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AMD XCKU11P-2FFVE1517I
- Part No.:
- XCKU11P-2FFVE1517I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU11P-2FFVE1517I.pdf
- Description:
- IC FPGA 512 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,482
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Product details
Overview
XCKU11P-2FFVE1517I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,143K logic cells, 72.5 Mb of block RAM, 3,552 DSP slices, and support for up to 48 GTY transceivers operating at 32.75 Gb/s. It is used in high-bandwidth data processing systems such as 100G/400G optical transport and radar signal processing.
For engineers reviewing the XCKU11P-2FFVE1517I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed grade, I/O bank voltage flexibility, thermal performance in air-cooled 1517-pin FC-BGA packaging, and configuration security options including AES-256 bitstream encryption.
Technical Context
The XCKU11P-2FFVE1517I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3 x16, 100G Ethernet MAC, DDR4 PHY), and multi-rate transceivers. It supports JTAG, SelectMAP, and QSPI configuration modes with dual-boot capability.
It operates across industrial temperature range (–40°C to +100°C junction), uses 0.85 V core voltage, and integrates System Monitor for on-chip temperature and supply voltage monitoring - all confirmed in AMD UG579 v1.14.2 and DS925 v1.15.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,143,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| Block RAM | 72.5 Mb - supports large on-die buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 3,552 - enables high-throughput fixed/floating-point math for filtering, FFT, and beamforming |
| GTY Transceivers | 48 × 32.75 Gb/s - delivers aggregate bandwidth for 400G Ethernet, CPRI, and JESD204B/C interfaces |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, and 1.8 V/2.5 V/3.3 V - allows direct interfacing with diverse peripherals and memory types |
| Configuration Security | AES-256 + HMAC-SHA256 - prevents unauthorized bitstream cloning and ensures authenticated boot |
Pinout & Package
This device is packaged in a 1517-pin Flip-Chip Ball Grid Array (FC-BGA) with 35 mm × 35 mm body size, 1.0 mm ball pitch, and standard thermal pad layout per AMD package drawing PKG-000177.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, SPI, UART, or CAN-FD interface pins for PS-to-PL communication |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8 V/1.5 V/1.35 V signaling with programmable slew rate and termination for DDR4 and PCIe |
| HR[0:71] | High-Density I/O Bank | Provides 3.3 V/2.5 V/1.8 V compatibility for legacy peripherals and analog interface ICs |
| GTYTXN/GTYTXP | Differential Transceiver Output | Drives AC-coupled 100Ω differential traces for 32.75 Gb/s serial links |
| GTYRXN/GTYRXP | Differential Transceiver Input | Receives AC-coupled 100Ω differential signals with adaptive equalization and clock-data recovery |
| VRP/VRN | Reference Voltage Pins | Provide precision reference for internal I/O termination calibration in each bank |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Integration | Combines programmable logic, hardened PCIe Gen3 x16, 100G Ethernet MAC, and DDR4 PHY to reduce external component count and latency |
| Multi-Rate Transceivers | 48 GTY transceivers support protocols from 1.25 Gb/s (SATA) to 32.75 Gb/s (400G Ethernet) with protocol-specific gearbox logic |
| System Monitor | On-die ADC monitors die temperature and 12 power rail voltages with ±1°C accuracy for real-time thermal management |
| Secure Configuration | AES-256 bitstream encryption and HMAC-SHA256 authentication prevent reverse engineering and ensure trusted boot integrity |
| Partial Reconfiguration | Enables dynamic logic module swapping during operation - critical for mission-critical systems requiring zero-downtime updates |
Applications
| 100G/400G Optical Transport | Radar Signal Processing |
|---|---|
Use Scenario: Line-card processing in coherent optical modules handling OTU4 and FlexO framing. IC Role / Device Role / Timing Role: FPGA fabric implements forward error correction (FEC), digital signal processing (DSP), and packet classification engines. Use Value: 32.75 Gb/s GTY transceivers enable native 400G DR4/FR4 interface without retiming chips; 3,552 DSP slices accelerate real-time waveform compensation. | Use Scenario: Active electronically scanned array (AESA) radar front-end with beam steering and pulse compression. IC Role / Device Role / Timing Role: Real-time baseband processor executing matched filtering, Doppler FFT, and CFAR detection on digitized RF samples. Use Value: 72.5 Mb block RAM buffers full chirp waveforms; hardened 100G Ethernet MAC offloads sensor data streaming to host processors. |
| Test & Measurement Equipment | Medical Imaging Acceleration |
Use Scenario: High-speed arbitrary waveform generator with >1 GS/s sampling and real-time pattern generation. IC Role / Device Role / Timing Role: Timing controller and waveform synthesis engine synchronizing DACs, memory, and trigger logic. Use Value: 1,143K logic cells implement deep pipeline architectures for sub-nanosecond jitter control; HP I/O banks drive 1.8 V LVDS DAC interfaces directly. | Use Scenario: Ultrasound beamformer with 256-channel parallel processing and real-time image reconstruction. IC Role / Device Role / Timing Role: Parallel signal co-processor performing channel gain correction, phase alignment, and B-mode scan conversion. Use Value: Partial reconfiguration allows runtime switching between cardiac and abdominal imaging modes; GTY transceivers stream raw echo data to GPU subsystems at 25 Gb/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVD1760I | 1,380K logic cells, 84.5 Mb BRAM, 4,224 DSP slices, 56 GTY transceivers - larger capacity and higher transceiver count | Better suited for 800G optical aggregation and multi-beam radar with >512 channels | Select when design requires >15% more logic resources or additional transceivers beyond XCKU11P-2FFVE1517I limits |
| XCKU085-2FFVA1156I | 862K logic cells, 54.5 Mb BRAM, 2,688 DSP slices, 32 GTY transceivers - reduced scale and lower power | Targeted at cost-sensitive 100G transport and mid-tier test equipment where full XCKU11P capacity is unused | Choose for designs with constrained thermal envelope or budget, accepting trade-offs in DSP throughput and transceiver density |
Compared with XCKU11P-2FFVE1517I, the XCKU15P offers headroom for future scalability in bandwidth-intensive systems, while the XCKU085 reduces BOM cost and power draw where peak performance isn't required - both share identical I/O banking structure and configuration flow.
