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AMD XCKU15P-1FFVE1517I
- Part No.:
- XCKU15P-1FFVE1517I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU15P-1FFVE1517I.pdf
- Description:
- IC FPGA 512 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,035
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Product details
Overview
XCKU15P-1FFVE1517I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,024K logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It supports PCIe Gen4 x16, 25.8 Gb/s transceivers, and DDR4 memory interfaces up to 2400 MT/s. Used in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU15P-1FFVE1517I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed grade, I/O bank voltage support, thermal design power budget, and configuration interface options.
Technical Context
The XCKU15P-1FFVE1517I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, 100G Ethernet MAC, and UltraScale+ memory controllers. It integrates dual ARM Cortex-A53 processors for embedded processing and supports partial reconfiguration.
Configuration is performed via quad-SPI, BPI, or JTAG, with bitstream encryption and HMAC authentication enabled. The device operates across industrial temperature range (–40°C to +100°C) and uses 0.85 V core voltage with multiple I/O standards including LVDS, SSTL, and HSTL.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,024,000 - total configurable LUTs and flip-flops for complex digital logic implementation |
| DSP Slices | 5,520 - dedicated arithmetic units supporting 27×18-bit multiply-accumulate per slice |
| Block RAM | 64.2 Mb - distributed as 36 Kb BRAM primitives for on-chip data buffering and FIFOs |
| Transceiver Speed | 25.78125 Gb/s - maximum line rate per GTY transceiver channel, compliant with IEEE 802.3bj |
| PCIe Interface | Gen4 x16 - hard IP supporting root complex and endpoint roles with AXI4 streaming interface |
| Memory Support | DDR4-2400 - 16 banks at 2400 MT/s with integrated memory controller and calibration logic |
| Config Interface | Quad-SPI/BPI/JTAG - primary configuration modes with secure bitstream loading and authentication |
Pinout & Package
Package: 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:7] | Multiplexed I/O | ARM processor peripheral interface pins supporting SDIO, UART, SPI, I2C, and GPIO functions |
| HP[0:7]_IO[0:71] | High-Performance I/O Bank | 72 pins per bank supporting 1.8 V/1.5 V/1.35 V/1.25 V I/O standards with programmable slew and drive strength |
| GTY_TX/RX[0:31] | Transceiver Lane | 32 differential GTY transceiver channels, each with independent TX/RX termination and equalization control |
| VRP/VRN | Reference Voltage | Dedicated analog reference pins for I/O bank voltage calibration and termination matching |
| CONFIG_M[2:0] | Configuration Mode | 3-pin strap defining boot source: Quad-SPI, BPI, JTAG, or fallback mode selection |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Processing | Integrated dual-core ARM Cortex-A53 with NEON and TrustZone, enabling Linux-capable embedded control alongside FPGA logic |
| Hardened PCIe Gen4 | Full x16 link capability with integrated TLP parsing, credit management, and MSI-X support-no soft IP resource cost |
| UltraScale+ Memory Controller | Supports DDR4, LPDDR4, and RLDRAM3 with automatic calibration, ECC, and AXI4 interface for deterministic latency |
| Secure Configuration | AES-256 bitstream encryption and HMAC-based authentication prevent unauthorized programming and cloning |
| Partial Reconfiguration | Dynamic logic module swapping without system reset, enabling runtime adaptation in radar and comms applications |
Applications
| Radar Signal Processing | 5G Baseband Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency FFTs and CFAR detection; ARM cores manage system control and data transport. Use Value: 25.8 Gb/s GTY transceivers feed ADC/DAC data directly into processing pipelines, eliminating external buffering and reducing end-to-end latency by >30%. | Use Scenario: Layer 1 PHY acceleration for massive MIMO base stations operating in FR1 (sub-6 GHz) bands. IC Role / Device Role / Timing Role: Hardened 100G Ethernet MAC and PCIe Gen4 x16 interface enable fronthaul/backhaul offload and host CPU co-processing. Use Value: 5,520 DSP slices deliver >1.2 TMAC/s for LDPC decoding and OFDM modulation, meeting 3GPP Release 16 throughput targets. |
| High-Frequency Trading Engine | Medical Imaging Reconstruction |
Use Scenario: Deterministic packet processing and ultra-low-latency order execution in financial exchange gateways. IC Role / Device Role / Timing Role: FPGA logic performs nanosecond-precision timestamping, packet classification, and custom protocol translation. Use Value: Sub-10 ns timing resolution across I/O banks ensures consistent latency under full load, critical for arbitrage window compliance. | Use Scenario: Real-time iterative reconstruction of CT and MRI volumetric datasets using compressed sensing algorithms. IC Role / Device Role / Timing Role: Block RAM and DSP resources accelerate sparse matrix operations; DDR4-2400 interface sustains >128 GB/s memory bandwidth. Use Value: On-chip 64.2 Mb RAM buffers full sinogram frames, avoiding external DRAM round-trips and cutting reconstruction time by 40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVE1517I | Higher speed grade (–2 vs –1), enabling 30.54 Gb/s GTY operation and 2666 MT/s DDR4 | Suitable for designs requiring maximum transceiver bandwidth or tighter timing closure margins | Select when target clock frequencies exceed –1 grade limits; requires updated timing constraints and power delivery validation |
| XCKU085-1FFVA1156I | Smaller footprint (1156-pin FCBGA), 850K logic cells, 4,032 DSP slices, same speed grade and temperature range | Better fit for space-constrained or cost-sensitive deployments where full XCKU15P capacity is unused | Choose when design utilizes ≤85% of XCKU15P resources; enables PCB area reduction and lower BOM cost |
Compared with XCKU15P-1FFVE1517I, the –2 speed grade variant delivers higher transceiver and memory bandwidth at increased power and timing margin requirements, while the XCKU085 offers identical speed grade and thermal rating in a smaller package with reduced logic and DSP capacity-enabling scalable platform design.
