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AMD XCKU13P-1FFVE900E
- Part No.:
- XCKU13P-1FFVE900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU13P-1FFVE900E.pdf
- Description:
- IC FPGA 304 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,741
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Product details
Overview
XCKU13P-1FFVE900E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145K logic cells, 72.5 Mb of block RAM, and 840 DSP slices. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in high-bandwidth data center acceleration and 5G radio unit designs.
For engineers reviewing the XCKU13P-1FFVE900E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O voltage support (1.2V/1.35V/1.8V), thermal design power (24W typical), and package-compatible migration paths within the Kintex UltraScale+ family.
Technical Context
The XCKU13P-1FFVE900E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, plus integrated ADCs for system monitoring. Its UltraScale+ architecture uses 16nm FinFET process technology and supports partial reconfiguration.
It delivers deterministic latency for real-time signal processing via dedicated clock routing networks and supports JTAG, SelectMAP, and Quad-SPI configuration modes. The device includes dual-core ARM Cortex-A53 processor subsystems only in Zynq UltraScale+ MPSoC variants - not present in this Kintex-family part.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,145,280 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| Block RAM | 72.5 Mb - enables large on-die buffering for packet processing, video frame storage, or FFT coefficient tables |
| DSP Slices | 840 - supports parallel multiply-accumulate operations at up to 10.5 TMAC/s for AI inference acceleration |
| Transceivers | 40 × 25.78125 Gb/s - provides native support for CPRI/eCPRI, 100G KR4, and PCIe Gen4 x16 interconnect |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - allows direct interfacing with DDR4, QSFP28, and sensor front-ends |
| Package | FFVE900 - 900-pin flip-chip BGA with 0.8 mm pitch, thermal lid, and 35×35 mm body for high-power dissipation |
Pinout & Package
Package: FFVE900 - 900-pin flip-chip BGA, 35 mm × 35 mm body, 0.8 mm ball pitch, integrated heat spreader, RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0V ±3% regulated input powering logic fabric and CLBs; requires low-noise, high-PDn decoupling |
| VCCAUX | Auxiliary supply | 1.8V supply for configuration logic, PCIe hard IP, and transceiver reference clocks |
| MGTAVCC | Transceiver analog supply | 1.0V analog rail for GTY transceiver PLLs and serializers; sensitive to ripple & noise |
| IO_Lx_y | Configurable I/O bank | Grouped pins supporting selectable VCCO (1.2V–1.8V) and IOSTANDARD per bank |
| CLK_IN_0 | Dedicated clock input | Differential input for primary system clock; routed to global clock networks with <150 ps skew |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 Hard IP | Integrated endpoint/root complex supporting x1/x2/x4/x8/x16 widths with AXI4 streaming interface |
| UltraScale+ Memory Controller | Hardened DDR4/LPDDR4 controller with ECC, 2400 MT/s max data rate, and 64-bit bus width |
| Partial Reconfiguration | Enables dynamic logic swapping without full device reset - critical for multi-mode radar and protocol-agile radios |
| 25G GTY Transceivers | Each lane supports PAM4 and NRZ modulation; includes built-in PRBS generators/checkers and eye scan |
| System Monitor | On-die ADC measuring die temperature, supply voltages, and external analog inputs with ±2°C accuracy |
Applications
| 5G Massive MIMO Radio Unit | Data Center SmartNIC Acceleration |
|---|---|
Use Scenario: Real-time beamforming matrix computation and CPRI/eCPRI fronthaul processing in active antenna systems. IC Role / Device Role / Timing Role: Primary compute fabric handling L1 PHY layer processing, with deterministic timing enforced by dedicated clock trees. Use Value: 840 DSP slices enable concurrent 64×64 complex matrix multiplication at sub-100 µs latency, meeting 3GPP Release 16 TDD frame timing. | Use Scenario: Offloading TLS encryption, RDMA verbs, and packet classification in cloud server NICs. IC Role / Device Role / Timing Role: Co-processor tightly coupled to host CPU via PCIe Gen4 x16, delivering <1.2 µs interrupt-to-action latency. Use Value: 40 × 25G transceivers allow dual 100G QSFP28 ports while retaining >300K LUTs for stateful flow inspection logic. |
| High-Frequency Trading Engine | Medical Imaging Signal Processor |
Use Scenario: Low-latency order matching and market data parsing with nanosecond timestamping. IC Role / Device Role / Timing Role: Deterministic latency engine synchronizing to GPS-disciplined 10 MHz reference via dedicated clock inputs. Use Value: Sub-8 ns input-to-output path delay across critical trading logic paths, verified under worst-case PVT conditions. | Use Scenario: Real-time reconstruction of MRI k-space data using iterative SENSE algorithms. IC Role / Device Role / Timing Role: High-throughput compute accelerator interfacing directly to ADCs and DDR4 frame buffers. Use Value: 72.5 Mb block RAM enables double-buffered storage of two full 4K×4K complex-valued k-space matrices during pipeline execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Higher logic density (1,375K LC), 960 DSP slices, 48 transceivers; larger 1156-pin package; 30% higher TDP | Better suited for multi-100G transport systems requiring >100G MAC offload + encryption + FEC in one device | Select when additional DSP resources and transceiver count justify board redesign and thermal redesign |
| XCKU085-2FFVA1156E | Fewer logic cells (841K), 540 DSP slices, 32 transceivers; same 1156-pin package but lower power (18W typical) | Targeted at cost-sensitive 25G/50G edge servers where full XCKU13P capability is unused | Choose for migration paths requiring identical footprint but reduced feature set and lower BOM cost |
Compared with XCKU13P-1FFVE900E, the XCKU15P offers higher throughput at increased power and layout complexity, while the XCKU085 delivers proven compatibility in 1156-pin sockets with relaxed performance targets - enabling scalable platform design across performance tiers.
