AMD XCKU13P-2FFVE900I

Overview

XCKU13P-2FFVE900I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145,472 logic cells, 7,225 DSP slices, and 84.2 Mb of block RAM. It integrates hardened PCIe Gen3 x16, 100G Ethernet MACs, and DDR4 memory controllers, targeting high-bandwidth data processing in radar signal chains and 5G baseband units.

For engineers reviewing the XCKU13P-2FFVE900I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (56 GTY), I/O voltage support (1.2 V to 1.8 V), thermal design power (54 W typical), and package footprint compatibility with FFVE900.

Technical Context

The XCKU13P-2FFVE900I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, 100G Ethernet, and DDR4/DDR3/LPDDR4 memory interfaces. Its GTY transceivers operate up to 32.75 Gb/s per lane with built-in PRBS generators and error detectors.

Configuration is supported via quad-SPI, BPI, or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device supports partial reconfiguration and dynamic function exchange for runtime adaptation in mission-critical systems.

Key Specifications

Pinout & Package

The XCKU13P-2FFVE900I is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) with 1.0 mm pitch, designed for high-density PCB routing and thermal dissipation in air- or liquid-cooled modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU13P-2FFVE900I, the XCKU15P-2FFVD900I offers higher compute density but demands tighter thermal margins, while the XCKU085-2FFVA1156I reduces transceiver count and power at the cost of board-level redesign and reduced real-time processing headroom.

Availability

XCKU13P-2FFVE900I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, avionics flight computers, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCKU13P-2FFVE900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.

The Kintex UltraScale+ family targets high-throughput, low-latency applications in aerospace, defense, wired/wireless infrastructure, and instrumentation-designed to replace ASICs with field-programmable flexibility and hardened IP acceleration.

FAQ

What is the maximum data rate supported by the GTY transceivers on the XCKU13P-2FFVE900I?

The XCKU13P-2FFVE900I features 56 GTY transceiver lanes, each supporting up to 32.75 Gb/s. This enables full-rate operation for 100G Ethernet (4×25G), CPRI Option 10, and JESD204C interfaces. The transceivers include built-in PRBS pattern generators and error detectors for link validation without external test equipment.

Does the XCKU13P-2FFVE900I support DDR4 memory interfaces?

Yes, the XCKU13P-2FFVE900I includes hardened DDR4 memory controller IP supporting data rates up to DDR4-2400 (1200 MHz). It provides full calibration, on-die termination, and ECC support across up to eight 72-bit DIMMs. The controller is integrated into the UltraScale+ memory interface suite and requires no soft logic implementation.

Is the XCKU13P-2FFVE900I qualified for aerospace or defense applications?

The XCKU13P-2FFVE900I is offered in an industrial temperature grade (–40°C to +100°C junction) and supports AES-256 bitstream encryption and HMAC-SHA256 authentication, meeting DO-254 Level A and IEC 62443-3-3 SL3 requirements. While not radiation-hardened, it is widely deployed in non-Space-grade avionics and ground-based defense systems with external mitigation.

What configuration modes does the XCKU13P-2FFVE900I support?

The XCKU13P-2FFVE900I supports multiple configuration modes including master/slave SPI (quad or standard), BPI parallel NOR flash, and JTAG boundary-scan. Configuration can be initiated from external flash or through ICAP for partial reconfiguration. Bitstream authentication and decryption occur automatically during boot if enabled.

How many PCIe Gen3 lanes does the XCKU13P-2FFVE900I integrate?

The XCKU13P-2FFVE900I integrates a single hardened PCIe Gen3 x16 endpoint block. It supports root complex and endpoint roles, with AXI4 streaming interfaces and DMA engines. The block operates at 8 GT/s per lane and includes MSI-X, TLP checksum, and advanced error reporting capabilities.