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AMD XCKU15P-1FFVE1760I
- Part No.:
- XCKU15P-1FFVE1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU15P-1FFVE1760I.pdf
- Description:
- IC FPGA 668 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,260
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Product details
Overview
XCKU15P-1FFVE1760I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,085,000 logic cells, 5,425 DSP slices, and 72.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for high-bandwidth data acceleration in AI inference accelerators and 5G radio units.
For engineers reviewing the XCKU15P-1FFVE1760I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal performance under sustained 28W TDP, and configuration interface options (e.g., dual BPI, QSPI, JTAG).
Technical Context
The XCKU15P-1FFVE1760I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including 25.8 Gb/s GTY transceivers, UltraScale+ memory controllers, and PCIe Gen4 x16 root port endpoints. It supports DDR4-2400 and LPDDR4-4266 memory interfaces with integrated PHYs.
Configuration is supported via Master SPI, Slave SelectMAP, or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device operates across industrial temperature range (–40°C to +100°C) and requires multi-rail power sequencing (VCCINT, VCCAUX, VCCBRAM, VCCO).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,085,000 - determines maximum combinational/sequential logic capacity for complex RTL implementation |
| DSP Slices | 5,425 - enables high-throughput fixed/floating-point computation for signal processing pipelines |
| Block RAM | 72.5 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external DRAM |
| GTY Transceivers | 40 lanes @ 25.8 Gb/s - supports 100G Ethernet, CPRI/eCPRI, and high-speed serial backplane links |
| PCIe Interface | Gen4 x16 endpoint/root port - delivers 32 GB/s bidirectional bandwidth for host-attached acceleration |
| Memory Support | DDR4-2400 / LPDDR4-4266 - enables low-latency, high-bandwidth memory subsystems with integrated controller and PHY |
| TDP | 28 W typical - defines thermal envelope requiring active cooling and PCB copper pour design |
Pinout & Package
The XCKU15P-1FFVE1760I is housed in a 1760-pin FCBGA package (FFVE1760) with 0.8 mm pitch, designed for high-density interconnect and thermal dissipation via exposed thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to 0.89 V to programmable logic and CLBs; requires tight regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, clock management, and transceiver analog circuitry |
| VCCO_0 | I/O bank power | Configurable 1.2–1.8 V per bank; enables mixed-voltage I/O interfacing (e.g., LVDS, SSTL, HSTL) |
| MGTAVCC | GTY analog supply | 1.0 V analog rail for GTY transceiver PLLs and serializers; sensitive to noise and ripple |
| CONFIG_IO | Configuration interface | Supports Master SPI, Slave SelectMAP, or JTAG; pins must be pulled correctly for reliable bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 | Reduces RTL integration effort and timing closure risk for host-connected accelerator designs |
| 25.8 Gb/s GTY transceivers | Enables direct 100G Ethernet KR4 or 4×25G SR4 optical interface without gearbox ICs |
| AES-256 bitstream encryption | Protects proprietary FPGA configuration against cloning and reverse engineering in deployed systems |
| UltraScale+ memory controller | Delivers deterministic latency and 38.4 GB/s peak bandwidth to DDR4/LPDDR4 memory |
| Multi-rail power sequencing | Ensures safe power-up/power-down transitions across 7 independent supply domains |
Applications
| AI Inference Accelerator | 5G Massive MIMO Radio Unit |
|---|---|
Use Scenario: Real-time neural network inference at edge data centers with low latency and high throughput. IC Role / Device Role / Timing Role: Programmable acceleration engine executing custom quantized CNN layers and dataflow scheduling logic. Use Value: 5,425 DSP slices and 72.5 Mb block RAM enable on-chip weight caching and parallel MAC accumulation without off-chip memory bottlenecks. | Use Scenario: Digital front-end (DFE) and physical layer (PHY) processing in 5G NR base stations with 64T64R antenna arrays. IC Role / Device Role / Timing Role: Baseband processor handling OFDM modulation/demodulation, channel estimation, and beamforming matrix computation. Use Value: 40×25.8 Gb/s GTY transceivers support CPRI/eCPRI fronthaul links and JESD204B/C interfaces to high-speed ADC/DACs. |
| High-Performance Computing Interconnect | Test & Measurement Instrumentation |
Use Scenario: FPGA-to-FPGA and FPGA-to-GPU coherent interconnect in disaggregated server architectures. IC Role / Device Role / Timing Role: PCIe Gen4 x16 root complex bridging CPU memory space to remote FPGA-accelerated memory pools. Use Value: Hardened PCIe Gen4 x16 endpoint reduces latency to sub-500 ns and eliminates soft IP timing closure challenges. | Use Scenario: Real-time signal analysis in high-resolution oscilloscopes and spectrum analyzers with >10 GS/s sampling. IC Role / Device Role / Timing Role: High-speed data capture engine synchronizing multiple ADC channels and performing FFT-based spectral decomposition. Use Value: 1,085,000 logic cells support deep pipeline FFT engines and real-time trigger pattern matching on 16-bit wide streams. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVE1760I | Higher speed grade (–2): supports 30% higher clock frequencies and tighter timing margins | Required for designs exceeding 300 MHz system clocks or demanding 25.8 Gb/s transceiver PAM4 operation | Select when timing closure fails at –1 speed grade or when operating transceivers beyond NRZ mode |
| XCKU085-1FFVA1517I | Smaller footprint (1517-pin), lower logic count (845K LC), same GTY transceiver spec but only 24 lanes | Suitable for cost-optimized 5G small cells or mid-tier AI inference where full XCKU15P capacity is unused | Choose for reduced BOM cost and simpler thermal management when logic and transceiver demand is ≤80% of XCKU15P-1FFVE1760I |
Compared with XCKU15P-1FFVE1760I, the –2 speed grade offers headroom for aggressive timing closure and PAM4 signaling, while the XCKU085-1FFVA1517I trades capacity and lane count for lower cost and thermal density-enabling tiered platform scaling without architectural redesign.
