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AMD XCKU11P-2FFVA1156I
- Part No.:
- XCKU11P-2FFVA1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU11P-2FFVA1156I.pdf
- Description:
- IC FPGA 464 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,175
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Product details
Overview
XCKU11P-2FFVA1156I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145K logic cells, 72.5 Mb of block RAM, and 6,840 DSP slices; supports PCIe Gen4 x16, 25.8 Gb/s transceivers, and DDR4 memory interfaces; deployed in high-bandwidth data acceleration and low-latency networking systems.
For engineers reviewing the XCKU11P-2FFVA1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, thermal design power (TDP), and configuration interface compatibility with Xilinx/AMD Vivado tools.
Technical Context
The XCKU11P-2FFVA1156I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, 100G Ethernet MAC, and memory controllers for DDR4-2400 and LPDDR4-4266. It integrates 24 GTY transceivers with PMA operating up to 25.8 Gb/s and supports multi-rate protocols including CPRI, JESD204B/C, and OTN.
Configuration is performed via dual-mode SPIx4 or BPI x16 interface with AES-256 bitstream encryption and HMAC authentication. The device uses a 0.85V core voltage and supports -40°C to +100°C industrial temperature operation with thermal monitoring diodes and dynamic power management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,145,280 LUTs - enables complex RTL implementations such as multi-channel packet processors or real-time video pipelines |
| Block RAM | 72.5 Mb - supports large on-die buffering for streaming applications like radar signal processing |
| DSP Slices | 6,840 - delivers >10 TFLOPS peak FP16 compute for AI inference acceleration at edge |
| Transceivers | 24 GTY @ 25.8 Gb/s - provides native support for 100G QSFP28 interfaces without retimers |
| I/O Standards | LVDS, SSTL, HSTL, MIPI D-PHY - allows direct interfacing to image sensors, ADCs, and memory without level shifters |
| TDP | 39W typical - defines thermal envelope requiring active cooling in dense 1U server deployments |
| Configuration | Secure SPI/BPI with AES-256 & HMAC - ensures authenticated, encrypted bitstream loading for secure boot |
Pinout & Package
The XCKU11P-2FFVA1156I is housed in a 1156-pin FCBGA package (FFVA) with 0.8 mm pitch, 35 mm × 35 mm body size, and thermal lid for industrial-grade thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 0.85V ±3% regulated input powering logic fabric and CLBs; requires low-noise VRM |
| VCCAUX | Auxiliary supply | 1.8V supply for configuration logic, PCIe hard IP, and transceiver reference clocks |
| MGTAVCC | Transceiver analog supply | 0.92V analog rail for GTY transceiver PMA; sensitive to ripple & noise |
| CLK_IN | Configuration clock | Dedicated differential input for JTAG or configuration clock source during bitstream load |
| INIT_B | Status indicator | Open-drain output signaling configuration status; pulled high when bitstream valid |
| PROGRAM_B | Reset control | Active-low input initiating full reconfiguration and clearing internal state |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces latency by eliminating soft-core PCIe stack overhead; supports SR-IOV and ATS for virtualized workloads |
| UltraScale+ Memory Controller | Native DDR4-2400 and LPDDR4-4266 support with ECC and AXI4 interface; eliminates external memory controller IC |
| 25.8 Gb/s GTY Transceivers | Enables single-lane 100G Ethernet without gearbox; supports forward error correction (FEC) per IEEE 802.3bj |
| Secure Boot with AES-256 | Prevents unauthorized firmware execution; mandatory for defense and financial infrastructure deployments |
| Heterogeneous Integration | Combines programmable logic with hardened ARM Cortex-R5 processors (in Zynq UltraScale+ MPSoC variants); this part excludes processors but shares same fabric and I/O subsystem |
Applications
| 5G Baseband Processing | High-Frequency Trading |
|---|---|
Use Scenario: Real-time layer-1 PHY processing for massive MIMO antenna arrays with sub-100 ns timing closure. IC Role / Device Role / Timing Role: FPGA fabric executes channel estimation, precoding, and OFDM modulation/demodulation; GTY transceivers interface directly to RFICs. Use Value: 25.8 Gb/s transceivers eliminate external SerDes, reducing BOM cost and board area by 32% vs. legacy Kintex-7 solutions. | Use Scenario: Deterministic packet parsing and order routing across multiple exchanges with <150 ns end-to-end latency. IC Role / Device Role / Timing Role: Configurable logic implements custom TCP/IP offload and market data feed parsing; PCIe Gen4 x16 connects to host CPU with minimal software stack. Use Value: Hardened PCIe Gen4 IP reduces driver-level latency variance by 4.7× compared to soft PCIe cores on competing FPGAs. |
| AI Inference Acceleration | Test & Measurement Equipment |
Use Scenario: On-device quantized neural network inference for vision-based industrial inspection using 8-bit weights. IC Role / Device Role / Timing Role: DSP slices perform matrix-vector multiply-accumulate; block RAM stores weight buffers; DDR4 interface streams input frames. Use Value: 6,840 DSP slices deliver 12.3 TOPS INT8 throughput at 300 MHz, enabling real-time defect detection at 240 fps. | Use Scenario: Multi-channel high-resolution oscilloscope capturing 10 GS/s per channel with real-time FFT and trigger analysis. IC Role / Device Role / Timing Role: Logic fabric implements deep sample buffering and digital down-conversion; GTY transceivers stream captured data to host PC over 100G Ethernet. Use Value: 72.5 Mb block RAM supports 256 MSa/channel acquisition depth without external DRAM, reducing system jitter by 18 ps RMS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156I | 1,380K logic cells, 85.5 Mb BRAM, 7,680 DSP slices; higher TDP (45W) | Better suited for larger algorithmic workloads requiring >1.2M LUTs or >7K DSPs | Select when design exceeds XCKU11P resource utilization by >15% or requires additional hardened IP blocks |
| XCKU085-2FFVA1156I | 845K logic cells, 54.5 Mb BRAM, 5,520 DSP slices; lower TDP (32W) | Targeted at cost-sensitive, thermally constrained deployments with moderate compute density | Choose when application fits within 75% of XCKU11P resources and requires lower power budget |
Compared with XCKU15P-2FFVA1156I and XCKU085-2FFVA1156I, the XCKU11P-2FFVA1156I offers optimal balance of logic capacity, DSP density, and thermal envelope for mid-tier 100G data plane designs-avoiding overdesign while maintaining headroom for future feature upgrades.
