My Inquiry
My Account
AMD XCKU15P-2FFVA1760E
- Part No.:
- XCKU15P-2FFVA1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU15P-2FFVA1760E.pdf
- Description:
- IC FPGA 512 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,696
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCKU15P-2FFVA1760E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,085K logic cells, 72.5 Mb of block RAM, and 4,520 DSP slices, operating at -2 speed grade with 1760-pin FCBGA packaging; used in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU15P-2FFVA1760E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate (32.75 Gb/s), I/O voltage support (0.6–1.8 V), thermal design power (59 W), and PCIe Gen4 x16 interface capability.
Technical Context
The XCKU15P-2FFVA1760E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency transceivers. It supports up to 64 GTY transceivers with PAM4 and NRZ modulation schemes.
Its memory subsystem includes dual-channel DDR4-2400 interfaces with ECC support and integrated UltraRAM for high-density on-die storage. Configuration occurs via quad-SPI or BPI flash, with secure bitstream encryption using AES-256 and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,085,000 - total configurable logic resources for complex RTL implementation |
| Block RAM | 72.5 Mb - distributed across 2,160 BRAM blocks supporting true dual-port operation |
| DSP Slices | 4,520 - fixed-point and floating-point arithmetic units with 27×18-bit multipliers |
| Transceivers | 64 GTY - 32.75 Gb/s serial line rate, supporting PCIe Gen4, 100G Ethernet, and CPRI |
| I/O Standards | 0.6–1.8 V - supports LVCMOS, SSTL, HSTL, and differential standards including LVDS |
| TDP | 59 W - thermal design power at maximum operating conditions, guides heatsink selection |
| Speed Grade | -2 - guarantees timing closure at specified frequency targets under industrial temperature range |
Pinout & Package
Package: 1760-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid and underfill support.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 0.85 V ±3% input for FPGA fabric and CLB logic |
| VCCAUX | Auxiliary supply | 1.8 V ±3% for configuration logic, SelectIO, and transceiver analog circuitry |
| VCCO | I/O bank supply | Configurable per-bank (0.6–1.8 V) to match interfaced peripheral voltage levels |
| MGTAVCC | Transceiver analog supply | 0.95 V ±2% dedicated supply for GTY transceiver analog front-end |
| CONFIG_DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization |
| INIT_B | Configuration control | Active-low input that resets configuration state machine and clears internal registers |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Root Port | Hardened endpoint with full link training, error reporting, and AER support |
| DDR4 Memory Controller | Two 72-bit channels (64 + 8 ECC) supporting 2400 MT/s with on-die termination calibration |
| UltraRAM Blocks | Integrated 288 Kb RAM primitives enabling large on-chip FIFOs without BRAM resource consumption |
| Secure Boot | AES-256 encrypted bitstream with HMAC SHA-256 authentication and anti-rollback protection |
| Partial Reconfiguration | Dynamic logic module swapping without system reset, enabling runtime function adaptation |
Applications
| 5G Wireless Baseband Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time massive MIMO precoding and channel estimation in 5G gNodeB units. IC Role / Device Role / Timing Role: Primary programmable baseband processor handling L1/L2 protocol stack offload and low-latency signal path. Use Value: GTY transceivers enable direct fronthaul interface to RU via eCPRI at 25 Gb/s, reducing external SerDes count by 40%. | Use Scenario: FPGA-accelerated database query engines and AI inference pipelines in cloud servers. IC Role / Device Role / Timing Role: Co-processor tightly coupled to CPU via PCIe Gen4 x16, executing custom kernels with deterministic latency. Use Value: 4,520 DSP slices deliver 12.8 TFLOPS FP16 throughput, accelerating matrix operations beyond GPU memory bandwidth limits. |
| Defense Radar Signal Processing | Medical Imaging Reconstruction |
Use Scenario: Pulse-Doppler radar beamforming and synthetic aperture imaging in airborne EW platforms. IC Role / Device Role / Timing Role: Real-time digital downconverter and adaptive filtering engine synchronized to 100 MHz system clock. Use Value: 72.5 Mb block RAM enables full-frame STAP processing buffer without external DDR, cutting latency by 3.2 µs. | Use Scenario: Iterative CT image reconstruction using compressed sensing algorithms on portable scanners. IC Role / Device Role / Timing Role: Dedicated accelerator for back-projection and iterative solver execution, decoupled from host ARM SoC. Use Value: Partial reconfiguration allows on-the-fly kernel switching between FBP and MBIR algorithms without system reboot. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-1FFVA1760I | Slower -1 speed grade; lower max I/O toggle rate and transceiver line rate (25.78 Gb/s) | Suitable for cost-sensitive radar test benches where full 32.75 Gb/s not required | Select when thermal budget <48 W and PCIe Gen3 suffices |
| XCKU19P-2FFVA2104E | Higher density (1,375K LC), larger package (2104-pin), +12% DSP slices, +18% BRAM | Required for multi-100G Ethernet line cards needing >64 lanes or dual 400G MACs | Choose when >1.1M logic cells or >80 GTY lanes are needed |
Compared with XCKU15P-2FFVA1760E, the -1FFVA1760I reduces performance headroom but lowers cooling requirements, while the XCKU19P-2FFVA2104E extends scalability at the cost of PCB redesign and higher power delivery complexity.
