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AMD XCKU11P-2FFVD900E
- Part No.:
- XCKU11P-2FFVD900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU11P-2FFVD900E.pdf
- Description:
- IC FPGA 408 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,813
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Product details
Overview
XCKU11P-2FFVD900E from AMD is a high-performance Kintex UltraScale+ FPGA with 1,145K logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets high-bandwidth data processing in radar signal conditioning, 5G baseband units, and AI inference acceleration at the edge.
For engineers reviewing the XCKU11P-2FFVD900E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, thermal envelope (100°C junction), and configuration security options including AES-256 bitstream encryption.
Technical Context
The XCKU11P-2FFVD900E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA engines), and UltraScale+ DSP slices delivering 10.4 TMAC/s peak performance. Its dual-die package integrates a programmable logic die and a high-speed I/O die using 2.5D interposer technology.
It supports multi-boot configuration via Quad-SPI, BPI, or JTAG, with fallback capability and secure boot enforced by on-chip eFUSE and HMAC authentication. Configuration bitstream integrity is verified using SHA-3 hash before loading into fabric.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,145,280 - determines maximum combinational/sequential logic capacity for custom datapaths and control state machines |
| Block RAM | 72.5 Mb - enables large on-chip buffering for video frame stores, packet queues, or coefficient tables |
| UltraScale+ DSP Slices | 3,528 - delivers 10.4 TMAC/s for fixed/floating-point matrix operations in AI and signal processing |
| Transceiver Line Rate | 25.8 Gb/s - supports 100G KR4, CEI-28G, and 25G Ethernet without gearbox overhead |
| I/O Standards | LVDS, SSTL, HSTL, MIPI D-PHY - allows direct interfacing to image sensors, memory, and high-speed serdes PHYs |
| Junction Temp | 100°C - defines maximum operating temperature under full static/dynamic power load with specified cooling |
| Configuration Security | AES-256 + HMAC SHA-3 - prevents unauthorized bitstream cloning and ensures authenticated firmware updates |
Pinout & Package
The XCKU11P-2FFVD900E is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 1.0 mm ball pitch and 35 × 35 mm body size. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8V/3.3V operation |
| HR Bank 0–3 | High-Range I/O | Supports up to 1.8V signaling; compatible with DDR4, LPDDR4, and PCIe reference clocks |
| HP Bank 4–7 | High-Performance I/O | Operates at 1.2V/1.35V; optimized for transceiver reference clocks and high-speed SerDes lanes |
| VRP/VRN | Reference Voltage Pins | Provide precision internal reference for differential input receivers in HP/HR banks |
| CONFIG_IO | Configuration I/O | Dedicated pins for Quad-SPI flash interface and mode selection during power-up |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Multi-Die Architecture | Separate programmable logic and I/O dies connected via 2.5D interposer, enabling independent scaling and yield optimization |
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort and guarantees deterministic latency for host-to-FPGA data transfers |
| UltraScale+ DSP Slice with 27×18 Multiplier | Enables single-cycle 27×18 signed multiplication and cascaded accumulation for FIR filter chains |
| Secure Boot with eFUSE-based Key Storage | Prevents runtime bitstream tampering and enforces cryptographic chain-of-trust from power-on reset |
| Dynamic Reconfiguration Port (DRP) | Allows real-time partial reconfiguration of logic regions without interrupting active transceiver or memory interfaces |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in airborne phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; transceivers interface with ADC/DACs sampling at 2.4 GSPS. Use Value: 25.8 Gb/s transceivers eliminate external serializers, and 3,528 DSP slices sustain 128-channel beamformer throughput. | Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 5G NR macro base stations. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD algorithms; PCIe Gen4 x16 connects to host CPU for real-time coefficient updates. Use Value: AES-256 bitstream encryption protects proprietary DPD models deployed across distributed radio units. |
| AI Edge Inference Accelerator | High-Speed Test Equipment |
Use Scenario: Low-latency object detection on industrial inspection cameras using quantized CNN models. IC Role / Device Role / Timing Role: DSP slices perform INT8 convolutions; MIPI D-PHY inputs receive raw sensor frames at 4K@60fps. Use Value: On-chip 72.5 Mb BRAM stores model weights and feature maps, avoiding external DRAM latency bottlenecks. | Use Scenario: Bit-error-rate testing (BERT) and jitter tolerance validation for 100G optical modules. IC Role / Device Role / Timing Role: Transceivers generate and analyze PRBS31 patterns; logic fabric implements pattern matching and error counting in real time. Use Value: Dual-die architecture isolates high-speed analog test paths from digital control logic, improving measurement repeatability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Higher logic density (1,380K cells), larger package (1156-pin), higher static power | Better suited for multi-protocol aggregation (e.g., 4×100G Ethernet + PCIe Gen4) | Select when >1.1M logic cells or >100G serial bandwidth per die is required |
| XCKU085-2FFVA1156E | Fewer logic cells (845K), same 1156-pin package, lower transceiver count (20 vs. 32 lanes) | Targeted at cost-sensitive 25G/50G line cards with reduced DSP demand | Choose when transceiver lane count and DSP slice budget can be reduced by ~30% |
Compared with XCKU11P-2FFVD900E, the XCKU15P offers greater scalability for protocol stacking, while the XCKU085 trades density and speed for lower power and cost-making XCKU11P-2FFVD900E the optimal balance for 100G-class edge compute with strict thermal constraints.