Availability
XCKU13P-1FFVE900E is available at Aetrix Electronics and suitable for 5G infrastructure, high-frequency trading hardware, and medical imaging equipment requiring stable component supply over extended production lifecycles.
Supply support for XCKU13P-1FFVE900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex UltraScale+ family targets high-performance, cost-optimized applications demanding bandwidth, DSP throughput, and transceiver flexibility - especially in wireless infrastructure and compute acceleration.
FAQ
What is the maximum supported data rate for transceivers on the XCKU13P-1FFVE900E?
The XCKU13P-1FFVE900E integrates GTY transceivers supporting up to 25.78125 Gb/s per lane in NRZ mode and 51.5625 Gb/s in PAM4 mode. These transceivers are qualified for CPRI, eCPRI, 100G KR4, and PCIe Gen4 protocols. The XCKU13P-1FFVE900E datasheet specifies AC characteristics including jitter tolerance and eye opening at these rates under defined PVT conditions.
Does the XCKU13P-1FFVE900E include integrated processors or ARM cores?
No, the XCKU13P-1FFVE900E is a pure FPGA fabric device without integrated processors. Unlike Zynq UltraScale+ MPSoC parts, it contains no ARM Cortex-A53 or Cortex-R5 subsystems. All control and management functions must be implemented externally or in soft logic. The XCKU13P-1FFVE900E relies on external microcontrollers or host CPUs for configuration and runtime supervision.
What memory interface standards does the XCKU13P-1FFVE900E support natively?
The XCKU13P-1FFVE900E includes hardened memory controllers supporting DDR4, LPDDR4, and RLDRAM3 interfaces. It achieves up to 2400 MT/s on DDR4 with 64-bit bus width and full ECC support. The XCKU13P-1FFVE900E does not support DDR5 or GDDR6 - those require UltraScale+ Virtex or Versal devices.
Is partial reconfiguration supported on the XCKU13P-1FFVE900E?
Yes, the XCKU13P-1FFVE900E fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic swapping of logical partitions without resetting the entire device. This capability is used in multi-standard radios and adaptive compute engines. The XCKU13P-1FFVE900E implements frame-based PR with bitstream authentication and CRC checking per reconfigurable region.
What thermal management provisions exist for the XCKU13P-1FFVE900E in the FFVE900 package?
The XCKU13P-1FFVE900E in FFVE900 package features an integrated copper heat spreader and thermal lid compatible with standard vapor chamber or extruded aluminum heatsinks. Thermal design guidelines specify 2.5°C/W junction-to-case resistance and require ≥40 CFM airflow over a 35×35 mm heatsink base. The XCKU13P-1FFVE900E System Monitor reports real-time die temperature with ±2°C accuracy for closed-loop thermal throttling.
XCKU13P-1FFVE900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 42660
- Number of Logic Elements/Cells:
- 746550
- Total RAM Bits:
- 70656000
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU13P-1FFVE900E FAQ
1.How can I place an order for XCKU13P-1FFVE900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU13P-1FFVE900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU13P-1FFVE900E reliable?
The price and inventory of XCKU13P-1FFVE900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU13P-1FFVE900E is usually 5 days.
3.What payment methods are accepted for XCKU13P-1FFVE900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU13P-1FFVE900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU13P-1FFVE900E?
XCKU13P-1FFVE900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU13P-1FFVE900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU13P-1FFVE900E?
For technical support, including XCKU13P-1FFVE900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU13P-1FFVE900E requirements.
6.How does Aetrix verify that XCKU13P-1FFVE900E is sourced from the original manufacturer or authorized distributors?
All XCKU13P-1FFVE900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU13P-1FFVE900E meets industry standards.
7.What is the process for return or replacement of XCKU13P-1FFVE900E?
All XCKU13P-1FFVE900E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU13P-1FFVE900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU13P-1FFVE900E part is unused and in its original packaging.
Return procedure for XCKU13P-1FFVE900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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