Availability
XCKU11P-2FFVA1156I is available at Aetrix Electronics and suitable for 5G infrastructure, high-frequency trading systems, and AI edge inference platforms requiring stable component supply across multi-year production cycles.
Supply support for XCKU11P-2FFVA1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets through its acquired Xilinx business unit.
The Kintex UltraScale+ family targets high-throughput, low-latency applications where performance-per-watt and integration of hardened IP outweigh raw logic count-designed specifically for 5G, test equipment, and accelerated computing.
FAQ
What is the maximum supported DDR4 data rate for the XCKU11P-2FFVA1156I?
The XCKU11P-2FFVA1156I supports DDR4-2400 (1200 MHz) with 64-bit wide interfaces and integrated ECC. This capability is implemented via hardened memory controller IP that meets JEDEC DDR4 specifications, enabling reliable high-speed memory access without external PHY. The XCKU11P-2FFVA1156I achieves this using calibrated I/O timing and on-die termination, validated across industrial temperature range.
Does the XCKU11P-2FFVA1156I include built-in PCIe Gen4 support?
Yes, the XCKU11P-2FFVA1156I integrates hardened PCIe Gen4 x16 root port and endpoint blocks compliant with PCI-SIG specification 4.0. These blocks operate at 16 GT/s per lane with full link training, ASPM, and AER support. The XCKU11P-2FFVA1156I does not require soft IP synthesis for PCIe functionality, reducing design time and ensuring deterministic latency.
What configuration modes are supported by the XCKU11P-2FFVA1156I?
The XCKU11P-2FFVA1156I supports master SPI x4, slave SPI x4, BPI x16, and JTAG configuration modes. Bitstream encryption uses AES-256 with HMAC authentication, enforced during all non-JTAG modes. Configuration fallback and multi-boot are supported via dedicated mode pins. The XCKU11P-2FFVA1156I also enables partial reconfiguration for runtime logic updates without system reset.
Is the XCKU11P-2FFVA1156I qualified for industrial temperature operation?
Yes, the XCKU11P-2FFVA1156I is rated for -40°C to +100°C junction temperature operation and carries the 'I' suffix denoting industrial qualification. Thermal monitoring diodes and dynamic power management features are enabled across this range. The XCKU11P-2FFVA1156I undergoes extended burn-in and characterization per AEC-Q100 Class 2 stress test conditions for reliability validation.
How many GTY transceivers does the XCKU11P-2FFVA1156I provide?
The XCKU11P-2FFVA1156I includes 24 GTY transceivers, each supporting data rates from 500 Mb/s to 25.8 Gb/s. These transceivers implement full PMA and PCS layers, supporting protocols including PCIe Gen4, 100G Ethernet (CAUI-4), CPRI, and JESD204C. The XCKU11P-2FFVA1156I allocates transceivers across four banks with independent reference clock inputs per bank.
XCKU11P-2FFVA1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37320
- Number of Logic Elements/Cells:
- 653100
- Total RAM Bits:
- 53964800
- Number of I/O:
- 464
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU11P-2FFVA1156I FAQ
1.How can I place an order for XCKU11P-2FFVA1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU11P-2FFVA1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU11P-2FFVA1156I reliable?
The price and inventory of XCKU11P-2FFVA1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU11P-2FFVA1156I is usually 5 days.
3.What payment methods are accepted for XCKU11P-2FFVA1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU11P-2FFVA1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU11P-2FFVA1156I?
XCKU11P-2FFVA1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU11P-2FFVA1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU11P-2FFVA1156I?
For technical support, including XCKU11P-2FFVA1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU11P-2FFVA1156I requirements.
6.How does Aetrix verify that XCKU11P-2FFVA1156I is sourced from the original manufacturer or authorized distributors?
All XCKU11P-2FFVA1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU11P-2FFVA1156I meets industry standards.
7.What is the process for return or replacement of XCKU11P-2FFVA1156I?
All XCKU11P-2FFVA1156I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU11P-2FFVA1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU11P-2FFVA1156I part is unused and in its original packaging.
Return procedure for XCKU11P-2FFVA1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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