AMD XCKU11P-2FFVD900I

Overview

XCKU11P-2FFVD900I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145K logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets high-bandwidth data processing in radar signal conditioning, 5G baseband units, and AI inference acceleration at the edge.

For engineers reviewing the XCKU11P-2FFVD900I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (56), I/O voltage support (1.2 V to 1.8 V), thermal design power (55 W typical), and package pin compatibility with FFVD900 footprint.

Technical Context

The XCKU11P-2FFVD900I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including dual 100G Ethernet MACs, 25G/50G/100G PCS/PMA, and integrated ARM Cortex-R5F processors for real-time control. It supports partial reconfiguration and AXI4-Stream interfaces for dynamic system adaptation.

Its UltraScale+ architecture delivers deterministic timing closure for multi-gigabit serial protocols and includes dedicated DSP slices (3,528) optimized for complex mathematical operations in beamforming and channel estimation algorithms.

Key Specifications

Pinout & Package

The XCKU11P-2FFVD900I is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVD900) package with 1.0 mm ball pitch, designed for high-signal-integrity PCB routing and thermal dissipation via central thermal ball array.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU11P-2FFVD900I, the XCKU15P offers scalable logic and I/O for future-proofing, while the VU13P provides superior transceiver performance at significantly higher power and cost-making XCKU11P-2FFVD900I optimal for balanced compute, I/O, and thermal budgets in radar and 5G edge deployments.

Availability

XCKU11P-2FFVD900I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and AI edge inference accelerators requiring stable component supply across extended product lifecycles.

Supply support for XCKU11P-2FFVD900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets through its FPGA, adaptive SoC, and GPU technologies.

The Kintex UltraScale+ family targets high-performance, cost-optimized applications demanding advanced serial connectivity, high logic density, and embedded processing-specifically for wireless infrastructure, aerospace, and test & measurement equipment.

FAQ

What is the maximum supported data rate per transceiver lane for the XCKU11P-2FFVD900I?

The XCKU11P-2FFVD900I supports up to 25.8 Gb/s per transceiver lane, validated for protocols including PCIe Gen4, 100G Ethernet (CAUI-4), and CPRI. This rate is achievable with proper PCB stackup, controlled impedance routing, and reference clock jitter below 300 fs RMS. The XCKU11P-2FFVD900I transceiver architecture includes built-in equalization and clock-data recovery to maintain signal integrity at this speed.

Does the XCKU11P-2FFVD900I include embedded processors?

Yes, the XCKU11P-2FFVD900I integrates a dual-core ARM Cortex-R5F processor subsystem operating at up to 600 MHz, with 256 KB of tightly coupled memory (TCM) and configurable cache. This subsystem runs real-time firmware for configuration management, PCIe link training, and protocol offload-reducing reliance on external microcontrollers. The XCKU11P-2FFVD900I allows tight coupling between programmable logic and processor execution for deterministic control loops.

What package type and thermal characteristics define the XCKU11P-2FFVD900I?

The XCKU11P-2FFVD900I uses a 900-pin Flip-Chip Fine-Pitch BGA (FFVD900) with 1.0 mm ball pitch and an exposed thermal pad. Its typical thermal design power is 55 W, with junction-to-case thermal resistance of 0.35 °C/W. The XCKU11P-2FFVD900I requires a 6-layer PCB with dedicated power/ground planes and thermal vias under the package to meet JEDEC JESD51-2 compliant cooling requirements.

Can the XCKU11P-2FFVD900I support DDR4 memory interfaces?

Yes, the XCKU11P-2FFVD900I supports DDR4-2400 interfaces with up to 16 banks across multiple I/O banks, including dedicated memory controller hard IP. It achieves 1200 MT/s per pin with calibrated write leveling and read-leveling circuitry. The XCKU11P-2FFVD900I memory interface supports ECC, address/command parity, and dynamic ODT control for robust operation in mission-critical systems.

Is partial reconfiguration supported on the XCKU11P-2FFVD900I?

Yes, the XCKU11P-2FFVD900I fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic swapping of logical partitions without resetting the entire device. This capability is used in applications such as adaptive beamforming and protocol agility where functional modules (e.g., different modulation schemes) must be loaded on-the-fly. The XCKU11P-2FFVD900I includes dedicated configuration logic and secure bitstream authentication for safe partial updates.