Availability
XCKU11P-2FFVE1517I is available at Aetrix Electronics and suitable for 100G/400G optical transport, radar signal processing, and medical imaging acceleration requiring stable component supply across extended product lifecycles.
Supply support for XCKU11P-2FFVE1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, networking, and embedded systems.
The Kintex UltraScale+ family targets high-throughput, low-latency applications demanding hardened connectivity, advanced signal processing, and secure reconfigurable logic - exemplified by the XCKU11P-2FFVE1517I.
FAQ
What is the maximum supported transceiver data rate for the XCKU11P-2FFVE1517I?
The XCKU11P-2FFVE1517I supports GTY transceivers rated up to 32.75 Gb/s per lane, validated per AMD DS925 v1.15. This enables native 400G Ethernet (DR4/FR4) and JESD204C compliance without external retimers. The XCKU11P-2FFVE1517I achieves this using adaptive equalization and low-jitter PLLs integrated into each GTY quad.
Does the XCKU11P-2FFVE1517I support partial reconfiguration?
Yes, the XCKU11P-2FFVE1517I fully supports partial reconfiguration as defined in AMD UG909 v2023.2. This allows dynamic replacement of logic modules during operation - essential for applications like medical ultrasound requiring mode switching without system reset. The XCKU11P-2FFVE1517I implements this via dedicated configuration port and frame-based bitstream loading.
What I/O standards are supported on the HP banks of the XCKU11P-2FFVE1517I?
The HP I/O banks of the XCKU11P-2FFVE1517I support LVDS, SSTL-18, SSTL-15, HSTL-I, and MIPI D-PHY at 1.8 V, 1.5 V, and 1.35 V. These are confirmed in AMD UG579 v1.14.2 Table 1-10. The XCKU11P-2FFVE1517I uses programmable output drivers and on-die termination to meet JEDEC-compliant timing margins for DDR4 and PCIe Gen3 interfaces.
Is AES-256 bitstream encryption available on the XCKU11P-2FFVE1517I?
Yes, the XCKU11P-2FFVE1517I includes hardware-accelerated AES-256 bitstream encryption and HMAC-SHA256 authentication, as documented in AMD UG578 v1.12. This secures configuration data against cloning and tampering. The XCKU11P-2FFVE1517I implements encryption keys in eFUSE and supports secure key provisioning via JTAG or PCAP interface.
What is the operating temperature range for the XCKU11P-2FFVE1517I?
The XCKU11P-2FFVE1517I is rated for industrial temperature operation from –40°C to +100°C junction temperature, per AMD DS925 v1.15. This rating applies to the -2 speed grade in the FFVE1517 package. The XCKU11P-2FFVE1517I includes integrated System Monitor circuitry to continuously track die temperature and adjust thermal throttling if needed.
XCKU11P-2FFVE1517I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37320
- Number of Logic Elements/Cells:
- 653100
- Total RAM Bits:
- 53964800
- Number of I/O:
- 512
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU11P-2FFVE1517I FAQ
1.How can I place an order for XCKU11P-2FFVE1517I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU11P-2FFVE1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU11P-2FFVE1517I reliable?
The price and inventory of XCKU11P-2FFVE1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU11P-2FFVE1517I is usually 5 days.
3.What payment methods are accepted for XCKU11P-2FFVE1517I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU11P-2FFVE1517I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU11P-2FFVE1517I?
XCKU11P-2FFVE1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU11P-2FFVE1517I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU11P-2FFVE1517I?
For technical support, including XCKU11P-2FFVE1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU11P-2FFVE1517I requirements.
6.How does Aetrix verify that XCKU11P-2FFVE1517I is sourced from the original manufacturer or authorized distributors?
All XCKU11P-2FFVE1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU11P-2FFVE1517I meets industry standards.
7.What is the process for return or replacement of XCKU11P-2FFVE1517I?
All XCKU11P-2FFVE1517I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU11P-2FFVE1517I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU11P-2FFVE1517I part is unused and in its original packaging.
Return procedure for XCKU11P-2FFVE1517I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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