Availability
XCKU15P-2FFVA1760E is available at Aetrix Electronics and suitable for 5G infrastructure, defense radar systems, and medical imaging equipment requiring stable component supply across extended product lifecycles.
Supply support for XCKU15P-2FFVA1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.
The Kintex UltraScale+ family delivers optimized balance of logic capacity, I/O bandwidth, and power efficiency for compute-intensive real-time applications in aerospace, communications, and instrumentation.
FAQ
What is the maximum transceiver line rate supported by XCKU15P-2FFVA1760E?
The XCKU15P-2FFVA1760E supports a maximum GTY transceiver line rate of 32.75 Gb/s, validated for PCIe Gen4, 100G Ethernet, and eCPRI protocols. This rating applies under industrial temperature conditions (-40°C to +100°C) with proper power delivery and signal integrity layout. The XCKU15P-2FFVA1760E achieves this using adaptive equalization and PAM4 signaling modes in select channels.
Does XCKU15P-2FFVA1760E support PCIe Gen5?
No, XCKU15P-2FFVA1760E does not support PCIe Gen5. It integrates hardened PCIe Gen4 x16 root port logic with full link training and AER compliance. PCIe Gen5 capability requires the Versal ACAP platform or newer UltraScale+ derivatives not present in the XCKU15P-2FFVA1760E silicon revision.
What I/O voltage standards are compatible with XCKU15P-2FFVA1760E banks?
XCKU15P-2FFVA1760E supports I/O voltages from 0.6 V to 1.8 V per bank, enabling direct interfacing with LVCMOS12/15/18, SSTL12/15/18, HSTL_I/II, and differential standards including LVDS, TMDS, and RSDS. Each bank's VCCO must be set to match the target peripheral's signaling level, and mixed-voltage operation is permitted across adjacent banks.
How much block RAM is available in XCKU15P-2FFVA1760E?
XCKU15P-2FFVA1760E provides 72.5 Mb of total block RAM, distributed across 2,160 individual BRAM primitives. Each BRAM can operate in true dual-port mode with independent read/write clocks, and supports byte-write enable for efficient memory-mapped peripheral access. This capacity is fixed and cannot be increased via UltraRAM allocation.
Is partial reconfiguration supported on XCKU15P-2FFVA1760E?
Yes, XCKU15P-2FFVA1760E fully supports partial reconfiguration through Vivado Design Suite v2022.2+. This allows dynamic swapping of logical modules-such as filter banks or protocol engines-without resetting the entire device. The XCKU15P-2FFVA1760E implements frame-based PR with CRC-protected configuration frames and secure update paths.
XCKU15P-2FFVA1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 512
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU15P-2FFVA1760E FAQ
1.How can I place an order for XCKU15P-2FFVA1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-2FFVA1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-2FFVA1760E reliable?
The price and inventory of XCKU15P-2FFVA1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-2FFVA1760E is usually 5 days.
3.What payment methods are accepted for XCKU15P-2FFVA1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-2FFVA1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-2FFVA1760E?
XCKU15P-2FFVA1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-2FFVA1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-2FFVA1760E?
For technical support, including XCKU15P-2FFVA1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-2FFVA1760E requirements.
6.How does Aetrix verify that XCKU15P-2FFVA1760E is sourced from the original manufacturer or authorized distributors?
All XCKU15P-2FFVA1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-2FFVA1760E meets industry standards.
7.What is the process for return or replacement of XCKU15P-2FFVA1760E?
All XCKU15P-2FFVA1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-2FFVA1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-2FFVA1760E part is unused and in its original packaging.
Return procedure for XCKU15P-2FFVA1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU15P-2FFVA1760E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
