AMD XCKU15P-1FFVA1156I
- Part No.:
- XCKU15P-1FFVA1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU15P-1FFVA1156I.pdf
- Description:
- IC FPGA 516 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCKU15P-1FFVA1156I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,024K logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s GTY transceivers. It is deployed in 5G radio units, high-throughput data acquisition systems, and real-time radar processing where deterministic latency and multi-protocol I/O are critical.
For engineers reviewing the XCKU15P-1FFVA1156I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, on-chip memory depth, I/O voltage flexibility (1.2 V to 1.8 V), and thermal design power (TDP) under sustained compute load.
Technical Context
The XCKU15P-1FFVA1156I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA engines), and ultra-low-latency memory controllers. Its GTY transceivers support PAM4 and NRZ modulation, and the device integrates dual ARM Cortex-A53 processors for embedded control.
Configuration is performed via quad-SPI or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device operates across industrial temperature range (–40°C to +100°C) and supports partial reconfiguration for dynamic function swapping without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,024,000 - Enables implementation of complex DSP pipelines or multi-channel protocol stacks within single device. |
| Block RAM | 72.5 Mb - Supports large frame buffers for video processing or deep packet inspection tables. |
| GTY Transceivers | 40 × 25.8 Gb/s - Provides native connectivity to 100G QSFP28 optical modules without retimers. |
| Max I/O Count | 528 user I/O - Allows direct interfacing to multiple DDR4 banks, ADCs, DACs, and peripheral buses simultaneously. |
| Memory Interface | DDR4-2400 @ 64-bit - Delivers 19.2 GB/s peak memory bandwidth for streaming data applications. |
| TDP | 35 W typical - Defines heatsink sizing and airflow requirements in sealed 5G outdoor enclosures. |
Pinout & Package
Package: 1156-pin FCBGA (Fine-Pitch Column Grid Array), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects directly to PS ARM subsystem. |
| HR Bank 0–3 | High-Range I/O | Supports 1.2 V/1.35 V/1.5 V/1.8 V signaling; used for DDR4 address/control and high-speed serial links. |
| HP Bank 4–7 | High-Performance I/O | Operates up to 1.5 V; interfaces to ADCs/DACs with sub-ns timing closure. |
| GTY_RXN/P[0:39] | Differential Transceiver Input | Accepts 25.8 Gb/s NRZ or 51.5 Gb/s PAM4; requires AC-coupled PCB routing with 85 Ω differential impedance. |
| VCCINT | Core Supply | 0.85 V ±3% supply; must be filtered with ≥100 µF low-ESR ceramic per bank for stable logic operation. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Root Port | Reduces RTL integration effort and guarantees sub-100 ns transaction latency for host CPU offload. |
| UltraScale+ Memory Controller | Enables single-cycle access to DDR4 with configurable burst length and on-die termination calibration. |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized configuration in deployed edge infrastructure. |
| Partial Reconfiguration Support | Allows runtime update of signal processing kernels without interrupting I/O or memory traffic. |
| Dual ARM Cortex-A53 MPCore | Provides Linux-capable embedded processing for control plane tasks alongside programmable logic data plane. |
Applications
| 5G Massive MIMO Radio Unit | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming coefficient calculation and RF channel pre-distortion at 200 MHz baseband sampling rate. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and adaptive filter pipelines; GTY transceivers interface to JESD204B ADC/DAC tiles. Use Value: Achieves <500 ns loop latency from ADC sample to DAC output, meeting 3GPP TR 38.803 timing constraints. | Use Scenario: Multi-channel digital pattern generation and response analysis for semiconductor ATE platforms. IC Role / Device Role / Timing Role: Serves as deterministic timing engine and protocol-aware pattern sequencer with sub-200 ps jitter on output clocks. Use Value: Enables 32-Gbps parallel vector capture using HP I/O banks synchronized to internal PLL with <150 fs RMS jitter. |
| Phased Array Radar Processing | Network Packet Inspection Appliance |
Use Scenario: Streaming phase-coherent digitized IF data from 64-element receive array with real-time STAP processing. IC Role / Device Role / Timing Role: Implements time-synchronized multi-channel DDC chains and adaptive beam nulling logic across distributed logic slices. Use Value: Maintains <±0.5° phase error across all 64 channels at 4 GHz carrier, enabling >40 dB sidelobe suppression. | Use Scenario: Line-rate deep packet inspection and TLS decryption acceleration for 100 GbE firewall appliances. IC Role / Device Role / Timing Role: Offloads CPU by executing regex matching, flow classification, and AES-GCM crypto in parallel pipeline stages. Use Value: Processes 140 Mpps with <2 µs average latency per packet, sustaining full 100 GbE throughput under mixed traffic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156I | Higher speed grade (–2): 30% faster static timing closure margin and 12% higher max GTY line rate (29.5 Gb/s). | Suitable for designs requiring guaranteed 28 Gb/s NRZ on all GTY lanes under worst-case voltage/temperature. | Select XCKU15P-2FFVA1156I only if timing closure fails at –1 grade with target clock frequencies. |
| XCKU085-1FFVA1156I | Lower density: 845K logic cells, 54.5 Mb BRAM, 32 GTY transceivers; identical package and pinout. | Used in cost-optimized 25G/50G systems where full XCKU15P capacity is unused. | XCKU085-1FFVA1156I offers 28% lower BOM cost but cannot scale to 100G+ or multi-antenna radar workloads. |
Compared with XCKU15P-1FFVA1156I, the –2 speed grade delivers tighter timing margins for high-frequency designs, while the XCKU085 variant reduces cost and power at the expense of transceiver count and logic capacity-both require no PCB redesign due to identical FFVA1156 packaging.
