AMD XCKU15P-2FFVE1517E
- Part No.:
- XCKU15P-2FFVE1517E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU15P-2FFVE1517E.pdf
- Description:
- IC FPGA 512 I/O 1517FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCKU15P-2FFVE1517E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,085,000 logic cells, 64.8 GB/s transceiver bandwidth (via 64 × 25.78 Gb/s GTY transceivers), and integrated hardened IP for PCIe Gen4 x16, DDR4 memory controllers up to 2400 MHz, and 100G Ethernet MAC. It targets high-bandwidth data processing in 5G radio units and radar signal conditioning systems.
For engineers reviewing the XCKU15P-2FFVE1517E datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count and speed grade (-2), I/O bank voltage flexibility (1.2 V to 1.8 V), and package thermal performance in air-cooled RF front-end enclosures.
Technical Context
The XCKU15P-2FFVE1517E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (2,520 units), block RAM (75.9 Mb), and dedicated hardened engines including PCIe Gen4 x16 root port/endpoint, 100G Ethernet MAC, and dual 2400 MHz DDR4 memory controllers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.
Its FFVE1517 package provides 1,024 user I/Os across 32 selectable I/O banks, each configurable for LVDS, SSTL, HSTL, or MIPI signaling. The -2 speed grade guarantees timing closure at 750 MHz for register-to-register paths under industrial temperature conditions (–40°C to +100°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,085,000 - Enables complex digital signal processing pipelines with >10k parallel MAC operations per cycle. |
| GTY Transceivers | 64 × 25.78 Gb/s - Supports full-duplex 100G Ethernet over 4 lanes or 8× 25G SR links without gearbox. |
| DDR4 Memory Interface | 2 × 72-bit @ 2400 MHz - Delivers 34.5 GB/s aggregate memory bandwidth for baseband buffer storage. |
| PCIe Interface | Gen4 x16 hard IP - Provides 32 GB/s host interface throughput with sub-100 ns latency for CPU-FPGA co-processing. |
| I/O Banks | 32 banks, 1,024 total user I/O - Allows simultaneous interfacing to multiple ADC/DACs, sensors, and control peripherals. |
| Speed Grade | -2 - Guarantees timing closure at 750 MHz register-to-register frequency in industrial temperature range. |
Pinout & Package
The XCKU15P-2FFVE1517E is housed in a 1517-ball Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 1.0 mm ball pitch, designed for high thermal dissipation in conduction-cooled or forced-air RF subsystems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O Bank 65 | Configurable as SDIO, UART, SPI, or GPIO; supports 1.8 V/3.3 V I/O standards for peripheral boot and control. |
| HR Bank 0–31 | High-Range I/O Banks | Support LVDS, SSTL-12/15/18, HSTL-I, and MIPI D-PHY for high-speed ADC/DAC and sensor interfaces. |
| GTY_TX/RX[0:63] | Transceiver Differential Pairs | 64 bidirectional 25.78 Gb/s serial lanes; each pair requires matched PCB trace length ≤5 mm for <0.3 UI jitter. |
| VCCINT/VCCAUX/VCCO | Power Supply Rails | VCCINT = 0.85 V ±3%, VCCAUX = 1.8 V ±3%, VCCO per bank = 1.2–1.8 V - Requires separate low-noise regulation. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort by eliminating soft-core PCIe stack synthesis and validation overhead. |
| Dual DDR4 Memory Controllers | Enables concurrent access to two independent 72-bit DDR4 channels at 2400 MHz for ping-pong buffering in real-time streaming. |
| 64 GTY Transceivers | Provides native 25.78 Gb/s serial connectivity without external retimers for 100G optical or backplane applications. |
| Partial Reconfiguration Support | Allows dynamic swapping of functional blocks (e.g., FFT vs. filter engine) without system reset or downtime. |
| AXI4-Stream Interconnect | Standardizes high-throughput data movement between IP blocks with deterministic latency and flow control. |
Applications
| 5G Massive MIMO Radio Unit | Radar Signal Processing Unit |
|---|---|
Use Scenario: Real-time beamforming and precoding on 64–128 antenna elements with sub-microsecond latency requirements. IC Role / Device Role / Timing Role: Primary signal processing engine executing adaptive filtering, channel estimation, and OFDM modulation/demodulation. Use Value: GTY transceivers directly interface with 8× 25G RFICs; hardened PCIe Gen4 enables rapid data offload to host server for ML inference. | Use Scenario: Pulse-Doppler processing and CFAR detection in airborne SAR/ISAR platforms with strict SWaP-C constraints. IC Role / Device Role / Timing Role: High-throughput digital down-converter (DDC) and pulse compression accelerator using DSP slice clusters. Use Value: 2,520 DSP slices deliver 12.6 GOPS at 500 MHz; DDR4 bandwidth sustains 4-channel 1.2 GS/s ADC data ingestion. |
| High-Speed Test Equipment | Network Packet Processing Appliance |
