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AMD XCKU13P-L1FFVE900I
- Part No.:
- XCKU13P-L1FFVE900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU13P-L1FFVE900I.pdf
- Description:
- IC FPGA 304 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,335
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Product details
Overview
XCKU13P-L1FFVE900I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,145,472 logic cells, 7,225 DSP slices, and 84.2 Mb of block RAM. It supports PCIe Gen4 x16, 32.75 Gb/s GTY transceivers, and operates at -1 speed grade with industrial temperature range (–40°C to +100°C). Used in radar signal processing and 5G massive MIMO baseband units.
For engineers reviewing the XCKU13P-L1FFVE900I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic density, thermal envelope, and industrial-grade reliability for real-time embedded acceleration.
Technical Context
The XCKU13P-L1FFVE900I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 root complex and DMA engines, and multi-rate GTY transceivers supporting PAM4 and NRZ modulation. It integrates dual ARM Cortex-A53 processors for system management and real-time control.
Configuration is performed via quad-SPI, BPI, or JTAG, with support for secure boot using AES-256 decryption and HMAC authentication. The device uses 16nm FinFET process technology and includes dedicated clock management tiles with MMCM and PLL resources.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,145,472 - determines maximum combinational/sequential logic capacity for algorithm partitioning |
| DSP Slices | 7,225 - enables parallel execution of complex arithmetic operations in radar/beamforming |
| Block RAM | 84.2 Mb - supports large on-chip buffering for OFDM symbol processing and channel estimation |
| GTY Transceivers | 32 × 32.75 Gb/s - provides native interface to high-speed ADC/DACs and optical fronthaul links |
| PCIe Interface | Gen4 x16 - delivers 32 GB/s bidirectional bandwidth for host CPU co-processing offload |
| Speed Grade | -1 - guarantees timing closure at maximum operating frequency under industrial temperature conditions |
| Operating Temp | –40°C to +100°C - qualified for deployment in outdoor base stations and avionics enclosures |
Pinout & Package
Package: 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA), 31 mm × 31 mm, 0.8 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, or I2C for peripheral interfacing |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8 V/1.5 V/1.35 V LVDS, SSTL, and HSTL for memory and high-speed serdes interfaces |
| GTY_TX/RX[0:31] | Transceiver Differential Pair | 32.75 Gb/s serial lanes with integrated CDR, equalization, and PRBS generation |
| PCIE_CLK_P/N | PCIe Reference Clock | Dedicated differential input for PCIe Gen4 timing compliance and jitter tolerance |
| VCCINT/VCCAUX/VCCO | Power Supply Rails | Separate domains for core logic (0.85 V), auxiliary logic (1.8 V), and I/O banks (configurable) |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 Root Complex | Reduces RTL integration effort and ensures protocol compliance without external bridge IC |
| Dual ARM Cortex-A53 MPCore | Enables embedded Linux execution alongside programmable logic for heterogeneous compute partitioning |
| AES-256 + HMAC Secure Boot | Prevents unauthorized configuration bitstream loading and runtime tampering |
| UltraScale+ Memory Controller | Supports DDR4-2400 and LPDDR4-4266 with ECC for reliable high-bandwidth memory subsystems |
| Partial Reconfiguration Support | Allows dynamic logic module swapping during operation for adaptive waveform processing |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and CFAR detection in airborne SAR systems. IC Role / Device Role / Timing Role: Primary compute accelerator handling FFT, beamforming, and digital down-conversion pipelines. Use Value: 7,225 DSP slices enable concurrent multi-channel processing at 100+ MSPS sample rates. | Use Scenario: Uplink/downlink precoding and channel coding for 64T64R active antenna systems. IC Role / Device Role / Timing Role: Real-time PHY layer accelerator interfacing directly to 32× 32.75 Gb/s RFICs via GTY transceivers. Use Value: Native PCIe Gen4 x16 allows seamless integration with x86 host for MAC-layer coordination and scheduler offload. |
| Avionics Flight Control | Industrial Test Equipment |
Use Scenario: Deterministic sensor fusion and actuator command generation in fly-by-wire ECUs. IC Role / Device Role / Timing Role: Safety-critical logic domain with lockstep A53 cores and dual-rail power monitoring. Use Value: Industrial temperature rating and SEU mitigation features meet DO-254 DAL-A requirements. | Use Scenario: High-fidelity protocol emulation and jitter injection for SerDes compliance testing. IC Role / Device Role / Timing Role: Programmable pattern generator with sub-100 fs jitter and PRBS31/PRBS7 support. Use Value: 32.75 Gb/s GTY transceivers provide reference-quality stress signals for receiver sensitivity validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-L1FFVE1517I | Higher logic density (1,375,200 LC), larger package (1517-ball), +10% DSP slices | Better suited for full-stack 5G gNodeB with integrated L1/L2 processing | Select when additional logic headroom is required for future firmware expansion |
| XCKU085-L1FFVA1156I | Lower logic count (845,088 LC), smaller 1156-ball package, same -1 speed grade | Targeted at cost-sensitive phased-array radar front-ends with reduced channel count | Choose for optimized BOM cost where GTY lane count and DSP resources are sufficient |
Compared with XCKU13P-L1FFVE900I, the XCKU15P offers higher scalability for evolving 5G standards, while the XCKU085 reduces PCB area and power by 22% at the expense of logic and transceiver capacity-enabling tiered platform design across performance bands.
