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AMD XCKU15P-2FFVA1760I
- Part No.:
- XCKU15P-2FFVA1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU15P-2FFVA1760I.pdf
- Description:
- IC FPGA 512 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,612
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Product details
Overview
XCKU15P-2FFVA1760I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,328K logic cells, 8,520 DSP slices, and 49.5 Mb of block RAM. It supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). Used in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU15P-2FFVA1760I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate (32.75 Gb/s), I/O voltage support (1.8 V/1.5 V/1.35 V/1.25 V/1.0 V), and configuration interface options (SPIx4, BPI, JTAG).
Technical Context
The XCKU15P-2FFVA1760I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 root port/endpoint, 100G Ethernet MAC, and UltraScale+ memory controllers. It integrates 64 GTY transceivers supporting PAM4 and NRZ modulation.
Configuration is performed via dual-boot SPI flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device supports partial reconfiguration and dynamic function exchange for runtime hardware adaptation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,328,000 - total configurable logic resources for complex digital logic implementation |
| DSP Slices | 8,520 - fixed-point and floating-point arithmetic units optimized for high-throughput math operations |
| Block RAM | 49.5 Mb - on-chip memory for data buffering, FIFOs, and lookup tables without external memory latency |
| GTY Transceivers | 64 × 32.75 Gb/s - serial I/O supporting 100G Ethernet, CPRI, and high-speed interconnect protocols |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - supports mixed-voltage system interfacing and DDR4-2400 memory subsystems |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for industrial and harsh-environment embedded deployments |
Pinout & Package
Package: 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) with 0.8 mm pitch, thermally enhanced for high-power FPGA operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multifunction I/O Bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS peripherals in Zynq UltraScale+ MPSoC hybrid mode |
| HP[0:63] | High-Performance I/O Bank | Supports DDR4-2400, LPDDR4, and 32.75 Gb/s GTY transceivers; voltage-programmable per bank |
| HR[0:47] | High-Density I/O Bank | LVCMOS/SSTL/HSTL-compatible; optimized for low-skew parallel interfaces and memory control |
| CLK_IN_0 / CLK_IN_1 | Dedicated Clock Inputs | Low-jitter inputs for global clock distribution; compatible with differential LVDS or single-ended LVCMOS |
| INIT_B / PROGRAM_B | Configuration Control | Active-low signals managing configuration startup, reconfiguration, and fallback recovery sequences |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Integrated endpoint/root port logic eliminating soft-core resource usage and ensuring deterministic latency |
| UltraScale+ Memory Controller | Native DDR4-2400 and LPDDR4-4266 support with ECC, reducing external memory controller design effort |
| AES-256 Bitstream Encryption | Hardware-accelerated encryption preventing unauthorized configuration and intellectual property theft |
| Partial Reconfiguration | Enables dynamic hardware updates without full system reset-critical for mission-critical and adaptive computing applications |
| 64 GTY Transceivers | Each capable of 32.75 Gb/s NRZ or 58 Gb/s PAM4, enabling 100G/400G optical and backplane interconnects |
Applications
| 5G Wireless Baseband Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time massive MIMO precoding and channel estimation in 5G gNodeB units. IC Role / Device Role / Timing Role: Programmable baseband processor handling L1/L2 protocol stack offload and RF front-end synchronization. Use Value: 64 GTY transceivers enable fronthaul CPRI/eCPRI over 25G/50G links; -2 speed grade ensures deterministic timing for sub-100 µs latency loops. | Use Scenario: FPGA-accelerated database query engines and AI inference pipelines in cloud data centers. IC Role / Device Role / Timing Role: Co-processor tightly coupled to x86 CPUs via PCIe Gen4 x16, executing custom kernels with ultra-low-latency memory access. Use Value: 49.5 Mb block RAM enables large on-die data caches; 8,520 DSP slices accelerate INT8/FP16 matrix operations without external accelerators. |
| Avionics Data Concentrators | Test & Measurement High-Speed Digitizers |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control systems. IC Role / Device Role / Timing Role: Deterministic packet switching and time-triggered scheduling engine with hardware timestamping. Use Value: Industrial temperature rating (-40°C to +100°C) and SEU mitigation features ensure reliability in unpressurized avionics bays. | Use Scenario: 10 GS/s real-time oscilloscopes and radar signal analyzers requiring deep memory capture and FFT acceleration. IC Role / Device Role / Timing Role: High-speed ADC interface controller and real-time spectral analysis engine using pipelined FFT cores. Use Value: HP I/O banks directly interface 10-bit/12-bit ADCs at 5+ GSPS; 1,328K logic cells implement multi-channel parallel FFTs with <1 µs latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-1FFVA1760I | Slower -1 speed grade; lower maximum clock frequency and reduced transceiver margin at 32.75 Gb/s | Suitable for cost-sensitive designs where full -2 timing margin is not required | Select when thermal/power budget allows relaxed timing closure and 32.75 Gb/s link margin is not critical |
| XCKU19P-2FFVA2104I | Larger die with 1,926K logic cells, 10,200 DSP slices, and 72.5 Mb block RAM; same -2 speed grade and FFVA package footprint | Required for designs exceeding XCKU15P resource limits while maintaining identical PCB layout and thermal envelope | Choose when logic utilization exceeds 90% in XCKU15P-2FFVA1760I and migration path must preserve board design |
Compared with XCKU15P-2FFVA1760I, the -1 variant trades performance margin for cost reduction, while the XCKU19P-2FFVA2104I provides scalable headroom within identical thermal and mechanical constraints-enabling incremental upgrades without board respin.
