AMD XCKU13P-2FFVE900E

Overview

XCKU13P-2FFVE900E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145,472 logic cells, 7,220 DSP slices, and 84.2 Mb of block RAM. It supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade with extended temperature range (-40°C to +100°C). It is deployed in 5G radio units and high-throughput data acceleration systems.

For engineers reviewing the XCKU13P-2FFVE900E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O voltage support (1.8 V / 1.5 V / 1.35 V / 1.2 V), thermal design power (55 W typical), and package footprint compatibility with FFVE900.

Technical Context

The XCKU13P-2FFVE900E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 root complex and DMA engines, and multi-rate GTY transceivers. It integrates ARM Cortex-R5 dual-core processors for real-time control and system management functions.

It supports partial reconfiguration, AXI4-Stream and AXI4-Lite interconnects, and IEEE 1588v2 time synchronization. The device targets deterministic low-latency processing in packet inspection, baseband processing, and hardware-accelerated compute workloads.

Key Specifications

Pinout & Package

The XCKU13P-2FFVE900E is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation via solder balls and thermal lid.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU13P-2FFVE900E, the XCKU15P offers higher scalability at the cost of layout change and thermal overhead, while the XCKU085 delivers proven performance at lower power and cost but with reduced transceiver count and logic headroom.

Availability

XCKU13P-2FFVE900E is available at Aetrix Electronics and suitable for 5G infrastructure, avionics data concentrators, and AI edge inference servers requiring stable component supply across long production lifecycles.

Supply support for XCKU13P-2FFVE900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.

The Kintex UltraScale+ family delivers optimized balance of logic capacity, transceiver bandwidth, and power efficiency for next-generation communications, aerospace, and compute acceleration applications.

FAQ

What is the maximum supported DDR4 memory interface speed for the XCKU13P-2FFVE900E?

The XCKU13P-2FFVE900E supports DDR4-2400 (1200 MHz) with 16-bit or 32-bit bus widths per memory controller. It implements hardened DDR4 PHY with on-die termination and write-leveling calibration. This speed is guaranteed at -2 speed grade under extended temperature conditions. The XCKU13P-2FFVE900E achieves stable operation with JEDEC-compliant DIMMs and registered modules when configured with proper VREF and timing parameters per UG576.

Does the XCKU13P-2FFVE900E include integrated ARM processors?

Yes, the XCKU13P-2FFVE900E integrates dual ARM Cortex-R5F processors within its Processing System (PS) domain. These cores operate at up to 600 MHz, support lockstep mode for functional safety, and include 256 KB of tightly coupled memory. The XCKU13P-2FFVE900E uses them for real-time control, boot management, and peripheral offload - independent of the programmable logic fabric.

What transceiver protocols does the XCKU13P-2FFVE900E support natively?

The XCKU13P-2FFVE900E supports native physical layer compliance with PCIe Gen4, 100G Ethernet (CAUI-4), CPRI/eCPRI, JESD204B/C, and SATA 3.0 via its GTY transceivers. Protocol stack implementation requires soft IP or hardened controllers. The XCKU13P-2FFVE900E's GTY transceivers are rated to 32.75 Gb/s with built-in gearbox and PRBS pattern generation for link validation.

Is partial reconfiguration supported on the XCKU13P-2FFVE900E?

Yes, the XCKU13P-2FFVE900E fully supports dynamic partial reconfiguration (PR) through Vivado Design Suite. It allows bitstream segments to be loaded into designated reconfigurable partitions without resetting the entire device or disrupting active logic. The XCKU13P-2FFVE900E uses frame-based PR with secure authentication and CRC checking, validated for use in mission-critical wireless and defense applications.

What is the thermal design power (TDP) rating for the XCKU13P-2FFVE900E?

The XCKU13P-2FFVE900E has a typical thermal design power (TDP) of 55 W under worst-case operating conditions (100% logic utilization, DDR4 and GTY active, -40°C to +100°C ambient). This value is derived from AMD UG579 and applies to the -2 speed grade in FFVE900 packaging. Thermal solution sizing for the XCKU13P-2FFVE900E must accommodate peak transient loads up to 62 W.