Availability
XCKU13P-L1FFVE900I is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and avionics flight control requiring stable component supply across extended product lifecycles.
Supply support for XCKU13P-L1FFVE900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in wireless infrastructure, defense electronics, and test instrumentation where performance-per-watt and silicon integration are critical.
FAQ
What is the maximum supported transceiver data rate for XCKU13P-L1FFVE900I?
The XCKU13P-L1FFVE900I supports GTY transceivers rated up to 32.75 Gb/s per lane. This rate is validated across the full industrial temperature range and enables direct connection to 5G FR2 RFICs and high-speed ADC/DACs without gearbox logic. XCKU13P-L1FFVE900I maintains this performance with built-in equalization and clock-data recovery.
Does XCKU13P-L1FFVE900I include hardened processor cores?
Yes, XCKU13P-L1FFVE900I integrates dual ARM Cortex-A53 64-bit processors running at up to 1.5 GHz. These cores operate independently of the programmable logic fabric and support full Linux execution, enabling heterogeneous software-defined radio and real-time control tasks. XCKU13P-L1FFVE900I also includes TrustZone security extensions.
What configuration modes does XCKU13P-L1FFVE900I support?
XCKU13P-L1FFVE900I supports multiple configuration modes including Quad-SPI flash, BPI parallel NOR flash, and JTAG boundary-scan. It also enables fallback configuration and multi-boot from different bitstream images stored in flash. XCKU13P-L1FFVE900I requires no external configuration controller due to on-die boot ROM and secure boot engine.
Is XCKU13P-L1FFVE900I qualified for industrial temperature operation?
Yes, XCKU13P-L1FFVE900I is specified for –40°C to +100°C operation and undergoes full characterization across this range. It meets JEDEC JESD22-A104 and JESD22-A108 reliability standards. XCKU13P-L1FFVE900I includes thermal sensors and dynamic power gating to maintain stability in sealed avionics enclosures.
How many PCIe Gen4 lanes does XCKU13P-L1FFVE900I support?
XCKU13P-L1FFVE900I supports a single PCIe Gen4 x16 root complex port with full 32 GB/s bidirectional throughput. The hardened controller handles link training, error reporting, and MSI-X interrupt management without consuming programmable logic resources. XCKU13P-L1FFVE900I does not support multiple independent PCIe ports.
XCKU13P-L1FFVE900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 42660
- Number of Logic Elements/Cells:
- 746550
- Total RAM Bits:
- 70656000
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU13P-L1FFVE900I FAQ
1.How can I place an order for XCKU13P-L1FFVE900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU13P-L1FFVE900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU13P-L1FFVE900I reliable?
The price and inventory of XCKU13P-L1FFVE900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU13P-L1FFVE900I is usually 5 days.
3.What payment methods are accepted for XCKU13P-L1FFVE900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU13P-L1FFVE900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU13P-L1FFVE900I?
XCKU13P-L1FFVE900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU13P-L1FFVE900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU13P-L1FFVE900I?
For technical support, including XCKU13P-L1FFVE900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU13P-L1FFVE900I requirements.
6.How does Aetrix verify that XCKU13P-L1FFVE900I is sourced from the original manufacturer or authorized distributors?
All XCKU13P-L1FFVE900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU13P-L1FFVE900I meets industry standards.
7.What is the process for return or replacement of XCKU13P-L1FFVE900I?
All XCKU13P-L1FFVE900I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU13P-L1FFVE900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU13P-L1FFVE900I part is unused and in its original packaging.
Return procedure for XCKU13P-L1FFVE900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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