Availability
XCKU15P-2FFVA1760I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace data concentrators, and high-performance test equipment requiring stable component supply across extended product lifecycles.
Supply support for XCKU15P-2FFVA1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Kintex UltraScale+ family targets high-throughput, power-efficient programmable logic for communications infrastructure, compute acceleration, and mission-critical embedded systems.
FAQ
What is the maximum supported transceiver line rate for XCKU15P-2FFVA1760I?
The XCKU15P-2FFVA1760I supports a maximum transceiver line rate of 32.75 Gb/s using its GTY transceivers in NRZ mode. This enables compliance with 100G Ethernet (4×25G), CPRI Option 10, and PCIe Gen4 standards. The -2 speed grade ensures reliable operation at this rate across the full industrial temperature range.
Does XCKU15P-2FFVA1760I support DDR4 memory interfaces?
Yes, XCKU15P-2FFVA1760I includes hardened memory controller IP supporting DDR4-2400 (1200 MHz) with 64-bit data bus width and ECC capability. It interfaces directly with standard DDR4 UDIMMs and RDIMMs through HP I/O banks configured for SSTL-12 I/O standard.
What configuration modes are supported by XCKU15P-2FFVA1760I?
XCKU15P-2FFVA1760I supports multiple configuration modes including master SPI x4, slave SPI, BPI parallel, and JTAG. Dual-boot capability allows fallback to a secondary bitstream stored in SPI flash, enhancing field-upgrade reliability. Configuration security includes AES-256 decryption and HMAC authentication.
Is partial reconfiguration supported on XCKU15P-2FFVA1760I?
Yes, XCKU15P-2FFVA1760I fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of logic modules during operation without resetting the entire device-essential for adaptive radio systems, runtime protocol switching, and fault-tolerant computing architectures.
What is the I/O voltage range supported by XCKU15P-2FFVA1760I HP banks?
XCKU15P-2FFVA1760I HP I/O banks support selectable VCCO voltages of 1.8 V, 1.5 V, 1.35 V, 1.25 V, and 1.0 V per bank. This enables direct interfacing with DDR4 (1.2 V), LPDDR4 (1.1 V), and legacy memory or ASICs while maintaining signal integrity and timing closure.
XCKU15P-2FFVA1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 512
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU15P-2FFVA1760I FAQ
1.How can I place an order for XCKU15P-2FFVA1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-2FFVA1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-2FFVA1760I reliable?
The price and inventory of XCKU15P-2FFVA1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-2FFVA1760I is usually 5 days.
3.What payment methods are accepted for XCKU15P-2FFVA1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-2FFVA1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-2FFVA1760I?
XCKU15P-2FFVA1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-2FFVA1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-2FFVA1760I?
For technical support, including XCKU15P-2FFVA1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-2FFVA1760I requirements.
6.How does Aetrix verify that XCKU15P-2FFVA1760I is sourced from the original manufacturer or authorized distributors?
All XCKU15P-2FFVA1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-2FFVA1760I meets industry standards.
7.What is the process for return or replacement of XCKU15P-2FFVA1760I?
All XCKU15P-2FFVA1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-2FFVA1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-2FFVA1760I part is unused and in its original packaging.
Return procedure for XCKU15P-2FFVA1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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