AMD XCKU15P-1FFVA1760I

Overview

XCKU15P-1FFVA1760I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,083K logic cells, 72.5 Mb of block RAM, and 4,520 DSP slices. It integrates dual ARM Cortex-A53 MPCore processors, supports PCIe Gen3 x16, and operates at -40°C to +100°C junction temperature for industrial and aerospace applications.

For engineers reviewing the XCKU15P-1FFVA1760I datasheet, pinout, applications, or equivalent options, key selection criteria include programmable logic density, embedded processor subsystem availability, high-speed transceiver count (32 × 25.78 Gb/s), and thermal performance in conduction-cooled environments.

Technical Context

The XCKU15P-1FFVA1760I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe, DDR4 PHY, 10/25G Ethernet MAC), and a dual-core ARM Cortex-A53 processing system running at up to 1.5 GHz. It supports DDR4-2400 memory interfaces with 16 banks and includes 32 GTY transceivers compliant with IEEE 802.3bj and CEI-28G-VSR standards.

Configuration is performed via quad-SPI, BPI, or JTAG, with secure boot support using AES-256 decryption and SHA-3 authentication. The device uses 16nm FinFET process technology and targets applications requiring deterministic low-latency signal processing and real-time control with hardware-accelerated compute.

Key Specifications

Pinout & Package

The XCKU15P-1FFVA1760I is housed in a 1760-pin FCBGA package (FFVA1760) with 0.8 mm pitch, 35 mm × 35 mm body size, and thermal lid for enhanced heat dissipation in high-power configurations.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU15P-2FFVA1760I, the XCKU15P-1FFVA1760I trades 10% timing margin for lower static power; versus XCKU085-1FFVA1517I, it adds 238K logic cells and 12.6 Mb block RAM at the cost of larger package and higher thermal envelope.

Availability

XCKU15P-1FFVA1760I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and avionics display generation requiring stable component supply across long production lifecycles.

Supply support for XCKU15P-1FFVA1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge applications.

The Kintex UltraScale+ family delivers optimized balance of logic capacity, I/O bandwidth, and power efficiency for demanding signal processing, networking, and real-time control applications.

FAQ

What is the maximum supported DDR4 data rate for XCKU15P-1FFVA1760I?

The XCKU15P-1FFVA1760I supports DDR4-2400 (1200 MHz) with 64-bit bus width and on-die termination. Its hardened memory controller includes write-leveling, read-leveling, and gate training to ensure signal integrity at full speed across all 16 banks. This capability is validated per JEDEC DDR4 specification and documented in UG576 v1.14.

Does XCKU15P-1FFVA1760I support PCIe Gen4?

No, the XCKU15P-1FFVA1760I integrates a hardened PCIe Gen3 x16 endpoint/root complex controller only. It does not support PCIe Gen4 signaling or link training. Designs requiring Gen4 must use Versal ACAP or newer Kria KV260 derivatives, as confirmed in DS923 v1.22 Section 3.2.

What thermal solution is recommended for XCKU15P-1FFVA1760I in continuous 100% utilization?

A vapor chamber heatsink with ≥0.15°C/W thermal resistance and forced airflow ≥300 LFM is recommended for XCKU15P-1FFVA1760I under full load. The FFVA1760 package includes a copper thermal lid; thermal interface material must be applied per Xilinx AR#69422 guidelines to maintain junction temperature ≤100°C.

Can XCKU15P-1FFVA1760I be configured via JTAG only, or are other methods required?

XCKU15P-1FFVA1760I supports multiple configuration modes: JTAG, quad-SPI flash, and BPI parallel NOR flash. JTAG is sufficient for debugging and initial programming, but production deployment typically uses quad-SPI for faster boot and secure bitstream encryption. All modes are detailed in UG470 v1.11.

Is partial reconfiguration supported on XCKU15P-1FFVA1760I, and what tools enable it?

Yes, partial reconfiguration is fully supported on XCKU15P-1FFVA1760I using Vivado Design Suite 2022.2 or later. It requires hierarchical design partitioning, checkpoint-based implementation, and PR-enabled bitstream generation. Verified use cases include dynamic filter bank switching in SDR and runtime accelerator swapping in AI inference engines.