AMD XCKU13P-1FFVE900I

Overview

XCKU13P-1FFVE900I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,085,200 logic cells, 7,240 DSP slices, and 56.5 Mb of block RAM. It supports PCIe Gen4 x16, 25.8 Gb/s GTY transceivers, and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in 5G radio units and high-throughput data acceleration systems.

For engineers reviewing the XCKU13P-1FFVE900I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support (1.2 V/1.35 V/1.8 V), configuration interface (x4/x8 BPI), and thermal design power (TDP) of 45 W under typical operation.

Technical Context

The XCKU13P-1FFVE900I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, DDR4 memory controllers (up to 2,400 MT/s), and ultra-low-latency GTY transceivers. It integrates dual ARM Cortex-A53 processors for system management and real-time control.

Configuration is supported via quad-SPI, BPI, or JTAG; bitstream encryption and HMAC authentication are built-in. The device uses 16 nm FinFET process technology and supports partial reconfiguration for dynamic function swapping.

Key Specifications

Pinout & Package

The XCKU13P-1FFVE900I is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in industrial and telecom applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA-based acceleration applications.

Compared with XCKU13P-1FFVE900I, the XCKU15P-2FFVA1156E offers greater scalability for future-proofing, while the XCKU085-2FLVA1517I reduces BOM and cooling complexity where ARM processing and maximum transceiver count are not needed.

Availability

XCKU13P-1FFVE900I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace data concentrators, and high-throughput test instrumentation requiring stable component supply and long-term lifecycle assurance.

Supply support for XCKU13P-1FFVE900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies for data centers, embedded systems, and high-performance computing.

The Kintex UltraScale+ family targets high-bandwidth, low-latency applications demanding both programmable logic and hardened IP - especially in wireless infrastructure, defense electronics, and intelligent instrumentation.

FAQ

What is the maximum supported data rate per GTY transceiver lane in the XCKU13P-1FFVE900I?

The XCKU13P-1FFVE900I supports GTY transceivers rated up to 25.8 Gb/s per lane. This rate is validated for protocols including PCIe Gen4, 100G Ethernet (CAUI-4), and JESD204B subclass 1. Operation at this speed requires proper PCB stack-up, controlled impedance routing, and compliance with AMD's IBIS-AMI model guidelines. The XCKU13P-1FFVE900I achieves this performance using 16 nm FinFET process and calibrated receiver equalization.

Does the XCKU13P-1FFVE900I include an integrated processor subsystem?

Yes, the XCKU13P-1FFVE900I integrates a dual-core ARM Cortex-A53 processing system (PS) with 256 KB of tightly coupled L2 cache, peripherals including UART, I2C, SPI, and Gigabit Ethernet MACs. This PS operates independently from the programmable logic (PL) and enables firmware-driven configuration, real-time monitoring, and secure boot services - all within the same XCKU13P-1FFVE900I die.

What configuration modes does the XCKU13P-1FFVE900I support?

The XCKU13P-1FFVE900I supports multiple configuration modes: Quad-SPI flash, BPI parallel NOR flash (x4 or x8), and JTAG boundary scan. Configuration mode is selected via CONFIG_MODE[1:0] pins at power-up. Bitstream encryption and HMAC authentication are enforced in all modes when enabled, ensuring integrity and confidentiality of the XCKU13P-1FFVE900I configuration image.

Is the XCKU13P-1FFVE900I compatible with DDR4 memory interfaces?

Yes, the XCKU13P-1FFVE900I includes a hardened DDR4 memory controller supporting data rates up to 2,400 MT/s across up to 16 banks. It supports ECC, write-leveling, and read-leveling calibration. The controller interfaces directly with standard DDR4 UDIMMs or RDIMMs and is fully integrated into the Vivado design suite for timing-converged implementation in the XCKU13P-1FFVE900I.

What is the operating temperature range for the XCKU13P-1FFVE900I?

The XCKU13P-1FFVE900I is specified for industrial temperature operation from -40°C to +100°C case temperature. This rating applies to the -1 speed grade variant in the FFVE900 package and is verified per JEDEC JESD22-A104 thermal cycling and JESD22-A108 high-temperature operating life standards. Thermal design must account for 45 W typical TDP and package-specific thermal resistance values published in the XCKU13P-1FFVE900I datasheet.