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AMD XCKU15P-2FFVA1156E
- Part No.:
- XCKU15P-2FFVA1156E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU15P-2FFVA1156E.pdf
- Description:
- IC FPGA 516 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,004
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Product details
Overview
XCKU15P-2FFVA1156E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,024K logic cells, 6,480 DSP slices, and 72.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCI Express Gen4 x16, making it suitable for high-bandwidth data acceleration in AI inference accelerators.
For engineers reviewing the XCKU15P-2FFVA1156E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic density, on-chip memory bandwidth, and PCIe Gen4 compliance for heterogeneous compute offload designs.
Technical Context
The XCKU15P-2FFVA1156E implements a segmented architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, DDR4/DDR5 controllers), and multi-rate transceivers. It supports deterministic timing closure via clock region partitioning and includes dedicated routing for AXI4-Stream and AXI4-Lite interconnects.
Its configuration interface supports dual-boot fallback via SPIx4 and JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device operates across industrial temperature range (-40°C to +100°C) with VCCINT = 0.85 V ±3% and VCCAUX = 1.8 V ±3%.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,024,000 - Enables complex RTL implementations such as multi-channel packet processing engines or real-time video encoding pipelines. |
| DSP Slices | 6,480 - Supports concurrent 27×18-bit multiply-accumulate operations at 500+ MHz for AI/ML tensor math acceleration. |
| Block RAM | 72.5 Mb - Provides on-die buffering for streaming workloads without external memory latency penalties. |
| GTY Transceivers | 40 channels @ 25.8 Gb/s - Enables direct attachment to 100G/200G Ethernet PHYs or CXP/OSFP optical modules. |
| PCIe Interface | Gen4 x16 root port or endpoint - Delivers 32 GB/s bidirectional throughput for host-CPU coherency or DMA-based data staging. |
| Memory Interfaces | DDR4-2400 & DDR5-4800 controllers - Supports up to 8 banks per controller with ECC for mission-critical buffer memory subsystems. |
Pinout & Package
The XCKU15P-2FFVA1156E is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) package with 1.0 mm ball pitch, designed for high-signal-integrity PCB layouts requiring controlled impedance routing and thermal management via exposed thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O bank | Configurable as GPIO, SDIO, UART, SPI, or I²C interfaces; supports 1.8 V/3.3 V I/O standards with programmable slew rate. |
| HP[0:63] | High-performance I/O bank | Supports DDR4/DDR5 DQ/DQS, differential signaling (LVDS, BLVDS), and sub-1.0 V swing for low-noise memory interfaces. |
| GTY_TX/RX[0:39] | Transceiver differential pair | Each pair routes full-rate 25.8 Gb/s serial data; requires AC-coupling capacitors and 100 Ω differential trace impedance. |
| CLK_IN_0/1 | Dedicated clock input | Accepts single-ended or differential reference clocks (10–750 MHz); feeds MMCM/PLL clock networks with <5 ps jitter accumulation. |
| PROGRAM_B / INIT_B | Configuration control | Active-low signals managing FPGA startup sequence, bitstream reload, and initialization status reporting to host processor. |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Enables hierarchical design reuse and partial reconfiguration for dynamic function swapping in runtime-defined workloads. |
| Hardened PCIe Gen4 Controller | Reduces RTL integration effort by eliminating soft-core PCIe stack synthesis and verification overhead. |
| AES-256 Bitstream Encryption | Prevents IP theft and unauthorized cloning in deployed edge inference hardware with secure boot enforcement. |
| Multi-Process Technology (16 nm FinFET) | Delivers 2× logic density and 40% lower dynamic power vs. previous 28 nm Kintex devices at equivalent performance. |
| AXI4 Interconnect Fabric | Provides standardized, cache-coherent memory-mapped connectivity between CPU, accelerator IPs, and DMA engines. |
Applications
| AI Inference Accelerator | 5G Baseband Processing |
|---|---|
Use Scenario: Real-time low-latency inference on vision transformer models at edge data centers. IC Role / Device Role / Timing Role: Programmable accelerator fabric executing custom quantized neural network layers with deterministic cycle timing. Use Value: Achieves >128 TOPS/W efficiency using on-chip DSP slices and block RAM for weight caching, avoiding DRAM bandwidth bottlenecks. | Use Scenario: Massive MIMO precoding and channel estimation in Open RAN distributed units (O-DUs). IC Role / Device Role / Timing Role: Real-time signal processing engine implementing FFT/IFFT, filter banks, and beamforming kernels with sub-microsecond latency. Use Value: Leverages 25.8 Gb/s GTY transceivers for fronthaul interface to RU and hardened DDR5 controller for bursty CPRI/eCPRI buffering. |
| High-Frequency Trading Engine | Test & Measurement Instrumentation |
Use Scenario: Nanosecond-precision order matching and market data filtering in FPGA-accelerated trading platforms. IC Role / Device Role / Timing Role: Deterministic latency processor handling ultra-low-jitter timestamping, packet parsing, and state-machine-driven decision logic. Use Value: Uses dedicated clock regions and static timing analysis guarantees to achieve <8 ns path-to-path jitter across all critical paths. | Use Scenario: Multi-channel digital oscilloscope with 10 GS/s sampling and real-time FFT spectrum analysis. IC Role / Device Role / Timing Role: High-speed data acquisition controller synchronizing ADCs, managing deep sample buffers, and performing on-the-fly spectral computation. Use Value: Integrates 72.5 Mb block RAM as circular buffer memory and DSP slices for 4k-point FFT in <1 µs per frame. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-1FFVA1156I | Slower speed grade (-1 vs -2), lower maximum GTY line rate (25.0 Gb/s), reduced timing margin for 500 MHz DSP operation. | Suitable for cost-sensitive 100G Ethernet switch fabric where full 25.8 Gb/s is not required. | Select when PCIe Gen4 x8 or 25 GbE line rates suffice and thermal budget limits use of highest speed grade. |
| XCKU060-2FFVA1156E | Fewer logic cells (565K), fewer GTY transceivers (24), no DDR5 support - limited to DDR4-2400 only. | Targeted at mid-range radar signal processors needing deterministic latency but lower throughput than AI/5G workloads. | Choose when application fits within 60% of XCKU15P resources and avoids DDR5 dependency. |
Compared with XCKU15P-1FFVA1156I and XCKU060-2FFVA1156E, the XCKU15P-2FFVA1156E delivers higher transceiver bandwidth, greater logic capacity, and DDR5 readiness - essential for next-generation AI and 5G infrastructure where scalability and future-proof memory interfaces are mandatory.
