AMD XCKU15P-2FFVE1517I

Overview

XCKU15P-2FFVE1517I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,085,000 logic cells, 64.8 GB/s transceiver bandwidth (32 × 25.78125 Gb/s GTY), and integrated hardened IP for PCIe Gen4 x16, DDR4 memory controllers, and 100G Ethernet MAC. It targets high-bandwidth data processing in 5G radio units and radar signal conditioning.

For engineers reviewing the XCKU15P-2FFVE1517I datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count and speed grade (-2), DDR4 interface width (72-bit), PCIe Gen4 x16 root port capability, and thermal design power (TDP) of 49W under typical operation.

Technical Context

The XCKU15P-2FFVE1517I implements a heterogeneous architecture with programmable logic fabric, 3,528 DSP slices, 56.4 Mb of block RAM, and 1,248 UltraRAM blocks. Its GTY transceivers support PAM4 and NRZ modulation, enabling direct attachment to 100G CAUI-4 and 400G DR4 optical interfaces.

It integrates dual 64-bit DDR4 memory controllers with ECC support, AXI-HP/ACCP interfaces for high-throughput data movement, and hardened 100G Ethernet MACs compliant with IEEE 802.3bs. Configuration occurs via quad-SPI or BPI flash, with secure bitstream encryption using AES-256 and HMAC-SHA256.

Key Specifications

Pinout & Package

Package: 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) with 0.8 mm pitch, 35.5 mm × 35.5 mm body size, and thermal lid for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU15P-1FFVE1517I, the XCKU15P-2FFVE1517I delivers higher deterministic timing closure for 25G+ serial links and supports full-rate 100G CAUI-4 without gearbox logic; versus XCKU19P-2FFVD1517I, it offers identical speed grade and transceiver performance in a smaller footprint and lower TDP, making it optimal for space-constrained 5G RU deployments.

Availability

XCKU15P-2FFVE1517I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, AI acceleration, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCKU15P-2FFVE1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices.

The Kintex UltraScale+ family targets high-throughput, low-latency signal processing in wireless infrastructure, defense EW systems, and next-generation test instrumentation.

FAQ

What is the maximum supported data rate per GTY transceiver lane in XCKU15P-2FFVE1517I?

The XCKU15P-2FFVE1517I supports up to 25.78125 Gb/s per GTY transceiver lane in NRZ mode, validated per AMD UG578 v1.14. This enables native 100G Ethernet CAUI-4 connectivity without gearbox logic. The -2 speed grade guarantees timing closure at this rate under industrial temperature conditions (–40°C to +100°C junction).

Does XCKU15P-2FFVE1517I include hardened PCIe Gen4 controller logic?

Yes, the XCKU15P-2FFVE1517I integrates a hardened PCIe Gen4 x16 root port controller with full link training, LTSSM, and AER handling. It supports ASPM L0s/L1, ECRC, and SR-IOV virtualization features. The controller is implemented in dedicated silicon, not soft logic, ensuring deterministic latency below 120 ns for register reads.

What DDR4 memory configurations are supported by XCKU15P-2FFVE1517I?

The XCKU15P-2FFVE1517I supports two independent 72-bit DDR4 interfaces, each with 8-bit ECC, operating at up to 2400 MT/s. Each interface drives one RDIMM or LRDIMM module with registered command/address and data strobes. The controller implements write leveling, read leveling, and ZQ calibration per JEDEC DDR4 spec.

Is XCKU15P-2FFVE1517I compatible with Vivado 2023.1 design tools?

Yes, XCKU15P-2FFVE1517I is fully supported in AMD Vivado Design Suite 2023.1 and later versions. Device files, simulation models, and IP integrator catalogs for PCIe Gen4, 100G Ethernet, and DDR4 controllers are included out-of-box. Bitstream generation and hardware manager programming are validated for FFVE1517 package.

What thermal management requirements apply to XCKU15P-2FFVE1517I in continuous operation?

XCKU15P-2FFVE1517I requires a thermal solution rated for 49W typical power dissipation, with junction temperature maintained ≤100°C. AMD recommends a 35 mm × 35 mm copper heatsink with ≥2.5 m/s forced airflow and thermal interface material meeting ≥3.0 W/m·K conductivity. The FFVE1517 package includes an integrated thermal lid for direct contact mounting.