AMD XCKU15P-1FFVA1760E
- Part No.:
- XCKU15P-1FFVA1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU15P-1FFVA1760E.pdf
- Description:
- IC FPGA 512 I/O 1760FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCKU15P-1FFVA1760E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,085K logic cells, 72.5 Mb of block RAM, and 4,520 DSP slices. It integrates dual ARM Cortex-A53 processors, supports PCIe Gen3 x16, and targets high-bandwidth data processing in radar signal conditioning and 5G baseband subsystems.
For engineers reviewing the XCKU15P-1FFVA1760E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate (32.75 Gb/s), I/O voltage support (1.2 V to 1.8 V), thermal design power (59 W), and package footprint compatibility with FFVA1760.
Technical Context
The XCKU15P-1FFVA1760E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including 100G Ethernet MACs and DDR4 memory controllers, and dual-core ARM Cortex-A53 application processing units. It supports partial reconfiguration and AXI4 interconnect for system-level integration.
Its transceivers comply with IEEE 802.3bj and CEI-11G standards, enabling direct attachment to optical modules and high-speed serial backplanes. The device operates across industrial temperature range (-40°C to +100°C junction) and supports JTAG and Quad-SPI configuration modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,085,000 - determines maximum combinational/sequential logic capacity for complex RTL implementation |
| Block RAM | 72.5 Mb - enables large on-die buffering for video frame storage or packet buffering in networking |
| DSP Slices | 4,520 - supports parallel multiply-accumulate operations for real-time FFT and filtering in radar/5G |
| Transceiver Max Rate | 32.75 Gb/s - enables single-lane 100G KR4/CR4 or dual-lane 200G Ethernet interfaces |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - supports mixed-voltage interface bridging to ADCs, DACs, and memory |
| TDP | 59 W - defines minimum heatsink requirement and airflow specification for sustained operation |
| Package | FFVA1760 - 1760-pin flip-chip BGA with 0.8 mm pitch, requiring controlled impedance PCB stackup |
Pinout & Package
Package: FFVA1760 - 1760-ball flip-chip BGA, 35 mm × 35 mm body, 0.8 mm ball pitch, standard JEDEC MO-271AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0V ±3% regulated input powering logic fabric and CLBs |
| VCCAUX | Auxiliary supply | 1.8V supply for configuration logic, PCIe PHY, and clock management tiles |
| VCCO_0 | I/O bank supply | Configurable 1.2–1.8V output driver voltage per bank, enabling mixed-interface designs |
| MGTAVCC | Transceiver analog supply | 1.0V analog rail for GTY transceiver PLLs and serializers |
| PROGRAM_B | Configuration control | Active-low asynchronous reset that clears configuration memory and initiates reload |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during startup |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Processing | Dual ARM Cortex-A53 cores with NEON and TrustZone enable embedded software execution alongside programmable logic |
| Hardened 100G Ethernet | Integrated 100G MAC and RS-FEC blocks reduce latency and offload CPU in optical transport systems |
| DDR4 Memory Controller | Supports up to 2,400 MT/s on 16-bit interfaces with ECC, enabling reliable high-speed memory interfacing |
| Partial Reconfiguration | Allows dynamic logic module swapping without full device reboot, critical for adaptive radio and mission-critical systems |
| GTY Transceivers | 32.75 Gb/s PAM4-capable transceivers with built-in PRBS generators and eye monitors for production testability |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar front-ends. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; ARM cores run tracking algorithms and network stack. Use Value: 4,520 DSP slices enable simultaneous multi-beam processing at sub-microsecond latency. | Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 5G NR macro base stations. IC Role / Device Role / Timing Role: Programmable logic implements low-latency DPD lookup tables and interpolation engines; GTY transceivers interface to RFICs. Use Value: 32.75 Gb/s transceivers support direct connection to wideband RF sampling DACs/ADCs without retiming. |
| High-Performance Computing Acceleration | Optical Transport Network Line Cards |
Use Scenario: Offloading matrix multiplication and sparse tensor operations in edge inference servers. IC Role / Device Role / Timing Role: Logic fabric configures as custom systolic array; DDR4 controller manages 128 GB/s memory bandwidth. Use Value: 72.5 Mb block RAM provides on-die buffer space for multi-layer neural network activation caching. | Use Scenario: OTU4 framing, FEC decoding, and client multiplexing in 100G/200G line cards. IC Role / Device Role / Timing Role: Hardened 100G Ethernet IP handles OTU4 overhead insertion and RS(255,239) FEC in hardware. Use Value: Eliminates need for external FEC ASIC, reducing BOM count and power by 3.2 W typical. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1760I | Higher speed grade (-2), 68 W TDP, same logic resources and I/O count | Required for designs needing >250 MHz system clocks or tighter timing closure margins | Select when timing budget is constrained and thermal headroom allows higher power |
| XCKU115-2FLVD1924E | Smaller logic capacity (1,124K LC), different package (1924-pin FLVD), lower transceiver count (40 vs. 64) | Suitable for cost-sensitive 100G line cards where full XCKU15P resources are unused | Choose when design fits within reduced DSP slice count (3,328) and 24 GTY lanes suffice |
Compared with XCKU15P-1FFVA1760E, the -2 speed grade offers tighter timing margins at higher power, while the XCKU115 variant trades logic density and transceiver count for lower cost and thermal envelope-both require PCB redesign due to differing packages and pinouts.
