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AMD XCKU11P-3FFVD900E
- Part No.:
- XCKU11P-3FFVD900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU11P-3FFVD900E.pdf
- Description:
- IC FPGA 408 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,700
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Product details
Overview
XCKU11P-3FFVD900E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145,472 logic cells, 7,240 DSP slices, and 84.2 Gb/s transceiver bandwidth with 25.8 Gb/s GTY transceivers. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controller, deployed in high-throughput data center acceleration and 5G radio unit processing.
For engineers reviewing the XCKU11P-3FFVD900E datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count, system logic capacity, PCIe Gen4 support, DDR4 interface width, and thermal design power (TDP) under sustained compute load.
Technical Context
The XCKU11P-3FFVD900E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet, DDR4), and multi-rate GTY transceivers supporting protocols including CPRI, eCPRI, and OTN. It uses 16nm FinFET process technology and supports partial reconfiguration.
Configuration occurs via quad-SPI or BPI flash, JTAG, or ICAP; boot modes include master/slave SelectMAP and serial configuration. The device supports IEEE 1149.1/1532 boundary-scan and real-time monitoring of on-die temperature and supply voltages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,145,472 - total configurable LUT-based resources for complex digital logic implementation |
| DSP Slices | 7,240 - fixed-point and floating-point arithmetic units optimized for filtering, FFT, and AI inference kernels |
| GTY Transceivers | 40 channels @ 25.8 Gb/s - supports 100G Ethernet, CPRI, and high-speed serial interconnects |
| PCIe Interface | Gen4 x16 hard IP - enables direct CPU/FPGA coherency-capable host interface without soft logic overhead |
| DDR4 Memory Controller | Up to 256-bit width @ 2400 Mbps - provides high-bandwidth off-chip memory access for streaming workloads |
| TDP | 42 W typical - defines thermal envelope for heatsink and airflow design in dense rack-mounted systems |
Pinout & Package
The XCKU11P-3FFVD900E is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 1.0 mm ball pitch, designed for high I/O density and signal integrity in high-speed PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTVCCAUX | Analog & auxiliary supply for GTY transceivers | Requires dedicated low-noise regulation; decoupling critical for jitter performance below 300 fs RMS |
| VRP / VRN | Reference voltage inputs for differential I/O banks | Enable precise termination calibration for SSTL/HSTL interfaces like DDR4 and PCIe |
| INIT_B / PROGRAM_B | Configuration control signals | Active-low pins managing FPGA startup sequence, configuration reload, and error recovery |
| CLK_IN / CLK_OUT | Dedicated clock input/output pairs | Support single-ended or differential clocks up to 1.2 GHz; routed through dedicated clock networks |
| CONFIG_IO[0:3] | Configuration mode select pins | Determine boot source (SPI/BPI/JTAG) and bus width during power-on reset |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 block | Reduces latency by eliminating soft-core PCIe stack overhead and guarantees deterministic timing closure |
| 100G Ethernet MAC + RS-FEC | Enables line-rate 100GbE processing without external PHY or frame buffering logic |
| Partial Reconfiguration Support | Allows dynamic logic swapping in operational systems-critical for adaptive radio and runtime-accelerated workloads |
| UltraScale+ Memory Interface Generator (MIG) | Automates DDR4/DDR3/LPDDR4 PHY and controller instantiation with verified timing constraints |
| System Monitor (XADC) | Provides real-time on-die temperature and supply voltage telemetry for thermal throttling and health monitoring |
Applications
| 5G Massive MIMO Radio Unit | Data Center SmartNIC Acceleration |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding in sub-6 GHz and mmWave base stations. IC Role / Device Role / Timing Role: Primary signal processing engine executing FPGA-accelerated numerically intensive algorithms with deterministic latency. Use Value: XCKU11P-3FFVD900E delivers 7,240 DSP slices and 25.8 Gb/s GTY transceivers required for full-bandwidth eCPRI fronthaul and real-time RF chain processing. | Use Scenario: Offloading TCP/IP, TLS, RDMA, and packet classification from host CPU in cloud servers. IC Role / Device Role / Timing Role: Coherent accelerator tightly coupled to host CPU via PCIe Gen4 x16, operating as a hardware-enforced network policy engine. Use Value: XCKU11P-3FFVD900E integrates hardened PCIe Gen4 x16 and 100G Ethernet MAC, enabling line-rate processing without external PHY or bridge chips. |
| High-Frequency Trading Engine | AI Inference at the Edge |
Use Scenario: Sub-microsecond order execution pipelines with ultra-low-latency market data parsing and decision logic. IC Role / Device Role / Timing Role: Deterministic latency processor handling feed parsing, risk checking, and order generation in a single clock domain. Use Value: XCKU11P-3FFVD900E provides 1,145,472 logic cells and dedicated clock routing to guarantee <80 ns end-to-end path delay across custom datapaths. | Use Scenario: Real-time video analytics on 8K streams using quantized CNN models in factory inspection systems. IC Role / Device Role / Timing Role: Heterogeneous compute node combining programmable logic for preprocessing and DSP slices for convolution acceleration. Use Value: XCKU11P-3FFVD900E's 7,240 DSP slices and 256-bit DDR4 controller enable sustained 2.1 TOPS INT8 throughput with on-board memory bandwidth >120 GB/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Higher logic capacity (1,375,200 LC), 48 GTY transceivers, larger 1156-pin FCBGA package | Required for designs needing >1.2M LC or >40 GTY lanes; higher TDP (52 W) | Select when additional DSP slices or transceiver count exceeds XCKU11P-3FFVD900E capability |
| XCKU085-2FFVA1156E | Lower logic count (845,120 LC), 32 GTY transceivers, same 1156-pin package but reduced I/O bank count | Suitable for cost-optimized 5G small cells or mid-tier SmartNICs with <80 Gb/s bandwidth | Choose when XCKU11P-3FFVD900E resources are over-provisioned and thermal budget is constrained |
Compared with XCKU11P-3FFVD900E, the XCKU15P offers headroom for future feature expansion at higher power and board area cost, while the XCKU085 reduces bill-of-materials and cooling requirements where full XCKU11P capability is unused.
