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AMD XCKU11P-L1FFVD900I
- Part No.:
- XCKU11P-L1FFVD900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU11P-L1FFVD900I.pdf
- Description:
- IC FPGA 408 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,130
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Product details
Overview
XCKU11P-L1FFVD900I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145K logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s GTY transceivers. It is deployed in 5G radio units, high-throughput data acquisition systems, and real-time radar processing where deterministic latency and multi-protocol I/O are critical.
For engineers reviewing the XCKU11P-L1FFVD900I datasheet, pinout, applications, or equivalent options, key selection factors include GTY transceiver count (32), I/O bank voltage flexibility (1.2 V to 1.8 V), thermal design power (145 W typical), and package-specific I/O count (520 user I/Os).
Technical Context
The XCKU11P-L1FFVD900I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 Root Port/Endpoint, 100G Ethernet MAC, and integrated ARM Cortex-R5F processors for real-time control. It supports partial reconfiguration and dynamic function exchange for adaptive system operation.
It uses 16 nm FinFET process technology, delivers up to 2.5 TMAC/s DSP performance, and includes dedicated memory controllers for DDR4, LPDDR4, and RLDRAM3 with ECC support on all memory interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,145,280 - total configurable LUTs + flip-flops for complex digital logic implementation |
| Block RAM | 72.5 Mb - distributed across 2,160 BRAM primitives supporting true dual-port access |
| GTY Transceivers | 32 × 25.8 Gb/s - enables 100G Ethernet, CPRI/eCPRI, and JESD204C interface deployment |
| User I/O Pins | 520 - compatible with LVCMOS, SSTL, HSTL, and differential standards across 24 I/O banks |
| Memory Interface | DDR4-2400 / LPDDR4-4266 - integrated controller with 128-bit bus width and on-die termination |
| Thermal Design Power | 145 W (typical) - requires active cooling and thermal interface material per AMD UG578 guidelines |
Pinout & Package
This device is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V ±3% to FPGA fabric and CLB logic; requires low-noise regulation |
| VCCAUX | Auxiliary supply rail | Provides 1.8 V to configuration logic, SelectIO banks, and transceiver reference circuitry |
| MGTAVCC | Transceiver analog supply | Delivers 0.95 V ±2% to GTY analog circuitry; isolated from digital supplies |
| CLK_IN_0 | Dedicated clock input | Accepts single-ended or differential reference clocks up to 1.2 GHz for MMCM/PLL locking |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 Hard IP | Integrated root port and endpoint blocks supporting x1/x2/x4/x8/x16 link widths with AXI4 streaming interface |
| 100G Ethernet MAC | Hardened 100Gbps MAC with RS-FEC and CRC-32 offload, reducing soft logic resource usage by ~45% |
| ARM Cortex-R5F Dual Core | Lockstep-capable real-time processors running at 600 MHz, accessible via AXI GP/HP ports for embedded control |
| Partial Reconfiguration | Enables dynamic logic swapping without full device reset; supported in Vivado 2022.2+ with verified timing closure flow |
| UltraScale+ Memory Controller | Single controller supporting DDR4, LPDDR4, and RLDRAM3 with automatic calibration and ECC generation/detection |
Applications
| 5G Massive MIMO Radio Unit | High-Speed Data Acquisition System |
|---|---|
Use Scenario: Real-time beamforming and channel estimation in sub-6 GHz and mmWave base stations. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency FFT, CORDIC, and matrix inversion kernels; GTY transceivers interface with RFICs via JESD204C. Use Value: 25.8 Gb/s GTY links reduce interconnect complexity versus parallel LVDS; hardened 100G MAC handles fronthaul traffic without soft IP overhead. | Use Scenario: Multi-channel oscilloscope capturing 16-bit samples at 1 GS/s across 32 channels. IC Role / Device Role / Timing Role: XCKU11P-L1FFVD900I processes time-aligned ADC streams, performs real-time FFT and peak detection, and buffers results to DDR4. Use Value: 72.5 Mb block RAM enables 256 MSample deep capture buffer; PCIe Gen4 x16 provides 16 GB/s host transfer bandwidth. |
| Automotive ADAS Radar Processor | AI Accelerator Co-Processor |
Use Scenario: FMCW radar signal processing for 4D imaging radar with 192 virtual antenna channels. IC Role / Device Role / Timing Role: Configurable logic implements range-Doppler FFT, CFAR detection, and clustering; ARM R5F cores manage sensor fusion and CAN FD communication. Use Value: Deterministic 10 ns interrupt latency ensures timely response to safety-critical events; DDR4-2400 interface feeds point cloud data to host processor. | Use Scenario: Offloading convolution and quantization operations from CPU/GPU in edge inference servers. IC Role / Device Role / Timing Role: DSP slices execute INT8/FP16 multiply-accumulate; AXI-Stream interfaces connect to host SoC over PCIe Gen4. Use Value: 2.5 TMAC/s peak compute throughput exceeds GPU-based inference latency targets for LIDAR pre-processing workloads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-L1FFVA1156E | Higher logic capacity (1,375K LC), 40 GTY transceivers, 1156-ball package, lower max junction temp (100°C) | Supports larger 100G+ packet processing pipelines and higher-density SerDes aggregation | Select when >1.2M logic cells or >32 GTY lanes are required; verify PCB redesign for FFVA1156 footprint |
| XCKU085-L1FFVA1156I | Fewer logic cells (845K), 24 GTY transceivers, same 1156-ball package, industrial temp grade | Suitable for cost-optimized 25G/40G line cards and mid-tier radar subsystems | Choose for thermal-constrained industrial environments where 520 I/O and 32 GTY lanes exceed requirements |
Compared with XCKU11P-L1FFVD900I, the XCKU15P offers higher density and SerDes count at the cost of increased power and board space, while the XCKU085 reduces logic and transceiver resources to meet industrial temperature and cost targets without changing package compatibility.
