AMD XCKU11P-2FFVE1517E

Overview

XCKU11P-2FFVE1517E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,143K logic cells, 7,220 DSP slices, and 84.2 Mb of block RAM. It supports PCIe Gen4 x16, 32.75 Gb/s GTY transceivers, and operates at -2 speed grade with extended temperature range (-40°C to +100°C). It is deployed in high-bandwidth data acceleration and real-time signal processing systems.

For engineers reviewing the XCKU11P-2FFVE1517E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic density, thermal envelope, power delivery requirements, and package I/O count for high-speed interface routing.

Technical Context

The XCKU11P-2FFVE1517E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and ultra-low-latency GTY transceivers. It integrates dual 100G MACs and supports up to 24 DDR4 memory interfaces at 2400 Mbps.

Its -2 speed grade guarantees timing closure at 32.75 Gb/s transceiver operation and 640 MHz system clocking under extended temperature conditions. The device uses stacked-die interposer packaging to achieve high I/O count and bandwidth density within the 1517-pin FCBGA package.

Key Specifications

Pinout & Package

The XCKU11P-2FFVE1517E is housed in a 1517-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVE1517) package with 35 mm × 35 mm footprint, 0.8 mm ball pitch, and integrated thermal lid. Pinout follows AMD's UltraScale+ FPGA I/O banking architecture with dedicated configuration, JTAG, and transceiver reference clock pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XCKU11P-2FFVE1517E, the XCKU15P offers greater scalability for future-proofing, while the XCKU085 reduces BOM and thermal management overhead-enabling trade-offs between performance headroom and system-level cost.

Availability

XCKU11P-2FFVE1517E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-performance computing applications requiring stable component supply and long-term lifecycle assurance.

Supply support for XCKU11P-2FFVE1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and client markets.

The Kintex UltraScale+ family delivers high-performance, cost-optimized FPGA solutions targeting high-bandwidth, low-latency applications in communications, test & measurement, and defense systems.

FAQ

What is the maximum supported transceiver data rate for XCKU11P-2FFVE1517E?

The XCKU11P-2FFVE1517E supports GTY transceivers operating at up to 32.75 Gb/s per lane. This rate is guaranteed under the -2 speed grade across the extended temperature range (-40°C to +100°C) with appropriate reference clock stability and PCB signal integrity compliance. The XCKU11P-2FFVE1517E achieves this using adaptive equalization and continuous time linear equalization (CTLE) circuitry integrated into each GTY channel.

Does XCKU11P-2FFVE1517E include hardened PCIe Gen4 controllers?

Yes, the XCKU11P-2FFVE1517E integrates dual hardened PCIe Gen4 x8 endpoints/controllers capable of x16 link aggregation. These blocks support AXI4-Stream and AXI4-Lite interfaces, L1 substates, and ASPM power management. The XCKU11P-2FFVE1517E implements these functions without consuming programmable logic resources, preserving logic cells for application-specific logic.

What is the I/O voltage support for XCKU11P-2FFVE1517E banks?

The XCKU11P-2FFVE1517E supports multiple I/O standards across its 24 selectable I/O banks, including LVCMOS, SSTL, HSTL, and differential standards such as LVDS and TMDS. Each bank operates at selectable VCCO voltages from 1.2 V to 3.3 V, with dedicated VRP/VRN reference pins per bank. The XCKU11P-2FFVE1517E allows mixed-voltage operation across banks to interface with diverse peripheral families simultaneously.

Is XCKU11P-2FFVE1517E qualified for extended temperature operation?

Yes, the XCKU11P-2FFVE1517E is rated for operation from -40°C to +100°C ambient temperature and is manufactured using AMD's extended temperature qualification process. This includes burn-in, temperature cycling, and high-temperature operating life testing. The XCKU11P-2FFVE1517E meets industrial and select aerospace environmental requirements without derating.

How many DDR4 memory interfaces does XCKU11P-2FFVE1517E support?

The XCKU11P-2FFVE1517E supports up to 24 DDR4 memory interfaces, each configurable for x4, x8, or x16 data widths and operating at up to 2400 Mbps. These interfaces use dedicated hardened PHY blocks with write leveling, read leveling, and gate training. The XCKU11P-2FFVE1517E implements all timing-critical DDR4 functions in hardware, eliminating need for logic-based controller implementation.