AMD XCKU11P-L2FFVE1517E

Overview

XCKU11P-L2FFVE1517E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,143K logic cells, 7,225 DSP slices, and 84.2 Mb of block RAM. It integrates dual ARM Cortex-A53 processors, PCIe Gen3 x16 interface, and 24 transceivers supporting up to 32.75 Gb/s for high-speed serial connectivity. It is deployed in 5G radio units and radar signal processing systems requiring deterministic low-latency compute.

For engineers reviewing the XCKU11P-L2FFVE1517E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, integrated processor subsystem availability, PCIe Gen3 support, and thermal envelope for air-cooled RF front-end deployments.

Technical Context

The XCKU11P-L2FFVE1517E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, DDR4 PHY, 10/25/100G Ethernet MAC), and a dual-core ARM Cortex-A53 application processing unit running at up to 1.5 GHz. It supports DDR4-2400 memory interfaces with ECC and includes 24 GTY transceivers with PAM4 capability.

Its L2 speed grade (-2) guarantees operation at junction temperatures up to 100°C and supports static timing analysis with 0.5 ns clock uncertainty margin. The FFVE1517 package provides 1,517 I/O pins in flip-chip BGA with 0.8 mm pitch and thermal lid for enhanced heat dissipation.

Key Specifications

Pinout & Package

The XCKU11P-L2FFVE1517E is housed in a 1517-pin flip-chip BGA (FFVE1517) with 0.8 mm pitch, thermal lid, and I/O banks organized into HR, HP, and VR banks supporting multiple voltage standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU11P-L2FFVE1517E, the XCKU15P offers higher transceiver and logic capacity for scalable radar front-ends, while the XCKU085 reduces thermal load and PCB area for compact 5G O-RAN deployments-both maintain identical -2 speed grade and ARM processor subsystem compatibility.

Availability

XCKU11P-L2FFVE1517E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-speed test instrumentation requiring stable component supply across extended product lifecycles.

Supply support for XCKU11P-L2FFVE1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, and GPU technologies.

The Kintex UltraScale+ family targets high-performance, cost-sensitive applications demanding hardened I/O, high-bandwidth memory, and integrated processing-especially in wireless infrastructure and defense electronics.

FAQ

What is the maximum supported DDR4 data rate for XCKU11P-L2FFVE1517E?

The XCKU11P-L2FFVE1517E supports DDR4-2400 (1200 MHz clock) with 16-bit or 32-bit interfaces, including on-die termination calibration and ECC support. Its memory controller implements AXI4 interface and dynamic write leveling to maintain signal integrity across temperature ranges. XCKU11P-L2FFVE1517E achieves stable operation with JEDEC-compliant DDR4 modules under 100°C junction conditions.

Does XCKU11P-L2FFVE1517E include a hardened PCIe Gen3 controller?

Yes, XCKU11P-L2FFVE1517E integrates a hardened PCIe Gen3 x16 endpoint/root port controller with full link training, ASPM power management, and completion timeout handling. It does not require soft IP implementation, reducing logic utilization and ensuring deterministic latency below 100 ns for DMA transactions. XCKU11P-L2FFVE1517E supports both endpoint and root complex configurations per configuration mode pins.

What transceiver standards are supported by the GTY transceivers in XCKU11P-L2FFVE1517E?

The 24 GTY transceivers in XCKU11P-L2FFVE1517E support NRZ and PAM4 signaling up to 32.75 Gb/s per lane, enabling compliance with 100G Ethernet (IEEE 802.3cd), CPRI v7.0, eCPRI, JESD204B/C, SATA III, and 10G/25G/100G KR/KR4 protocols. XCKU11P-L2FFVE1517E includes built-in PRBS generators, eye diagram monitors, and adaptive equalization for each lane.

Can XCKU11P-L2FFVE1517E operate in industrial temperature range?

Yes, XCKU11P-L2FFVE1517E is rated for industrial temperature range (–40°C to +100°C junction). Its L2 speed grade is validated for timing closure and functional operation across this range, with thermal lid and FFVE1517 package optimized for conduction cooling in sealed RF enclosures. XCKU11P-L2FFVE1517E meets JEDEC JESD22-A104 reliability testing requirements.

Is the ARM Cortex-A53 subsystem in XCKU11P-L2FFVE1517E capable of running Linux?

Yes, the dual-core ARM Cortex-A53 subsystem in XCKU11P-L2FFVE1517E supports full Linux distributions (e.g., Petalinux, Yocto) with MMU, cache coherency, and peripheral drivers for UART, I2C, SPI, SDIO, and USB. XCKU11P-L2FFVE1517E includes dedicated PS DDR controller and interrupt routing to enable symmetric multiprocessing and real-time scheduling alongside PL-accelerated tasks.