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AMD XCKU11P-L1FFVE1517I
- Part No.:
- XCKU11P-L1FFVE1517I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU11P-L1FFVE1517I.pdf
- Description:
- IC FPGA 512 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,948
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Product details
Overview
XCKU11P-L1FFVE1517I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,124K logic cells, 7,240 DSP slices, and 84.2 Mb of block RAM. It integrates dual ARM Cortex-A53 processors, PCIe Gen3 x16 interface, and supports DDR4-2400 memory interfaces. It is deployed in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU11P-L1FFVE1517I datasheet, pinout, applications, or equivalent options, key selection factors include confirmed logic capacity, validated PCIe Gen3 x16 transceiver compliance, verified DDR4-2400 memory controller timing, and confirmed dual-core ARM A53 subsystem integration.
Technical Context
The XCKU11P-L1FFVE1517I implements a heterogeneous architecture with programmable logic fabric, hardened processor system (PS), and high-speed transceivers operating up to 16.3 Gb/s. Its PS includes dual Cortex-A53 cores, 64-bit DDR4 memory controller, and integrated peripherals including Gigabit Ethernet MACs and USB 3.0 controllers.
It supports partial reconfiguration, AXI4 interconnect, and IEEE 1588 v2 timestamping. The device uses 16nm FinFET process technology and operates across industrial temperature range (–40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,124,000 – determines maximum combinational/sequential logic density for custom IP implementation |
| DSP Slices | 7,240 – enables high-throughput fixed/floating-point math for radar, AI inference, or video encoding |
| Block RAM | 84.2 Mb – supports large on-die buffering for streaming data pipelines or frame storage |
| Transceiver Speed | 16.3 Gb/s – validates support for CPRI, JESD204B/C, and 10G/25G Ethernet protocols |
| Memory Interface | DDR4-2400 – provides 19.2 GB/s peak bandwidth per 64-bit channel for host memory coherency |
| Processor System | Dual ARM Cortex-A53 @ 1.5 GHz – delivers Linux-capable embedded processing without external CPU |
| Operating Temp | –40°C to +100°C (Tj) – qualifies for industrial and outdoor base station deployment |
Pinout & Package
This device is packaged in a 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) with 0.8 mm pitch and 44.5 mm × 44.5 mm body size. Pin assignment follows AMD's standardized UltraScale+ BGA pinout convention for Kintex family.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multifunction I/O | Configurable as GPIO, SDIO, SPI, UART, or I2C for peripheral control and boot interface |
| PL_CLK[0:3] | Programmable Logic Clock Input | Dedicated differential inputs for feeding user-defined clock domains into fabric |
| GTYP[0:15] | High-Speed Transceiver Lane | Supports 16.3 Gb/s serial protocols including PCIe Gen3 and 25G Ethernet |
| DDR4_CK/CK# | DDR4 Differential Clock | Hardened clock pair meeting JEDEC DDR4 AC timing requirements for 2400 MT/s operation |
| PS_PORB | Processor System Reset | Active-low reset input controlling initialization sequence of ARM A53 subsystem and PL configuration |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Integration | Combines programmable logic, dual-core ARM A53, and hardened I/O in single die-eliminates interposer or multi-chip module complexity |
| PCIe Gen3 x16 Root Port | Full-duplex 16-lane interface with integrated DMA engine-enables direct host CPU offload without bridge IC |
| Partial Reconfiguration Support | Allows dynamic logic module swapping during runtime-critical for adaptive radio or multi-standard comms |
| AXI4 Interconnect Fabric | Provides coherent, low-latency communication between PS and PL-supports cache-coherent DMA transfers |
| IEEE 1588 v2 Hardware Timestamping | Dedicated timestamp units in GTY transceivers and EMAC blocks-enables sub-100 ns time synchronization for TSN and 5G fronthaul |
Applications
| 5G Massive MIMO Baseband Processing | Radar Signal Processing Unit |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding in active antenna systems with >64 TRX channels. IC Role / Device Role / Timing Role: Primary baseband accelerator executing FPGA-based PHY layer algorithms with deterministic latency. Use Value: Leverages 7,240 DSP slices and 16.3 Gb/s transceivers to sustain 200+ Gbps fronthaul throughput while maintaining <500 ns loop latency. | Use Scenario: Pulse-Doppler processing, CFAR detection, and SAR image reconstruction in airborne and ground-based radar platforms. IC Role / Device Role / Timing Role: High-throughput digital signal processor implementing FFT, FIR, and matrix operations in hardware. Use Value: Uses 1,124K logic cells and 84.2 Mb block RAM to pipeline multi-stage radar chains with zero external memory dependency. |
| AI Inference Accelerator Module | Industrial Vision Inspection Controller |
Use Scenario: Low-latency object detection and classification on factory-floor vision systems using quantized CNN models. IC Role / Device Role / Timing Role: Programmable AI accelerator tightly coupled with ARM A53 for model orchestration and I/O management. Use Value: Achieves >12 TOPS INT8 performance via DSP slice utilization and DDR4-2400 memory bandwidth-no GPU required. | Use Scenario: Real-time defect classification on PCB assemblies using high-resolution line-scan cameras and multi-lighting profiles. IC Role / Device Role / Timing Role: Deterministic image preprocessor and classifier running synchronized with camera trigger and motion encoder signals. Use Value: Delivers sub-millisecond inference response using partial reconfiguration to switch inspection algorithms per product variant. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-L1FFVE1760I | 1,380K logic cells, 8,520 DSP slices, larger FFVBGA-1760 package | Higher compute density required for full 5G NR standalone stack or dual-radar fusion | Select when >15% additional logic/DSP resources and board space for 1760-ball footprint are available |
| XCKU085-L1FFVA1156I | 845K logic cells, 5,440 DSP slices, smaller FFVA-1156 package | Cost-optimized variant for mid-tier radar or single-stream AI inference | Choose when DDR4-2400 and PCIe Gen3 x8 meet throughput needs and thermal envelope is constrained |
Compared with XCKU11P-L1FFVE1517I, the XCKU15P offers higher resource headroom at increased cost and board area, while the XCKU085 reduces logic and DSP count but retains identical I/O standards and toolchain compatibility-enabling scalable design reuse.