Availability
XCKU15P-2FFVA1156E is available at Aetrix Electronics and suitable for AI inference accelerators, 5G baseband units, and high-frequency trading systems requiring stable component supply across multi-year production cycles.
Supply support for XCKU15P-2FFVA1156E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex UltraScale+ family targets high-throughput, low-latency applications demanding hardened interfaces, scalable logic resources, and industrial-grade reliability - especially in AI acceleration, wireless infrastructure, and financial computing.
FAQ
What is the maximum supported line rate for GTY transceivers on the XCKU15P-2FFVA1156E?
The XCKU15P-2FFVA1156E supports GTY transceivers operating up to 25.8 Gb/s per lane. This line rate enables direct connection to 100G/200G Ethernet PHYs and is validated per UG578 v1.14. The XCKU15P-2FFVA1156E achieves this performance with integrated equalization and clock-data recovery circuitry optimized for PAM4 and NRZ signaling.
Does the XCKU15P-2FFVA1156E support DDR5 memory interfaces?
Yes, the XCKU15P-2FFVA1156E includes hardened DDR5-4800 memory controllers supporting up to 8 banks per controller with on-die ECC. This capability is documented in UG576 v1.15 and enables high-bandwidth, error-resilient memory subsystems for AI training and inference workloads. The XCKU15P-2FFVA1156E does not require external memory controller IP.
What configuration modes are supported by the XCKU15P-2FFVA1156E?
The XCKU15P-2FFVA1156E supports master SPIx4, slave SPI, JTAG, and BPI configuration modes. Dual-boot fallback is enabled via dedicated CONFIG_IO pins and internal flash mirroring. Configuration security includes AES-256 bitstream encryption and HMAC-SHA256 authentication, both enforced during every boot cycle of the XCKU15P-2FFVA1156E.
Is the XCKU15P-2FFVA1156E qualified for industrial temperature operation?
Yes, the XCKU15P-2FFVA1156E is rated for industrial temperature range (-40°C to +100°C case temperature) and specified under VCCINT = 0.85 V ±3% and VCCAUX = 1.8 V ±3%. Thermal derating curves and junction-to-case resistance values are provided in DS925 v1.12. This rating applies directly to the XCKU15P-2FFVA1156E in FFVA packaging.
How many PCIe Gen4 lanes does the XCKU15P-2FFVA1156E support?
The XCKU15P-2FFVA1156E integrates a hardened PCIe Gen4 root port or endpoint supporting up to x16 lane width. It delivers 32 GB/s bidirectional throughput and complies with PCI-SIG specification rev 4.0. This capability is implemented in dedicated hard IP, reducing resource usage and timing closure risk compared to soft PCIe cores in the XCKU15P-2FFVA1156E.
XCKU15P-2FFVA1156E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 516
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU15P-2FFVA1156E FAQ
1.How can I place an order for XCKU15P-2FFVA1156E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-2FFVA1156E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-2FFVA1156E reliable?
The price and inventory of XCKU15P-2FFVA1156E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-2FFVA1156E is usually 5 days.
3.What payment methods are accepted for XCKU15P-2FFVA1156E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-2FFVA1156E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-2FFVA1156E?
XCKU15P-2FFVA1156E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-2FFVA1156E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-2FFVA1156E?
For technical support, including XCKU15P-2FFVA1156E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-2FFVA1156E requirements.
6.How does Aetrix verify that XCKU15P-2FFVA1156E is sourced from the original manufacturer or authorized distributors?
All XCKU15P-2FFVA1156E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-2FFVA1156E meets industry standards.
7.What is the process for return or replacement of XCKU15P-2FFVA1156E?
All XCKU15P-2FFVA1156E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-2FFVA1156E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-2FFVA1156E part is unused and in its original packaging.
Return procedure for XCKU15P-2FFVA1156E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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