Availability
XCKU11P-L1FFVD900I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-performance test equipment requiring stable component supply across extended product lifecycles.
Supply support for XCKU11P-L1FFVD900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, and GPU technologies.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in communications, defense, and instrumentation where hardened IP, memory bandwidth, and thermal efficiency are prioritized over maximum logic density.
FAQ
What is the maximum operating junction temperature for XCKU11P-L1FFVD900I?
The XCKU11P-L1FFVD900I has a maximum junction temperature rating of 100°C under industrial temperature grade specifications. Thermal design must ensure sustained operation within this limit using validated heatsink and airflow models per AMD UG578. The XCKU11P-L1FFVD900I datasheet defines derating curves for ambient temperature and power dissipation above 85°C ambient.
Does XCKU11P-L1FFVD900I support JESD204C protocol natively?
Yes, the XCKU11P-L1FFVD900I supports JESD204C through its GTY transceivers, enabling 12.9–25.8 Gb/s lane rates with deterministic latency and subclass 1 synchronization. The XCKU11P-L1FFVD900I requires configuration of GTY TX/RX PMA settings and use of AMD's JESD204C IP core in Vivado 2022.1 or later for full compliance.
How many PCIe Gen4 lanes does XCKU11P-L1FFVD900I support simultaneously?
The XCKU11P-L1FFVD900I supports up to 16 PCIe Gen4 lanes in x16 configuration, or flexible partitioning into x8+x8, x8+x4+x4, or other combinations using the hardened PCIe Gen4 block. The XCKU11P-L1FFVD900I achieves full 16 GT/s per lane with end-to-end link training and LTSSM compliance verified per PCI-SIG CEM 5.0 specification.
Is partial reconfiguration supported on XCKU11P-L1FFVD900I?
Yes, partial reconfiguration is fully supported on XCKU11P-L1FFVD900I using Vivado's PR flow with checkpoint-based implementation. The XCKU11P-L1FFVD900I allows dynamic swapping of logical partitions without resetting the entire device, provided timing closure is achieved for both static and reconfigurable regions per UG909 guidelines.
What memory interfaces are integrated into XCKU11P-L1FFVD900I?
The XCKU11P-L1FFVD900I integrates hard memory controllers for DDR4-2400 (up to 256-bit), LPDDR4-4266 (up to 128-bit), and RLDRAM3-2133 (up to 72-bit), all with on-die termination and ECC support. The XCKU11P-L1FFVD900I memory controller IP is delivered as parameterizable RTL with AXI4 interface and calibration firmware included in Vivado.
XCKU11P-L1FFVD900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37320
- Number of Logic Elements/Cells:
- 653100
- Total RAM Bits:
- 53964800
- Number of I/O:
- 408
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU11P-L1FFVD900I FAQ
1.How can I place an order for XCKU11P-L1FFVD900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU11P-L1FFVD900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU11P-L1FFVD900I reliable?
The price and inventory of XCKU11P-L1FFVD900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU11P-L1FFVD900I is usually 5 days.
3.What payment methods are accepted for XCKU11P-L1FFVD900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU11P-L1FFVD900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU11P-L1FFVD900I?
XCKU11P-L1FFVD900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU11P-L1FFVD900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU11P-L1FFVD900I?
For technical support, including XCKU11P-L1FFVD900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU11P-L1FFVD900I requirements.
6.How does Aetrix verify that XCKU11P-L1FFVD900I is sourced from the original manufacturer or authorized distributors?
All XCKU11P-L1FFVD900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU11P-L1FFVD900I meets industry standards.
7.What is the process for return or replacement of XCKU11P-L1FFVD900I?
All XCKU11P-L1FFVD900I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU11P-L1FFVD900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU11P-L1FFVD900I part is unused and in its original packaging.
Return procedure for XCKU11P-L1FFVD900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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