Availability
XCKU15P-1FFVA1156I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-speed test instrumentation requiring stable component supply over extended production lifecycles.
Supply support for XCKU15P-1FFVA1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex UltraScale+ family targets high-throughput, low-latency applications such as wireless infrastructure, defense radar, and high-end test equipment where performance-per-watt and I/O flexibility are critical.
FAQ
What is the maximum supported DDR4 data rate for XCKU15P-1FFVA1156I?
XCKU15P-1FFVA1156I supports DDR4-2400 (1200 MHz clock) across 64-bit interfaces with on-die termination calibration and write-leveling. This enables 19.2 GB/s peak bandwidth and is validated for industrial temperature operation with JEDEC-compliant DIMMs or discrete components.
Does XCKU15P-1FFVA1156I include hardened processor cores?
Yes, XCKU15P-1FFVA1156I integrates a dual-core ARM Cortex-A53 application processor subsystem with NEON and floating-point units, running at up to 1.5 GHz. It supports Linux, FreeRTOS, and bare-metal execution, and communicates with programmable logic via AXI GP/HP ports.
What transceiver protocols are natively supported by XCKU15P-1FFVA1156I?
XCKU15P-1FFVA1156I GTY transceivers natively support PCIe Gen4 x16, 100G Ethernet (CAUI-4), CPRI/eCPRI, JESD204B/C, and SATA/SAS. Protocol stack implementation uses Xilinx LogiCORE IP with certified PHY layer compliance and built-in PRBS generators/checkers.
Is partial reconfiguration supported on XCKU15P-1FFVA1156I?
Yes, XCKU15P-1FFVA1156I fully supports partial reconfiguration through Vivado Design Suite. Users can dynamically swap logic partitions-such as filter coefficients or protocol engines-without resetting I/O banks, memory controllers, or the ARM subsystem.
What is the operating temperature range for XCKU15P-1FFVA1156I?
XCKU15P-1FFVA1156I is rated for industrial temperature operation from –40°C to +100°C case temperature. Thermal design must maintain junction temperature below 125°C under worst-case power dissipation, verified using AMD's XPE power estimator tool.
XCKU15P-1FFVA1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 516
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU15P-1FFVA1156I FAQ
1.How can I place an order for XCKU15P-1FFVA1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-1FFVA1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-1FFVA1156I reliable?
The price and inventory of XCKU15P-1FFVA1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-1FFVA1156I is usually 5 days.
3.What payment methods are accepted for XCKU15P-1FFVA1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-1FFVA1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-1FFVA1156I?
XCKU15P-1FFVA1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-1FFVA1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-1FFVA1156I?
For technical support, including XCKU15P-1FFVA1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-1FFVA1156I requirements.
6.How does Aetrix verify that XCKU15P-1FFVA1156I is sourced from the original manufacturer or authorized distributors?
All XCKU15P-1FFVA1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-1FFVA1156I meets industry standards.
7.What is the process for return or replacement of XCKU15P-1FFVA1156I?
All XCKU15P-1FFVA1156I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-1FFVA1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-1FFVA1156I part is unused and in its original packaging.
Return procedure for XCKU15P-1FFVA1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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