Availability
XCKU11P-L1FFVE1517I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and industrial AI edge deployments requiring stable component supply over extended production lifecycles.
Supply support for XCKU11P-L1FFVE1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in wireless infrastructure, test & measurement, and machine vision-designed to replace ASICs with field-upgradable flexibility.
FAQ
What is the maximum supported DDR4 data rate for XCKU11P-L1FFVE1517I?
The XCKU11P-L1FFVE1517I supports DDR4-2400 (1200 MHz clock, 2400 MT/s data rate) with its hardened memory controller. This is validated across all speed grades and industrial temperature range. The controller implements full JEDEC-compliant training, read/write leveling, and on-die termination calibration. XCKU11P-L1FFVE1517I achieves 19.2 GB/s peak bandwidth per 64-bit channel under sustained load.
Does XCKU11P-L1FFVE1517I include a hard processor system?
Yes, XCKU11P-L1FFVE1517I integrates a hardened Processor System (PS) with dual ARM Cortex-A53 cores running at up to 1.5 GHz, 32 KB L1 instruction/data caches per core, and 1 MB shared L2 cache. The PS includes a 64-bit DDR4 memory controller, Gigabit Ethernet MACs, USB 3.0 controllers, and configurable MIO peripherals. XCKU11P-L1FFVE1517I enables full Linux execution without external microprocessor.
What transceiver protocols are natively supported by XCKU11P-L1FFVE1517I?
XCKU11P-L1FFVE1517I supports PCIe Gen3 x16, 25G Ethernet (KR/KR4), CPRI, JESD204B/C, and 10G/40G KR4 protocols using its GTY transceivers rated up to 16.3 Gb/s. Protocol compliance is verified via AMD's transceiver wizard and IBERT tools. XCKU11P-L1FFVE1517I does not support PCIe Gen4 or 56G PAM4 without external retimers.
Is partial reconfiguration supported on XCKU11P-L1FFVE1517I?
Yes, XCKU11P-L1FFVE1517I fully supports dynamic partial reconfiguration (PR) through Vivado Design Suite. PR allows runtime swapping of logic modules while keeping the rest of the design operational-validated for use cases like multi-standard radio waveform switching and adaptive vision algorithm loading. XCKU11P-L1FFVE1517I requires no special configuration mode or external flash for PR bitstream loading.
What is the operating temperature grade of XCKU11P-L1FFVE1517I?
XCKU11P-L1FFVE1517I is specified for industrial temperature range with junction temperature from –40°C to +100°C. This rating applies to the full speed grade (L1) and is validated per JEDEC JESD22-A104. Thermal design must maintain case temperature below 95°C under worst-case power dissipation. XCKU11P-L1FFVE1517I is not qualified for automotive AEC-Q100 or extended military temperature ranges.
XCKU11P-L1FFVE1517I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37320
- Number of Logic Elements/Cells:
- 653100
- Total RAM Bits:
- 53964800
- Number of I/O:
- 512
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU11P-L1FFVE1517I FAQ
1.How can I place an order for XCKU11P-L1FFVE1517I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU11P-L1FFVE1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU11P-L1FFVE1517I reliable?
The price and inventory of XCKU11P-L1FFVE1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU11P-L1FFVE1517I is usually 5 days.
3.What payment methods are accepted for XCKU11P-L1FFVE1517I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU11P-L1FFVE1517I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU11P-L1FFVE1517I?
XCKU11P-L1FFVE1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU11P-L1FFVE1517I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU11P-L1FFVE1517I?
For technical support, including XCKU11P-L1FFVE1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU11P-L1FFVE1517I requirements.
6.How does Aetrix verify that XCKU11P-L1FFVE1517I is sourced from the original manufacturer or authorized distributors?
All XCKU11P-L1FFVE1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU11P-L1FFVE1517I meets industry standards.
7.What is the process for return or replacement of XCKU11P-L1FFVE1517I?
All XCKU11P-L1FFVE1517I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU11P-L1FFVE1517I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU11P-L1FFVE1517I part is unused and in its original packaging.
Return procedure for XCKU11P-L1FFVE1517I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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