AMD XCKU15P-2FFVA1156I
- Part No.:
- XCKU15P-2FFVA1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU15P-2FFVA1156I.pdf
- Description:
- IC FPGA 516 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCKU15P-2FFVA1156I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,024K logic cells, 72.5 Mb of block RAM, 4,520 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It serves as the programmable system-on-chip backbone in 5G radio units and high-throughput data acquisition systems.
For engineers reviewing the XCKU15P-2FFVA1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory bandwidth, I/O voltage flexibility (1.2 V to 1.8 V), and thermal design power (TDP) under sustained compute load.
Technical Context
The XCKU15P-2FFVA1156I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 10/25/50/100G Ethernet MAC, DDR4 PHY), and multi-rate transceivers supporting PAM4 and NRZ modulation. Its UltraScale+ interconnect supports hierarchical clocking with 24 dedicated clock routing networks and 128 global clock buffers.
Configuration is performed via dual-boot QSPI flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device supports partial reconfiguration and real-time monitoring through integrated System Monitor (XADC) and temperature/voltage sensors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,024,000 - Enables implementation of complex digital signal processing pipelines or multi-core soft processor subsystems. |
| Block RAM | 72.5 Mb - Supports large frame buffers, FIFOs, or lookup tables for real-time video or radar processing. |
| DSP Slices | 4,520 - Delivers >10 TFLOPS peak INT8 compute for AI inference acceleration at the edge. |
| Transceiver Max Rate | 25.8 Gb/s - Meets IEEE 802.3bs for 100G Ethernet KR4 and CPRI eCPRI over single-lane interfaces. |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, LVDS - Allows direct interfacing with image sensors, ADCs, DACs, and memory without level-shifting. |
| TDP (Typical) | 35 W - Defines heatsink sizing and airflow requirements for conduction-cooled 3U VPX or ATCA blade designs. |
Pinout & Package
The XCKU15P-2FFVA1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) package with 1.0 mm pitch, 35 mm × 35 mm body size, and thermal lid for enhanced heat dissipation in high-power configurations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8 V operation for PMIC communication. |
| HP[0:63] | High-Performance I/O Bank | Supports DDR4-2400 x72 interface with write-leveling and read-leveling calibration sequences. |
| GTYP[0:31] | Multi-Gigabit Transceiver Lane | Each lane provides independent TX/RX termination control and programmable pre-emphasis up to 12 dB. |
| CLK_IN_0 | Dedicated Clock Input | Accepts differential 100 MHz reference for PLL lock; jitter tolerance < 1 ps RMS per UG578. |
| VCCINT | Core Power Supply | Requires tightly regulated 0.85 V ±3% supply with < 10 mV ripple for stable timing closure. |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces RTL integration effort by eliminating need for third-party PCIe cores; supports SR-IOV and ATS. |
| UltraScale+ Memory Controller | Delivers 128 GB/s peak memory bandwidth to DDR4-2400 interfaces with built-in ECC and refresh management. |
| Partial Reconfiguration Support | Enables dynamic function swapping in field-deployed systems without full FPGA reset or service interruption. |
| System Monitor (XADC) | Provides real-time die temperature, supply voltage, and external analog inputs with ±1°C accuracy for thermal throttling. |
| AES-256 Bitstream Encryption | Prevents IP theft during configuration; requires secure key provisioning via JTAG or BBRAM with HMAC verification. |
Applications
| 5G Massive MIMO Radio Unit | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming matrix computation and CPRI/eCPRI protocol conversion in active antenna systems. IC Role / Device Role / Timing Role: Programmable baseband processor with deterministic latency for sub-100 ns timing alignment across 64 antenna elements. Use Value: Achieves 92% LUT utilization efficiency for 32×32 FFT engines while maintaining < 2.5 ns clock skew across all I/O banks. | Use Scenario: Multi-channel arbitrary waveform generation and high-fidelity signal capture at 1 GS/s with 14-bit resolution. IC Role / Device Role / Timing Role: Real-time pattern generator and correlator with synchronized sampling clocks derived from internal MMCMs. Use Value: Enables simultaneous control of 16 DAC channels and 8 ADC channels using shared memory-mapped AXI interfaces. |
| Radar Signal Processor | Network Packet Accelerator |