Availability
XCKU11P-2FFVD900E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and AI edge inference requiring stable component supply across long-lifecycle industrial programs.
Supply support for XCKU11P-2FFVD900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.
The Kintex UltraScale+ family delivers high-performance, cost-optimized FPGAs for 5G infrastructure, aerospace radar, and real-time vision systems where power efficiency and I/O bandwidth are critical.
FAQ
What is the maximum supported DDR4 memory interface speed for the XCKU11P-2FFVD900E?
The XCKU11P-2FFVD900E supports DDR4-2400 (1200 MHz clock) across its HR I/O banks with dedicated memory controller hard IP. This enables sustained 19.2 GB/s aggregate bandwidth using a 64-bit bus with two ranks. The memory controller includes built-in calibration, refresh management, and ECC support-fully integrated into the Vivado design flow for XCKU11P-2FFVD900E projects.
Does the XCKU11P-2FFVD900E support partial reconfiguration?
Yes, the XCKU11P-2FFVD900E supports dynamic partial reconfiguration (PR) through its dedicated Dynamic Reconfiguration Port (DRP). This allows runtime swapping of logic modules-such as filter coefficients or protocol stacks-without resetting transceivers or memory controllers. PR implementation for XCKU11P-2FFVD900E requires Vivado 2022.2 or later and adheres to AMD's hierarchical design checkpoint methodology.
What configuration modes are supported by the XCKU11P-2FFVD900E?
The XCKU11P-2FFVD900E supports Quad-SPI, BPI, JTAG, and Master/Slave SelectMAP configuration modes. Quad-SPI is most commonly used for single-image boot from serial flash, while JTAG enables boundary-scan testing and debug programming. All modes enforce AES-256 decryption and HMAC SHA-3 verification for XCKU11P-2FFVD900E bitstreams prior to fabric loading.
Is the XCKU11P-2FFVD900E pin-compatible with other Kintex UltraScale+ devices?
No, the XCKU11P-2FFVD900E uses a unique 900-pin FFVD package not shared with other Kintex UltraScale+ members. While logic resources and I/O standards are architecturally consistent, physical pinout differs from 1156-pin variants like XCKU15P-2FFVA1156E. Migration between packages requires PCB redesign and signal integrity revalidation for XCKU11P-2FFVD900E applications.
What thermal management guidance applies to the XCKU11P-2FFVD900E?
The XCKU11P-2FFVD900E has a maximum junction temperature of 100°C and requires a thermal solution capable of dissipating up to 35 W under worst-case static/dynamic conditions. AMD recommends a 4-layer PCB with internal copper planes, thermal vias under the package's exposed thermal pad, and forced-air cooling. Thermal simulation data and layout guidelines for XCKU11P-2FFVD900E are provided in UG578 and Xilinx Answer Record AR71225.
XCKU11P-2FFVD900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37320
- Number of Logic Elements/Cells:
- 653100
- Total RAM Bits:
- 53964800
- Number of I/O:
- 408
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU11P-2FFVD900E FAQ
1.How can I place an order for XCKU11P-2FFVD900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU11P-2FFVD900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU11P-2FFVD900E reliable?
The price and inventory of XCKU11P-2FFVD900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU11P-2FFVD900E is usually 5 days.
3.What payment methods are accepted for XCKU11P-2FFVD900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU11P-2FFVD900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU11P-2FFVD900E?
XCKU11P-2FFVD900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU11P-2FFVD900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU11P-2FFVD900E?
For technical support, including XCKU11P-2FFVD900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU11P-2FFVD900E requirements.
6.How does Aetrix verify that XCKU11P-2FFVD900E is sourced from the original manufacturer or authorized distributors?
All XCKU11P-2FFVD900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU11P-2FFVD900E meets industry standards.
7.What is the process for return or replacement of XCKU11P-2FFVD900E?
All XCKU11P-2FFVD900E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU11P-2FFVD900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU11P-2FFVD900E part is unused and in its original packaging.
Return procedure for XCKU11P-2FFVD900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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