Availability
XCKU15P-1FFVE1517I is available at Aetrix Electronics and suitable for radar signal processing, 5G infrastructure, and medical imaging systems requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU15P-1FFVE1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in communications, test & measurement, and aerospace systems where performance-per-watt and integration density are critical.
FAQ
What is the maximum supported transceiver data rate for XCKU15P-1FFVE1517I?
The XCKU15P-1FFVE1517I supports a maximum GTY transceiver line rate of 25.78125 Gb/s, compliant with IEEE 802.3bj CAUI-4 and OTU4 standards. This rate is guaranteed under industrial temperature conditions and specified for the –1 speed grade. Higher rates require the –2 speed grade variant XCKU15P-2FFVE1517I.
Does XCKU15P-1FFVE1517I include embedded processors?
Yes, the XCKU15P-1FFVE1517I integrates a dual-core ARM Cortex-A53 MPCore processor subsystem with NEON SIMD extension and TrustZone security. These processors run Linux or bare-metal firmware and communicate with programmable logic via AXI Coherency Extensions (ACE) and AXI4 interfaces.
What configuration modes does XCKU15P-1FFVE1517I support?
XCKU15P-1FFVE1517I supports Quad-SPI, BPI, and JTAG configuration modes. Mode selection is controlled by the CONFIG_M[2:0] pin strapping. Secure configuration with AES-256 encryption and HMAC authentication is available in all modes, and fallback configuration is supported via secondary SPI flash.
Is partial reconfiguration supported on XCKU15P-1FFVE1517I?
Yes, XCKU15P-1FFVE1517I fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of logic modules without resetting the entire device, enabling runtime adaptation in applications such as multi-standard wireless base stations and reconfigurable radar waveforms.
What I/O standards are supported by the HP I/O banks on XCKU15P-1FFVE1517I?
The HP I/O banks on XCKU15P-1FFVE1517I support LVDS, mini-LVDS, RSDS, BLVDS, SSTL, HSTL, POD, and DIFF_HSTL across voltage ranges from 1.8 V down to 1.25 V. Each bank has independent VCCO and VREF settings, and programmable output drive strength and slew rate.
XCKU15P-1FFVE1517I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 512
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU15P-1FFVE1517I FAQ
1.How can I place an order for XCKU15P-1FFVE1517I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-1FFVE1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-1FFVE1517I reliable?
The price and inventory of XCKU15P-1FFVE1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-1FFVE1517I is usually 5 days.
3.What payment methods are accepted for XCKU15P-1FFVE1517I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-1FFVE1517I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-1FFVE1517I?
XCKU15P-1FFVE1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-1FFVE1517I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-1FFVE1517I?
For technical support, including XCKU15P-1FFVE1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-1FFVE1517I requirements.
6.How does Aetrix verify that XCKU15P-1FFVE1517I is sourced from the original manufacturer or authorized distributors?
All XCKU15P-1FFVE1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-1FFVE1517I meets industry standards.
7.What is the process for return or replacement of XCKU15P-1FFVE1517I?
All XCKU15P-1FFVE1517I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-1FFVE1517I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-1FFVE1517I part is unused and in its original packaging.
Return procedure for XCKU15P-1FFVE1517I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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