My Inquiry
My Account
AMD XCKU15P-1FFVE1760E
- Part No.:
- XCKU15P-1FFVE1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU15P-1FFVE1760E.pdf
- Description:
- IC FPGA 668 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,822
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCKU15P-1FFVE1760E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,083K logic cells, 72.5 Mb of block RAM, and 4,520 DSP slices, operating at -1 speed grade with 0.85V core voltage; used in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU15P-1FFVE1760E datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (832 HP/HR), transceiver line rate (32.75 Gb/s), thermal design power (59W), and package footprint compatibility with FFVE1760.
Technical Context
The XCKU15P-1FFVE1760E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4 x16, 100G Ethernet MAC, DDR4 PHY), and multi-rate transceivers supporting PAM4 and NRZ modulation. It supports partial reconfiguration and AXI4-Stream interfaces for dynamic system adaptation.
Targeted at low-latency compute acceleration, the device includes 168 GTY transceivers with built-in FEC and clock correction, and supports JTAG, SelectMAP, and QSPI configuration modes with dual-boot capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,083,000 - total available LUT-based fabric resources for custom logic implementation |
| Block RAM | 72.5 Mb - on-chip memory for FIFOs, buffers, and local data storage without external DRAM |
| DSP Slices | 4,520 - fixed-point and floating-point arithmetic units optimized for filtering and matrix operations |
| Transceivers | 168 GTY - 32.75 Gb/s serial I/O supporting PCIe Gen4, 100G Ethernet, and CPRI |
| I/O Pins | 832 - configurable HP (1.8/1.5/1.35V) and HR (3.3/2.5/1.8V) banks with slew rate control |
| Speed Grade | -1 - guaranteed timing performance at 0.85V core voltage and industrial temperature range |
| TDP | 59 W - maximum thermal dissipation under worst-case switching activity and voltage conditions |
Pinout & Package
Package: 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVE1760), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, with 28 thermal balls and dedicated VCCINT/VCCAUX/VCCO power delivery networks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:7] | Multifunction I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS-side peripherals |
| HP[0:7][0:71] | High-Performance I/O Bank | Supports 1.35V/1.5V/1.8V signaling; enables DDR4, LPDDR4, and high-speed SerDes interfaces |
| HR[0:3][0:71] | High-Density I/O Bank | 3.3V/2.5V/1.8V tolerant; suitable for legacy parallel buses and industrial interfaces |
| GTY_TX/RX[0:167] | Multi-rate Transceiver Lane | Each pair supports 1–32.75 Gb/s NRZ/PAM4; includes CDR, gearbox, and PRBS generator |
| VCCINT_00–VCCINT_15 | Core Power Supply | 16 dedicated 0.85V power inputs with decoupling requirements per AMD UG578 |
| CLK_IN1_P/N | Dedicated Clock Input | Differential input for primary system clock; routed to MMCM/PLL clock networks |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Integration | Combines programmable logic, hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 PHY in single die |
| Partial Reconfiguration | Enables dynamic logic swapping without full device reset; reduces system downtime in mission-critical applications |
| UltraScale+ Architecture | Uses 16nm FinFET process with enhanced routing interconnect and lower dynamic power vs. 28nm predecessors |
| Advanced Security | Includes AES-256 bitstream encryption, HMAC authentication, and secure boot with eFUSE key storage |
| Thermal Management | On-die temperature sensor with alert output and dynamic thermal throttling support via PMBus interface |
Applications
| 5G Wireless Baseband Processing | Financial Algorithm Acceleration |
|---|---|
Use Scenario: Real-time channel coding, massive MIMO precoding, and Layer 1 protocol stack offload in gNodeB units. IC Role / Device Role / Timing Role: Primary compute engine implementing LTE/NR physical layer functions with deterministic sub-microsecond latency. Use Value: 4,520 DSP slices and 168 GTY transceivers enable concurrent 100G CPRI and 32.75 Gb/s fronthaul link processing. | Use Scenario: Low-latency options pricing, risk modeling, and order matching in co-located trading systems. IC Role / Device Role / Timing Role: Hardware-accelerated compute node interfacing directly to FPGA-optimized market data feeds and exchange APIs. Use Value: Sub-200 ns round-trip latency achieved using AXI4-Stream pipelines and on-chip 72.5 Mb RAM for order book caching. |
| AI Inference at Edge | Test & Measurement Equipment |
Use Scenario: Real-time video analytics and object detection on factory floor vision systems with multi-camera input. IC Role / Device Role / Timing Role: Vision preprocessing and neural network inference accelerator with integrated MIPI CSI-2 receivers and DDR4 controller. Use Value: 1,083K logic cells support custom CNN architectures; HP I/O banks interface to four 12-bit 120 fps image sensors. | Use Scenario: High-resolution oscilloscope front-end with 10 GS/s sampling and real-time FFT analysis. IC Role / Device Role / Timing Role: Digital signal processor and pattern generator controlling ADC/DAC chains and managing waveform memory. Use Value: Block RAM enables 256 MSample deep acquisition buffer; GTY transceivers stream captured data to host PC at 32 Gb/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVE1760E | Faster speed grade (-2) with higher timing margin; requires 0.85V core but tighter voltage tolerance (±2%) | Suitable for designs demanding >500 MHz system clocks or extended temperature operation | Select when timing closure fails at -1 grade or when operating above 85°C ambient |
| XCKU085-1FFVA1517E | Smaller density (845K LC), same FFVA1517 package; lacks GTY transceivers (uses GTH only, max 16.3 Gb/s) | Applicable where 100G connectivity is not required and board space is constrained | Choose for cost-sensitive deployments with lower bandwidth and logic resource needs |
Compared with XCKU15P-1FFVE1760E, the -2 variant offers improved timing headroom at identical power, while the XCKU085 provides reduced logic and transceiver capability in a smaller footprint-both require PCB redesign due to different ball maps and power delivery requirements.
