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AMD XCKU15P-1FFVE1517E
- Part No.:
- XCKU15P-1FFVE1517E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU15P-1FFVE1517E.pdf
- Description:
- IC FPGA 512 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,070
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Product details
Overview
XCKU15P-1FFVE1517E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,024,000 logic cells, 6,480 DSP slices, and 72.5 Mb of block RAM. It supports PCIe Gen4 x16, 25.8 Gb/s transceivers, and DDR4 memory interfaces up to 2400 MT/s. It is deployed in high-bandwidth data center acceleration and 5G radio unit baseband processing.
For engineers reviewing the XCKU15P-1FFVE1517E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, DSP slice count, I/O voltage support (1.2 V/1.35 V/1.8 V), and thermal design power (TDP) under sustained operation.
Technical Context
The XCKU15P-1FFVE1517E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, and integrated ARM Cortex-R5F processors for real-time control. It uses 16 nm FinFET process technology and supports partial reconfiguration.
Its I/O bank structure supports mixed-voltage operation across 24 banks, with SelectIO™ standards including LVCMOS, SSTL, HSTL, and differential signaling (LVDS, BLVDS, TMDS). Configuration is performed via quad-SPI, BPI, or JTAG interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,024,000 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 6,480 - enables high-throughput fixed/floating-point computation for signal processing pipelines |
| Block RAM | 72.5 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external DRAM |
| Transceiver Max Rate | 25.8 Gb/s - supports 100G/200G/400G Ethernet and CPRI/eCPRI in wireless infrastructure |
| I/O Standards | LVCMOS, SSTL, HSTL, LVDS, TMDS - enables direct interfacing with DDR4, flash, sensors, and SerDes PHYs |
| TDP (Typical) | 35 W - defines thermal envelope requiring active cooling in dense PCB layouts |
| Configuration Interface | Quad-SPI/BPI/JTAG - determines boot source flexibility and in-system programming capability |
Pinout & Package
The XCKU15P-1FFVE1517E is housed in a 1517-ball Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 0.8 mm pitch, designed for high-density routing and thermal dissipation in multi-layer PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, or I2C for peripheral control and debug |
| GTYP[0:31] | High-speed transceiver | Supports 25.8 Gb/s serial links with built-in clock recovery and equalization |
| PL_CLK[0:3] | Programmable logic clock input | Provides reference clocks for logic fabric timing domains and PLL/MMCM configuration |
| VRP/VRN | Reference voltage pins | Set I/O bank voltage thresholds for SSTL/HSTL termination and signal integrity calibration |
| VCCINT/VCCAUX/VCCO | Power supply rails | Separate 0.85 V (core), 1.8 V (aux), and 1.2–1.8 V (I/O) supplies enable low-noise operation |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous compute architecture | Combines FPGA fabric, hardened PCIe Gen4, Ethernet, and dual-core ARM Cortex-R5F for control + acceleration partitioning |
| Partial reconfiguration support | Enables dynamic logic swapping without full device reset-critical for mission-critical telecom and radar systems |
| UltraScale+ memory interface | Native DDR4 controller supporting 2400 MT/s with ECC and address/command bus training |
| Advanced security features | Includes AES-256 bitstream encryption, HMAC authentication, and secure boot with eFUSE key storage |
| Thermal-aware packaging | FFVE package with thermal lid and copper pillar interconnects sustains 35 W TDP at junction temperatures ≤100°C |
Applications
| 5G Massive MIMO Baseband Processing | Data Center SmartNIC Offload |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and OFDM modulation/demodulation in 5G NR gNodeB units. IC Role / Device Role / Timing Role: Primary programmable accelerator handling Layer 1 PHY processing with deterministic latency under 5 µs. Use Value: 6,480 DSP slices and 25.8 Gb/s transceivers enable concurrent processing of 64 antenna streams at 100 MHz bandwidth. | Use Scenario: Hardware-accelerated packet classification, TLS offload, and RDMA transport in cloud server NICs. IC Role / Device Role / Timing Role: Co-processor tightly coupled to host CPU via PCIe Gen4 x16, managing data path while freeing CPU cycles. Use Value: Native PCIe Gen4 hard IP reduces latency to <150 ns and delivers >25 GB/s bidirectional throughput. |
| Radar Signal Processing | High-Frequency Trading Engine |
Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture imaging in airborne radar systems. IC Role / Device Role / Timing Role: Real-time streaming accelerator with deterministic timing for ADC/DAC interface and FFT pipeline execution. Use Value: 72.5 Mb block RAM buffers full chirp sequences; 1,024,000 logic cells implement parallel FFT engines with sub-cycle latency. | Use Scenario: Ultra-low-latency order matching, risk calculation, and market data parsing in exchange co-location racks. IC Role / Device Role / Timing Role: Deterministic hardware engine synchronizing to PTP grandmaster clock with sub-10 ns jitter tolerance. Use Value: 25.8 Gb/s transceivers interface directly to 100G Ethernet switches; hardened time-stamping IP ensures nanosecond timestamp accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVE1517I | Higher speed grade (-2): 30% faster timing closure margin and 10% higher transceiver stable operating frequency | Suitable for designs requiring worst-case 25.8 Gb/s operation at -40°C to +100°C ambient | Select when guaranteed timing closure at industrial temperature range is required; higher static power consumption |
| XCKU085-1FFVA1156E | Smaller footprint (1156-ball), 850K logic cells, 5,400 DSP slices, same transceiver spec but fewer GTY quads | Targeted at cost-optimized 5G small cells and edge AI inference where full XCKU15P capacity is unused | Choose for lower BOM cost and reduced PCB layer count when logic and DSP resource utilization stays below 80% |
Compared with XCKU15P-1FFVE1517E, the -2 speed grade offers tighter timing margins for extreme environments, while the XCKU085-1FFVA1156E trades capacity and I/O count for cost and board space savings-neither is pin-compatible, requiring layout revision.