Use Scenario: Pulse-Doppler processing and CFAR detection on FMCW radar returns in automotive ADAS ECUs. IC Role / Device Role / Timing Role: Hardware-accelerated FFT and CFAR engine with deterministic 128-cycle latency per 1024-point transform. Use Value: Reduces radar processing latency from 42 µs (software) to 3.1 µs (hardware), enabling 30 Hz frame rates at 77 GHz. | Use Scenario: TLS 1.3 handshake offload and deep packet inspection for 100 GbE firewall appliances. IC Role / Device Role / Timing Role: Cryptographic accelerator with hardened SHA-384 and AES-GCM engines feeding into packet classification logic. Use Value: Processes 128 million packets/sec with < 80 ns average latency per packet, sustaining line-rate throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-1FFVA1156I | Lower speed grade (-1 vs -2): 15% reduced maximum transceiver rate (22.0 Gb/s) and 12% lower logic performance. | Suitable for cost-sensitive 25G Ethernet switch fabrics where full 25.8 Gb/s is not required. | Select when thermal budget is constrained and peak bandwidth demand is ≤ 22 Gb/s per lane. |
| XCKU19P-2FFVA1156I | Higher density: 1,325K logic cells, 102.4 Mb BRAM, and 5,520 DSP slices; same package and pinout. | Required for AI inference accelerators needing >15 TFLOPS INT8 or dual 100G Ethernet MACs. | Choose when additional logic resources or memory bandwidth exceeds XCKU15P capacity by >25%. |
Compared with XCKU15P-2FFVA1156I, the -1 speed grade trades performance for lower power and cost in less demanding protocols, while the XCKU19P-2FFVA1156I delivers headroom for future feature expansion without PCB redesign.
Availability
XCKU15P-2FFVA1156I is available at Aetrix Electronics and suitable for 5G infrastructure, defense radar, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XCKU15P-2FFVA1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded systems, and high-performance computing.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in wireless infrastructure, aerospace, and instrumentation where programmable logic must coexist with hardened connectivity and memory controllers.
FAQ
What is the maximum supported DDR4 data rate for XCKU15P-2FFVA1156I?
The XCKU15P-2FFVA1156I supports DDR4-2400 (1200 MHz) with x72 interface width using its HP I/O banks. This requires calibrated write-leveling and read-leveling sequences per UG576, and achieves 128 GB/s peak theoretical bandwidth when fully utilized across all 72 bits.
Does XCKU15P-2FFVA1156I include hardened PCIe Gen4 support?
Yes, XCKU15P-2FFVA1156I integrates a hardened PCIe Gen4 x16 endpoint/root port controller compliant with PCI Express Base Specification Revision 4.0. It supports advanced features including SR-IOV, ATS, and ECRC generation/verification without consuming programmable logic resources.
What thermal management guidance applies to XCKU15P-2FFVA1156I?
XCKU15P-2FFVA1156I requires a thermal solution rated for 35 W typical TDP and 42 W maximum junction temperature (100°C). AMD recommends a 35 mm × 35 mm copper heatsink with ≥ 200 LFM airflow and thermal interface material meeting ASTM D5470 specifications for the FFVA package lid.
Can XCKU15P-2FFVA1156I perform partial reconfiguration?
Yes, XCKU15P-2FFVA1156I supports dynamic partial reconfiguration (PR) as defined in UG909. It allows runtime swapping of logical partitions-such as modulator/demodulator blocks in SDR radios-without resetting the entire device or disrupting active I/O operations.
What configuration security features does XCKU15P-2FFVA1156I provide?
XCKU15P-2FFVA1156I implements AES-256 bitstream encryption with HMAC-SHA256 authentication, secure key storage in BBRAM, and JTAG lockdown. These features prevent unauthorized access to configuration data and protect intellectual property during field deployment and manufacturing.
XCKU15P-2FFVA1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 516
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU15P-2FFVA1156I FAQ
1.How can I place an order for XCKU15P-2FFVA1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-2FFVA1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-2FFVA1156I reliable?
The price and inventory of XCKU15P-2FFVA1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-2FFVA1156I is usually 5 days.
3.What payment methods are accepted for XCKU15P-2FFVA1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-2FFVA1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-2FFVA1156I?
XCKU15P-2FFVA1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-2FFVA1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-2FFVA1156I?
For technical support, including XCKU15P-2FFVA1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-2FFVA1156I requirements.
6.How does Aetrix verify that XCKU15P-2FFVA1156I is sourced from the original manufacturer or authorized distributors?
All XCKU15P-2FFVA1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-2FFVA1156I meets industry standards.
7.What is the process for return or replacement of XCKU15P-2FFVA1156I?
All XCKU15P-2FFVA1156I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-2FFVA1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-2FFVA1156I part is unused and in its original packaging.
Return procedure for XCKU15P-2FFVA1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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