Availability
XCKU15P-1FFVE1760E is available at Aetrix Electronics and suitable for 5G infrastructure, financial trading hardware, and AI edge inference systems requiring stable component supply across multi-year production cycles.
Supply support for XCKU15P-1FFVE1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex UltraScale+ family delivers high-performance, power-optimized FPGA solutions targeting 100G+ networking, radar, and real-time signal processing applications.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCKU15P-1FFVE1760E?
The XCKU15P-1FFVE1760E supports up to 32.75 Gb/s per GTY transceiver lane using NRZ encoding, and 58 Gb/s using PAM4 modulation. This capability enables direct 100G Ethernet and CPRI interfaces without gearbox logic. The transceivers comply with IEEE 802.3bs and OIF CEI-11G standards as documented in AMD UG578 v1.14.
Does XCKU15P-1FFVE1760E support partial reconfiguration?
Yes, XCKU15P-1FFVE1760E fully supports partial reconfiguration through Vivado Design Suite v2023.1+. This allows dynamic swapping of logic modules while keeping the rest of the design operational. Use cases include runtime protocol adaptation in test equipment and firmware-upgradable signal processing pipelines in radar systems.
What configuration modes are supported by XCKU15P-1FFVE1760E?
XCKU15P-1FFVE1760E supports JTAG, Master/Slave SelectMAP, and Quad-SPI configuration modes, with dual-boot capability enabling fail-safe firmware updates. Configuration bitstreams can be loaded from external flash or through PCIe during runtime. All modes are validated per AMD UG470 and require specific pin strapping during power-up.
What is the thermal design power (TDP) of XCKU15P-1FFVE1760E?
The thermal design power of XCKU15P-1FFVE1760E is 59 W under worst-case operating conditions (100% logic toggle, 0.85V VCCINT, 85°C junction temperature). Actual power varies with design utilization and I/O activity; AMD Power Estimator tool v2023.1 provides accurate estimates based on HDL synthesis reports and pin constraints.
Is XCKU15P-1FFVE1760E pin-compatible with other Kintex UltraScale+ devices?
No, XCKU15P-1FFVE1760E uses the FFVE1760 package, which is unique to this density and speed grade within the Kintex UltraScale+ family. Devices like XCKU085 use FFVA1517, and XCKU115 uses FFVB1760-each has distinct ball maps, power pin allocations, and thermal pad layouts requiring separate PCB designs.
XCKU15P-1FFVE1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 668
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU15P-1FFVE1760E FAQ
1.How can I place an order for XCKU15P-1FFVE1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-1FFVE1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-1FFVE1760E reliable?
The price and inventory of XCKU15P-1FFVE1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-1FFVE1760E is usually 5 days.
3.What payment methods are accepted for XCKU15P-1FFVE1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-1FFVE1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-1FFVE1760E?
XCKU15P-1FFVE1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-1FFVE1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-1FFVE1760E?
For technical support, including XCKU15P-1FFVE1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-1FFVE1760E requirements.
6.How does Aetrix verify that XCKU15P-1FFVE1760E is sourced from the original manufacturer or authorized distributors?
All XCKU15P-1FFVE1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-1FFVE1760E meets industry standards.
7.What is the process for return or replacement of XCKU15P-1FFVE1760E?
All XCKU15P-1FFVE1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-1FFVE1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-1FFVE1760E part is unused and in its original packaging.
Return procedure for XCKU15P-1FFVE1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU15P-1FFVE1760E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