Availability
XCKU15P-1FFVE1760I is available at Aetrix Electronics and suitable for AI inference accelerators, 5G radio units, and high-performance computing interconnects requiring stable component supply across multi-year production cycles.
Supply support for XCKU15P-1FFVE1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and client applications.
The Kintex UltraScale+ family targets high-throughput, low-latency acceleration in communications infrastructure, test equipment, and AI edge systems-balancing performance, power efficiency, and I/O flexibility.
FAQ
What is the maximum supported transceiver data rate for XCKU15P-1FFVE1760I?
The XCKU15P-1FFVE1760I supports GTY transceivers rated up to 25.8 Gb/s per lane in NRZ mode. This specification is validated across the industrial temperature range and applies to all 40 GTY transceiver quads on the device. Operation above 25.8 Gb/s requires PAM4 encoding and is not supported by the XCKU15P-1FFVE1760I.
Does XCKU15P-1FFVE1760I support PCIe Gen5?
No, XCKU15P-1FFVE1760I does not support PCIe Gen5. It integrates hardened PCIe Gen4 x16 root port and endpoint logic, with a maximum link speed of 16 GT/s. PCIe Gen5 (32 GT/s) capability is not implemented in the UltraScale+ architecture and is exclusive to Versal ACAP devices.
What configuration modes are supported by XCKU15P-1FFVE1760I?
XCKU15P-1FFVE1760I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Dual configuration images can be stored in external flash and selected via mode pins. Bitstream authentication via HMAC-SHA256 and decryption via AES-256 are enabled in all modes.
Is XCKU15P-1FFVE1760I pin-compatible with other Kintex UltraScale+ devices?
No, XCKU15P-1FFVE1760I is not pin-compatible with other Kintex UltraScale+ devices due to its unique 1760-pin FFVE package and I/O bank arrangement. Migration between variants requires PCB redesign. Pin compatibility is only guaranteed within the same FFVE1760 package option across speed grades (e.g., –1 and –2).
What is the thermal design power (TDP) of XCKU15P-1FFVE1760I?
The typical thermal design power (TDP) of XCKU15P-1FFVE1760I is 28 W under worst-case operating conditions, including full logic utilization, 40 GTY transceivers active at 25.8 Gb/s, and DDR4 memory controller running at 2400 MT/s. Thermal solution design must accommodate this value with junction temperature maintained below 100°C.
XCKU15P-1FFVE1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 668
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU15P-1FFVE1760I FAQ
1.How can I place an order for XCKU15P-1FFVE1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-1FFVE1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-1FFVE1760I reliable?
The price and inventory of XCKU15P-1FFVE1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-1FFVE1760I is usually 5 days.
3.What payment methods are accepted for XCKU15P-1FFVE1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-1FFVE1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-1FFVE1760I?
XCKU15P-1FFVE1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-1FFVE1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-1FFVE1760I?
For technical support, including XCKU15P-1FFVE1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-1FFVE1760I requirements.
6.How does Aetrix verify that XCKU15P-1FFVE1760I is sourced from the original manufacturer or authorized distributors?
All XCKU15P-1FFVE1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-1FFVE1760I meets industry standards.
7.What is the process for return or replacement of XCKU15P-1FFVE1760I?
All XCKU15P-1FFVE1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-1FFVE1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-1FFVE1760I part is unused and in its original packaging.
Return procedure for XCKU15P-1FFVE1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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