Availability
XCKU15P-1FFVA1760E is available at Aetrix Electronics and suitable for radar signal conditioning, 5G baseband processing, and optical transport network equipment requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU15P-1FFVA1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Kintex UltraScale+ family delivers optimized performance-per-watt for compute-intensive, I/O-rich applications including wireless infrastructure, aerospace, and test equipment.
FAQ
What is the maximum supported data rate for GTY transceivers in XCKU15P-1FFVA1760E?
The XCKU15P-1FFVA1760E supports GTY transceivers with a maximum data rate of 32.75 Gb/s per lane. This capability enables compliance with IEEE 802.3bj CAUI-4 and CEI-11G standards. The XCKU15P-1FFVA1760E uses these transceivers for 100G Ethernet KR4/CR4 interfaces and direct RFIC connectivity in 5G systems.
Does XCKU15P-1FFVA1760E include integrated ARM processors?
Yes, the XCKU15P-1FFVA1760E integrates dual ARM Cortex-A53 application processing units with NEON and TrustZone security extensions. These processors run Linux or bare-metal firmware alongside programmable logic. The XCKU15P-1FFVA1760E uses this heterogeneous architecture to offload control-plane tasks from the FPGA fabric in radar and networking applications.
What memory interfaces does XCKU15P-1FFVA1760E support?
The XCKU15P-1FFVA1760E supports DDR4, LPDDR4, and RLDRAM3 memory interfaces via dedicated hard IP controllers. Its DDR4 controller achieves up to 2,400 MT/s with ECC support across 16-bit interfaces. The XCKU15P-1FFVA1760E leverages these interfaces for high-bandwidth data buffering in video processing and packet forwarding systems.
Is partial reconfiguration supported on XCKU15P-1FFVA1760E?
Yes, the XCKU15P-1FFVA1760E fully supports partial reconfiguration through Vivado Design Suite tools. This feature allows dynamic logic module updates without resetting the entire device. In the XCKU15P-1FFVA1760E, partial reconfiguration enables adaptive waveform changes in military radar and protocol switching in multi-standard base stations.
What is the operating temperature range for XCKU15P-1FFVA1760E?
The XCKU15P-1FFVA1760E is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification applies to the -1 speed grade in the FFVA1760 package. The XCKU15P-1FFVA1760E meets this range under defined airflow and thermal interface conditions per AMD's thermal design guidelines.
XCKU15P-1FFVA1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 512
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU15P-1FFVA1760E FAQ
1.How can I place an order for XCKU15P-1FFVA1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-1FFVA1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-1FFVA1760E reliable?
The price and inventory of XCKU15P-1FFVA1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-1FFVA1760E is usually 5 days.
3.What payment methods are accepted for XCKU15P-1FFVA1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-1FFVA1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-1FFVA1760E?
XCKU15P-1FFVA1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-1FFVA1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-1FFVA1760E?
For technical support, including XCKU15P-1FFVA1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-1FFVA1760E requirements.
6.How does Aetrix verify that XCKU15P-1FFVA1760E is sourced from the original manufacturer or authorized distributors?
All XCKU15P-1FFVA1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-1FFVA1760E meets industry standards.
7.What is the process for return or replacement of XCKU15P-1FFVA1760E?
All XCKU15P-1FFVA1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-1FFVA1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-1FFVA1760E part is unused and in its original packaging.
Return procedure for XCKU15P-1FFVA1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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