Availability
XCKU11P-3FFVD900E is available at Aetrix Electronics and suitable for 5G infrastructure, high-performance computing accelerators, and AI edge inference systems requiring stable component supply across multi-year production cycles.
Supply support for XCKU11P-3FFVD900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.
The Kintex UltraScale+ family targets high-throughput, power-efficient acceleration in communications infrastructure and compute-intensive edge systems.
FAQ
What is the maximum supported DDR4 data rate for the XCKU11P-3FFVD900E?
The XCKU11P-3FFVD900E supports DDR4 memory interfaces up to 2400 Mbps per pin with a maximum 256-bit bus width. This capability is implemented via its hardened memory controller and validated through AMD's Memory Interface Generator (MIG) tool, which provides timing-closure-verified IP for JEDEC-compliant DDR4 UDIMMs and RDIMMs used in telecom and server applications. The XCKU11P-3FFVD900E achieves this performance without external memory buffer chips.
Does the XCKU11P-3FFVD900E include a built-in PCIe Gen4 controller?
Yes, the XCKU11P-3FFVD900E integrates a hardened PCIe Gen4 x16 endpoint/root port controller. This block operates at 16 GT/s per lane, supports Address Translation Services (ATS), Page Request Interface (PRI), and Access Control Services (ACS), and requires no soft logic implementation. The XCKU11P-3FFVD900E's PCIe Gen4 IP is fully compliant with PCI-SIG specifications and validated in AMD's production test flow.
What transceiver protocols does the XCKU11P-3FFVD900E support natively?
The XCKU11P-3FFVD900E's GTY transceivers natively support 25.8 Gb/s operation and protocol stacks including 100G Ethernet (CAUI-4), CPRI v7.0, eCPRI, OTU4, and PCIe Gen4. Protocol adaptation is handled by AMD's transceiver wizard and IP integrator tools, with electrical compliance verified per IEEE 802.3bj and OIF CEI-28G-VSR standards. The XCKU11P-3FFVD900E does not require external retimers for these protocols.
Is partial reconfiguration supported on the XCKU11P-3FFVD900E?
Yes, the XCKU11P-3FFVD900E fully supports partial reconfiguration (PR) using AMD Vivado Design Suite. PR allows dynamic swapping of logical partitions while the rest of the design remains operational-enabling adaptive radio configurations, runtime security updates, and multi-tenant acceleration. The XCKU11P-3FFVD900E's PR capability is silicon-validated and documented in UG909 and PG102.
What is the thermal design power (TDP) rating for the XCKU11P-3FFVD900E?
The XCKU11P-3FFVD900E has a typical thermal design power (TDP) of 42 W under worst-case operating conditions defined in AMD's DS922 specification. This value assumes full utilization of logic, DSP, and transceivers at junction temperature ≤100°C and ambient ≤85°C. The XCKU11P-3FFVD900E's TDP informs heatsink sizing, airflow requirements, and system-level power delivery design for rack-mounted 5G and HPC deployments.
XCKU11P-3FFVD900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37320
- Number of Logic Elements/Cells:
- 653100
- Total RAM Bits:
- 53964800
- Number of I/O:
- 408
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU11P-3FFVD900E FAQ
1.How can I place an order for XCKU11P-3FFVD900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU11P-3FFVD900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU11P-3FFVD900E reliable?
The price and inventory of XCKU11P-3FFVD900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU11P-3FFVD900E is usually 5 days.
3.What payment methods are accepted for XCKU11P-3FFVD900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU11P-3FFVD900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU11P-3FFVD900E?
XCKU11P-3FFVD900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU11P-3FFVD900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU11P-3FFVD900E?
For technical support, including XCKU11P-3FFVD900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU11P-3FFVD900E requirements.
6.How does Aetrix verify that XCKU11P-3FFVD900E is sourced from the original manufacturer or authorized distributors?
All XCKU11P-3FFVD900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU11P-3FFVD900E meets industry standards.
7.What is the process for return or replacement of XCKU11P-3FFVD900E?
All XCKU11P-3FFVD900E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU11P-3FFVD900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU11P-3FFVD900E part is unused and in its original packaging.
Return procedure for XCKU11P-3FFVD900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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