU11P-2FFVA1156E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU11P-2FFVA1156E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU11P-2FFVA1156E part is unused and in its original packaging.

Return procedure for XCKU11P-2FFVA1156E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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