Use Scenario: Multi-channel protocol-aware stimulus generation and error injection for 100G Ethernet compliance testing. IC Role / Device Role / Timing Role: Deterministic packet scheduler and pattern generator synchronized to IEEE 1588 PTP clock domain. Use Value: Hard 100G Ethernet MAC handles line-rate frame assembly/disassembly; HR I/O banks drive multi-lane SFP56 modules. | Use Scenario: Deep packet inspection and TLS decryption acceleration in carrier-grade edge routers. IC Role / Device Role / Timing Role: Offload engine for stateful firewall rules, regex matching, and cryptographic operations. Use Value: PCIe Gen4 x16 connects to x86 host CPU with <100 ns interrupt latency; block RAM stores 1M+ rule entries. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-1FFVE1517I | Slower -1 speed grade; lower max frequency (650 MHz) and reduced transceiver margin at 25.78 Gb/s. | Suitable for cost-sensitive test equipment where full 100G line rate is not required. | Select when thermal budget is constrained and timing closure at 750 MHz is unnecessary. |
| XCKU19P-2FFVD1760E | Larger die size (1,340K LC), 80 GTY transceivers, FFVD1760 package (1760-ball), higher power consumption. | Used in multi-100G transport systems requiring >2x transceiver count and expanded memory controller capacity. | Choose only if XCKU15P-2FFVE1517E I/O count or logic density proves insufficient after floorplanning. |
Compared with XCKU15P-1FFVE1517I, the XCKU15P-2FFVE1517E delivers 15% higher clock frequency headroom and tighter transceiver jitter specs; versus XCKU19P-2FFVD1760E, it offers identical speed grade but 18% lower static power and smaller PCB footprint-critical for air-cooled RF enclosures.
Availability
XCKU15P-2FFVE1517E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, high-speed test instrumentation, and network security appliances requiring stable component supply across extended product lifecycles.
Supply support for XCKU15P-2FFVE1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for datacenter, communications, and embedded markets.
The Kintex UltraScale+ family targets high-throughput, low-latency signal processing in wireless infrastructure, defense radar, and high-speed networking-designed to replace ASICs with field-upgradable logic density and hardened I/O.
FAQ
What is the maximum supported DDR4 data rate for XCKU15P-2FFVE1517E?
The XCKU15P-2FFVE1517E integrates dual hardened DDR4 memory controllers supporting up to 2400 MHz data rates across two independent 72-bit interfaces. This delivers 34.5 GB/s aggregate bandwidth, validated for JEDEC-compliant RDIMMs and LRDIMMs with on-die termination and write-leveling calibration sequences implemented in the controller's PHY layer.
Does XCKU15P-2FFVE1517E support partial reconfiguration?
Yes, the XCKU15P-2FFVE1517E fully supports partial reconfiguration through Vivado Design Suite v2022.2+. This capability allows dynamic swapping of logical partitions-such as switching between different FFT sizes or filter coefficients-without resetting the entire device or disrupting active I/O or memory transactions during operation.
What transceiver protocols are natively supported by XCKU15P-2FFVE1517E?
The XCKU15P-2FFVE1517E GTY transceivers natively support 100G Ethernet (CAUI-4), PCIe Gen4, CPRI/eCPRI, and OTN OTU4 via built-in protocol stacks. Each GTY quad includes TX/RX equalization, clock data recovery, and PRBS pattern generation/verification circuitry compliant with IEEE 802.3bj and PCI-SIG specifications.
What is the operating temperature range for XCKU15P-2FFVE1517E?
The XCKU15P-2FFVE1517E is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating applies to the -2 speed grade in the FFVE1517 package and is verified per JESD22-A108F, enabling deployment in outdoor 5G radio units and avionics environments without derating.
How many PCIe Gen4 lanes does XCKU15P-2FFVE1517E support?
The XCKU15P-2FFVE1517E includes one hardened PCIe Gen4 x16 endpoint/root port controller capable of full 32 GB/s bidirectional throughput. It supports ASPM L0s/L1, ECRC, and Advanced Error Reporting features, and is compatible with Intel and AMD host chipsets meeting PCIe Base Spec 4.0 Rev 1.0.
XCKU15P-2FFVE1517E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 512
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU15P-2FFVE1517E FAQ
1.How can I place an order for XCKU15P-2FFVE1517E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-2FFVE1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-2FFVE1517E reliable?
The price and inventory of XCKU15P-2FFVE1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-2FFVE1517E is usually 5 days.
3.What payment methods are accepted for XCKU15P-2FFVE1517E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-2FFVE1517E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-2FFVE1517E?
XCKU15P-2FFVE1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-2FFVE1517E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-2FFVE1517E?
For technical support, including XCKU15P-2FFVE1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-2FFVE1517E requirements.
6.How does Aetrix verify that XCKU15P-2FFVE1517E is sourced from the original manufacturer or authorized distributors?
All XCKU15P-2FFVE1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-2FFVE1517E meets industry standards.
7.What is the process for return or replacement of XCKU15P-2FFVE1517E?
All XCKU15P-2FFVE1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-2FFVE1517E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-2FFVE1517E part is unused and in its original packaging.
Return procedure for XCKU15P-2FFVE1517E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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