Availability
XCKU15P-1FFVE1517E is available at Aetrix Electronics and suitable for 5G infrastructure, high-performance computing, and defense electronics requiring stable component supply over extended product lifecycles.
Supply support for XCKU15P-1FFVE1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets with emphasis on performance-per-watt and heterogeneous integration.
The Kintex UltraScale+ family targets high-throughput, low-latency acceleration in communications, test & measurement, and aerospace applications where reconfigurable logic meets hardened protocol engines.
FAQ
What is the maximum supported DDR4 data rate for XCKU15P-1FFVE1517E?
The XCKU15P-1FFVE1517E integrates a hardened DDR4 memory controller supporting up to 2400 MT/s with on-die termination, write leveling, and read/write leveling calibration. This specification is validated across all speed grades and applies to both single-rank and dual-rank DIMMs with appropriate PCB stack-up and signal integrity design.
Does XCKU15P-1FFVE1517E include integrated ARM processors?
Yes, the XCKU15P-1FFVE1517E includes dual-core ARM Cortex-R5F processors running at up to 600 MHz, with tightly coupled L1 cache, error-correcting memory, and dedicated AXI interfaces to programmable logic. These processors manage system initialization, real-time control, and firmware-driven configuration of the FPGA fabric.
What transceiver protocols are natively supported by XCKU15P-1FFVE1517E?
XCKU15P-1FFVE1517E natively supports PCIe Gen4 x16, 100G/200G/400G Ethernet (using RS-FEC and KR/KR4), CPRI, and OTN. Protocol support is implemented in hardened GTY transceiver blocks with built-in gearbox, clock correction, and elastic buffer logic-no soft logic resources required.
Is partial reconfiguration supported on XCKU15P-1FFVE1517E?
Yes, XCKU15P-1FFVE1517E fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic logic module swapping during runtime. This capability is used in radar and telecom systems to update signal processing pipelines without interrupting system operation or resetting the entire device.
What are the power supply requirements for XCKU15P-1FFVE1517E?
XCKU15P-1FFVE1517E requires three primary supplies: VCCINT at 0.85 V ±3%, VCCAUX at 1.8 V ±3%, and VCCO per I/O bank (1.2 V, 1.35 V, or 1.8 V depending on standard). Each rail must meet transient current demands specified in the device's DC and switching characteristics table.
XCKU15P-1FFVE1517E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 512
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU15P-1FFVE1517E FAQ
1.How can I place an order for XCKU15P-1FFVE1517E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-1FFVE1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-1FFVE1517E reliable?
The price and inventory of XCKU15P-1FFVE1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-1FFVE1517E is usually 5 days.
3.What payment methods are accepted for XCKU15P-1FFVE1517E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-1FFVE1517E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-1FFVE1517E?
XCKU15P-1FFVE1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-1FFVE1517E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-1FFVE1517E?
For technical support, including XCKU15P-1FFVE1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-1FFVE1517E requirements.
6.How does Aetrix verify that XCKU15P-1FFVE1517E is sourced from the original manufacturer or authorized distributors?
All XCKU15P-1FFVE1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-1FFVE1517E meets industry standards.
7.What is the process for return or replacement of XCKU15P-1FFVE1517E?
All XCKU15P-1FFVE1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-1FFVE1517E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-1FFVE1517E part is unused and in its original packaging.
Return procedure for XCKU15P-1FFVE1517E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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