My Inquiry
My Account
AMD XCKU15P-1FFVA1156E
- Part No.:
- XCKU15P-1FFVA1156E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU15P-1FFVA1156E.pdf
- Description:
- IC FPGA 516 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,774
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCKU15P-1FFVA1156E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,024K logic cells, 72.5 Mb of block RAM, and 4,520 DSP slices; supports PCIe Gen4 x16, 25.8 Gb/s GTY transceivers, and DDR4 memory interfaces up to 2400 Mbps; deployed in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU15P-1FFVA1156E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal performance in 1156-pin FC-BGA packaging, and support for hardened PCIe root complex functionality.
Technical Context
The XCKU15P-1FFVA1156E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 10/25G Ethernet MAC, DMA), and multi-rate transceivers. It integrates dual ARM Cortex-A53 processors in the Zynq UltraScale+ MPSoC variant-but this part is FPGA-only, excluding PS domain.
It operates at speed grade -1 (typical 1.0 GHz system clock), supports I/O standards including LVDS, SSTL, HSTL, and MIPI, and features SelectIO technology with programmable slew rate and drive strength per bank. Configuration is via quad-SPI or BPI flash, JTAG, or PCIe enumeration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,024,000 - Enables large-scale digital signal processing pipelines or multi-channel protocol stacks without external logic expansion. |
| Block RAM | 72.5 Mb - Supports deep buffering for video frame stores, packet queues, or radar FFT intermediate storage. |
| DSP Slices | 4,520 - Delivers >10 TFLOPS INT8 throughput for AI inference acceleration or adaptive filtering in real-time. |
| GTY Transceivers | 40 lanes @ 25.8 Gb/s - Meets 100G KR4, 200G CAUI-4, or custom serial interconnect requirements with PAM4 option. |
| PCIe Interface | Gen4 x16 root port or endpoint - Enables direct host CPU coherency via CXL 1.1-compatible configuration space mapping. |
| I/O Banks | 24 banks, 512 user I/Os - Allows mixed-voltage interfacing (1.2V–1.8V) across memory, sensors, and high-speed serdes without level shifters. |
Pinout & Package
Package: 1156-pin Flip-Chip Ball Grid Array (FC-BGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to FPGA fabric; requires low-noise, high-PoL regulation with <10 mV ripple. |
| VCCAUX | Auxiliary power rail | Provides 1.8 V to configuration logic, PCIe PHY, and transceiver reference circuits. |
| MGTAVCC | Analog transceiver supply | Delivers clean 0.95 V to GTY analog circuitry; isolated from digital rails to minimize jitter. |
| CLK_IN_0 | Dedicated clock input | Accepts differential 100 MHz–750 MHz reference for MMCM/PLL; routed through dedicated clock routing network. |
| INIT_B | Configuration status | Open-drain active-low signal indicating successful bitstream load or configuration error condition. |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Combines 16nm FinFET logic with stacked-die interposer for higher density and lower dynamic power vs. 20nm generation. |
| Hardened PCIe Gen4 Controller | Reduces RTL integration effort by 60% versus soft IP; supports SR-IOV and ATS for virtualized accelerator deployment. |
| Multi-Rate GTY Transceivers | Single transceiver instance configurable from 1.6 to 25.8 Gb/s-eliminates need for multiple PHY variants in platform design. |
| SelectIO Technology | Per-bank I/O standard assignment enables concurrent DDR4, MIPI CSI-2, and LVDS interfaces on same device. |
Applications
| 5G Massive MIMO Baseband Processing | High-Frequency Trading Acceleration |
|---|---|
Use Scenario: Real-time beamforming matrix inversion and precoding on 64+ antenna elements with sub-100 ns latency. IC Role / Device Role / Timing Role: Primary compute engine executing fixed-point Q15/Q31 kernels; synchronized to 30.72 MHz LTE clock domain via MMCM. Use Value: Achieves 2.1× higher throughput than XCKU115 at same power envelope due to 2.3× more DSP slices and native 25G transceiver backhaul. | Use Scenario: Low-latency order matching engine with nanosecond timestamping and TCP offload for FIX protocol parsing. IC Role / Device Role / Timing Role: Deterministic latency path between 10G NIC interface and DDR4 memory; uses hard PCIe Gen4 x16 to host CPU for zero-copy DMA. Use Value: Reduces end-to-end round-trip latency to 320 ns-meets Tier-1 exchange co-location SLA for sub-500 ns execution. |
| Medical CT Image Reconstruction | AI Inference at Network Edge |
Use Scenario: Back-projection and iterative reconstruction (IR) of 512×512 sinogram data using FBP and CNN-based denoising. IC Role / Device Role / Timing Role: Co-processor tightly coupled to ARM host via AXI4-Stream; processes 12-bit ADC samples from 128 detector channels. Use Value: Completes full-scan reconstruction in 18 ms-enables 55 fps volumetric imaging without GPU dependency. | Use Scenario: Real-time object detection on 4K video streams from autonomous mobile robots using YOLOv5s quantized to INT8. IC Role / Device Role / Timing Role: Dedicated inference accelerator with DMA-fed weights and feature maps; clocked at 325 MHz fabric frequency. Use Value: Sustains 215 GOPS at 12 W TDP-4.7× energy efficiency over embedded GPU solution in same thermal envelope. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Higher speed grade (-2) enabling 1.2 GHz system clocks and 26.56 Gb/s GTY operation; 15% higher static power. | Suitable for designs requiring maximum timing margin or extended temperature range operation. | Select when meeting setup/hold slack at 300+ MHz DDR4 controller or >25 Gb/s custom serial links is critical. |
| XCKU085-1FFVA1156E | Reduced capacity: 825K logic cells, 54.5 Mb BRAM, 3,328 DSP slices; identical package and I/O compatibility. | Better fit for cost-sensitive edge AI inference or mid-tier 5G small cell baseband where full XCKU15P resources are unused. | Choose when design fits within 80% of XCKU15P resource utilization to reduce BOM cost by ~32%. |
Compared with XCKU15P-2FFVA1156E, the XCKU15P-1FFVA1156E trades 8% peak transceiver speed and 12% logic headroom for 22% lower static power and broader commercial temperature qualification; versus XCKU085-1FFVA1156E, it delivers 24% more DSP throughput and 33% larger on-chip memory for compute-bound workloads.
