AMD XCKU11P-3FFVE1517E

Overview

XCKU11P-3FFVE1517E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145,472 logic cells, 7,240 DSP slices, and 84.2 Gb/s transceiver bandwidth with 25.8 Gbps GTY transceivers. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controller, deployed in high-throughput data center acceleration and 5G radio unit baseband processing.

For engineers reviewing the XCKU11P-3FFVE1517E datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count, bank voltage flexibility (1.2 V/1.35 V/1.8 V), PCIe Gen4 root port support, and thermal design power of 49 W under typical configuration.

Technical Context

The XCKU11P-3FFVE1517E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including dual 100G Ethernet MACs and quad 25G Ethernet PCS/PMA, and configurable I/O banks supporting MIPI D-PHY, LPDDR4, and SATA. Its UltraScale+ architecture enables time-critical deterministic latency paths for real-time signal processing.

It supports partial reconfiguration, AXI4-Stream interconnect, and integrated system monitoring via on-die temperature and supply sensors. Configuration occurs via Quad-SPI, BPI, or JTAG, with bitstream encryption using AES-256 and HMAC authentication.

Key Specifications

Pinout & Package

This device is housed in a 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via central thermal ball array.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU11P-3FFVE1517E, the XCKU15P offers higher throughput at increased power and board area, while the XCKU085 reduces cost and thermal load at the expense of transceiver count and logic capacity-selection depends on precise bandwidth, compute, and form factor constraints.

Availability

XCKU11P-3FFVE1517E is available at Aetrix Electronics and suitable for 5G infrastructure, data center acceleration, and radar signal processing applications requiring stable component supply across multi-year production cycles.

Supply support for XCKU11P-3FFVE1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, networking, and embedded systems.

The Kintex UltraScale+ family targets high-performance, cost-optimized applications demanding hardened connectivity, high DSP density, and flexible I/O for 5G, smart NICs, and real-time signal processing.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCKU11P-3FFVE1517E?

The XCKU11P-3FFVE1517E supports GTY transceivers up to 25.8 Gbps per lane. This rate is validated for protocols including PCIe Gen4, 100G KR4, and CPRI/eCPRI. The transceiver architecture includes adaptive equalization and clock data recovery optimized for backplane and optical module interfaces. XCKU11P-3FFVE1517E achieves this performance across commercial temperature range with proper PCB stackup and power integrity.

Does the XCKU11P-3FFVE1517E include hardened PCIe Gen4 support?

Yes, the XCKU11P-3FFVE1517E integrates a hardened PCIe Gen4 x16 root port block. It complies with PCI Express Base Specification Revision 4.0 and supports ASPM L0s/L1 power states. The block handles link training, transaction layer packet routing, and MSI-X interrupt delivery without consuming programmable logic resources. XCKU11P-3FFVE1517E enables direct CPU-FPGA communication at up to 16 GT/s per lane.

What memory interfaces are natively supported by the XCKU11P-3FFVE1517E?

The XCKU11P-3FFVE1517E includes a hardened DDR4 memory controller supporting 64-bit wide interfaces at up to 2400 MT/s. It also supports LPDDR4 (4266 Mbps), QDR-IV SRAM, and RLDRAM3 through programmable I/O banks. Memory calibration and refresh are handled automatically by the controller IP. XCKU11P-3FFVE1517E's I/O banks support 1.2 V, 1.35 V, and 1.8 V signaling to match these memory standards.

Can the XCKU11P-3FFVE1517E perform partial reconfiguration?

Yes, the XCKU11P-3FFVE1517E supports runtime partial reconfiguration of designated logic regions without resetting the entire device. This capability is implemented in hardware and managed via ICAP and FRAME_ECC primitives. Use cases include dynamic function switching in 5G RUs and adaptive radar waveform updates. XCKU11P-3FFVE1517E maintains active I/O and transceiver operation during reconfiguration of non-overlapping partitions.

What security features are built into the XCKU11P-3FFVE1517E?

The XCKU11P-3FFVE1517E includes AES-256 bitstream encryption, HMAC-SHA256 authentication, and RSA-4096 public-key boot. Bitstream decryption occurs in dedicated hardware before configuration, preventing exposure of plaintext design. Secure debug access is enforced via JTAG lockdown and eFUSE-based key provisioning. XCKU11P-3FFVE1517E supports secure field updates and anti-tamper monitoring using on-die sensors.