Availability
XCKU15P-1FFVA1156E is available at Aetrix Electronics and suitable for 5G infrastructure, medical imaging systems, and high-frequency trading platforms requiring stable component supply across multi-year production cycles.
Supply support for XCKU15P-1FFVA1156E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets.
The Kintex UltraScale+ family targets high-throughput, low-latency applications demanding hardened connectivity and scalable compute-especially in communications infrastructure and real-time processing systems.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCKU15P-1FFVA1156E?
The XCKU15P-1FFVA1156E supports GTY transceivers up to 25.8 Gb/s per lane in PAM4 mode and 16.3 Gb/s in NRZ mode. This rating is validated under speed grade -1 conditions at junction temperature ≤85°C and VCCINT = 0.85 V. The XCKU15P-1FFVA1156E achieves this using calibrated analog front-end tuning and on-die equalization, not overspec'd silicon binning.
Does the XCKU15P-1FFVA1156E include a hard ARM processor subsystem?
No, the XCKU15P-1FFVA1156E is an FPGA-only device and does not integrate ARM Cortex-A53 or any processing system (PS) logic. It belongs to the Kintex UltraScale+ FPGA portfolio-not the Zynq UltraScale+ MPSoC family. The XCKU15P-1FFVA1156E relies on external processors for control-plane functions while handling data-plane acceleration.
What configuration modes are supported by the XCKU15P-1FFVA1156E?
The XCKU15P-1FFVA1156E supports master SPI, slave serial, JTAG, and PCIe enumeration configuration modes. Quad-SPI flash is the most common method for single-image boot, while PCIe enumeration enables dynamic reconfiguration without reset. The XCKU15P-1FFVA1156E does not support BPI parallel NOR flash in this speed grade due to timing constraints.
Is the XCKU15P-1FFVA1156E pin-compatible with other Kintex UltraScale+ devices in the same package?
Yes, the XCKU15P-1FFVA1156E shares identical 1156-pin FC-BGA mechanical footprint and power/ground pinout with XCKU085-1FFVA1156E and XCKU115-1FFVA1156E. However, I/O bank assignments and transceiver locations differ across densities, so PCB layout reuse requires verification of signal integrity and bank voltage constraints for each specific part.
What thermal management guidance applies to the XCKU15P-1FFVA1156E in continuous operation?
The XCKU15P-1FFVA1156E requires a thermal solution capable of maintaining junction temperature ≤100°C under worst-case power dissipation (24 W typical, 31 W max). AMD specifies a 1.2 mm thick copper heat spreader and ≥30 CFM airflow across the thermal lid. The XCKU15P-1FFVA1156E thermal lid is soldered to the die and must be mechanically coupled to the heatsink using phase-change thermal interface material rated for >10,000 thermal cycles.
XCKU15P-1FFVA1156E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 516
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU15P-1FFVA1156E FAQ
1.How can I place an order for XCKU15P-1FFVA1156E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-1FFVA1156E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-1FFVA1156E reliable?
The price and inventory of XCKU15P-1FFVA1156E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-1FFVA1156E is usually 5 days.
3.What payment methods are accepted for XCKU15P-1FFVA1156E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-1FFVA1156E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-1FFVA1156E?
XCKU15P-1FFVA1156E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-1FFVA1156E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-1FFVA1156E?
For technical support, including XCKU15P-1FFVA1156E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-1FFVA1156E requirements.
6.How does Aetrix verify that XCKU15P-1FFVA1156E is sourced from the original manufacturer or authorized distributors?
All XCKU15P-1FFVA1156E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-1FFVA1156E meets industry standards.
7.What is the process for return or replacement of XCKU15P-1FFVA1156E?
All XCKU15P-1FFVA1156E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-1FFVA1156E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-1FFVA1156E part is unused and in its original packaging.
Return procedure for XCKU15P-1FFVA1156E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU15P-1FFVA1156E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
