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AMD XCKU15P-2FFVE1760E
- Part No.:
- XCKU15P-2FFVE1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU15P-2FFVE1760E.pdf
- Description:
- IC FPGA 668 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,377
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Product details
Overview
XCKU15P-2FFVE1760E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,024K logic cells, 72.5 Mb of block RAM, and 840 DSP slices. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, targeting high-bandwidth data processing in 5G infrastructure and radar systems.
For engineers reviewing the XCKU15P-2FFVE1760E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O voltage flexibility (1.2 V to 1.8 V), thermal performance in FFVE1760 package, and configuration security options.
Technical Context
The XCKU15P-2FFVE1760E implements a heterogeneous architecture with programmable logic, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers. It integrates 24 UltraScale+ transceivers operating up to 25.78125 Gb/s with PMA/PMD compliance to IEEE 802.3bj and CEI-28G-VSR.
Configuration is supported via dual-boot QSPI, BPI, or JTAG, with AES-256 bitstream encryption and HMAC authentication. The device uses SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,024,000 - Enables complex algorithm acceleration and multi-channel signal processing pipelines. |
| Block RAM | 72.5 Mb - Supports large on-die buffering for video frame storage or packet queuing. |
| DSP Slices | 840 - Delivers >10 TFLOPS INT8 compute for real-time radar FFT and beamforming. |
| Transceivers | 24 × 25.78125 Gb/s - Meets 5G eCPRI and CPRI fronthaul latency and bandwidth requirements. |
| I/O Standards | SSTL-12/15/18, HSTL-I/II, LVDS, TMDS - Allows direct interface to DDR4, MIPI D-PHY, and HDMI PHYs. |
| Configuration Security | AES-256 + HMAC - Prevents unauthorized bitstream cloning and field reprogramming. |
Pinout & Package
The XCKU15P-2FFVE1760E is housed in a 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) with 0.8 mm pitch, designed for high thermal dissipation and signal integrity in air-cooled 5G baseband cards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC/MGTAVTT | Analog power for transceivers | Requires ultra-low-noise regulation to maintain <0.3 UI jitter at 25.78 Gb/s. |
| VRP/VRN | Reference voltage inputs | Set I/O bank termination voltage for SSTL/HSTL interfaces to DDR4 memory. |
| CONFIG_IO[0:3] | Configuration mode select | Determines boot source (QSPI/BPI/JTAG) and configuration width (x1/x2/x4/x8/x16). |
| INIT_B | Configuration status output | Active-low open-drain signal indicating successful bitstream loading or CRC error. |
| PROGRAM_B | Configuration reset input | Asynchronous active-low trigger to restart configuration sequence and clear FPGA state. |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Enables time-multiplexed logic sharing across multiple functions without timing penalty. |
| PCIe Gen4 Hard IP | Reduces RTL integration effort and guarantees sub-100 ns transaction latency for host-FPGA communication. |
| DDR4 Memory Controller | Supports dual-rank 72-bit wide DDR4-2400 with ECC, enabling 172 GB/s memory bandwidth. |
| Partial Reconfiguration | Allows dynamic swapping of functional modules (e.g., modems, codecs) without system reset. |
| UltraScale+ Transceivers | Integrate CDR, gearbox, and FEC to meet IEEE 802.3bj KR4/KR2 specifications for backplane links. |
Applications
| 5G Massive MIMO Baseband Processing | Radar Signal Processing Unit |
|---|---|
Use Scenario: Real-time beamforming and channel estimation across 64+ antenna elements in sub-6 GHz 5G base stations. IC Role / Device Role / Timing Role: Primary programmable logic fabric executing OFDM symbol processing, MIMO matrix inversion, and precoding. Use Value: 840 DSP slices deliver >10 TFLOPS INT8 throughput, meeting 3GPP Release 16 latency targets under 100 µs per slot. | Use Scenario: Pulse-Doppler processing and CFAR detection in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: High-throughput digital receiver front-end handling ADC sampling at 2.4 GS/s and real-time FFTs. Use Value: 72.5 Mb block RAM enables full-frame storage of 16k-point complex FFT outputs for clutter suppression. |
| High-Speed Test Equipment Platform | Avionics Data Concentrator |
Use Scenario: Modular PXIe chassis supporting multi-protocol stimulus/response generation (JESD204B, Aurora, CPRI). IC Role / Device Role / Timing Role: Protocol-agnostic interconnect hub with deterministic low-latency forwarding between instrument modules. Use Value: 24 × 25.78 Gb/s transceivers enable simultaneous JESD204B subclass 1 links to 8 ADC/DAC modules. | Use Scenario: ARINC 664 Part 7 (AFDX) and MIL-STD-1553B bridging in fly-by-wire avionics racks. IC Role / Device Role / Timing Role: Deterministic network switch with hardware timestamping and traffic shaping engines. Use Value: AES-256 encryption and HMAC authentication ensure secure partitioning of safety-critical and non-critical data streams. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-1FFVE1760I | Slower speed grade (-1 vs -2), lower max transceiver rate (16.3 Gb/s), reduced DSP slice timing margin. | Suitable for cost-sensitive radar front-ends where 25G transceivers are unused. | Select when full 25.78 Gb/s line rate and worst-case timing closure are not required. |
| XCKU19P-2FFVE1760E | Higher logic density (1,375K cells), +35% more DSP slices (1140), same package and pinout. | Required for AI-accelerated 5G RAN inference or multi-beam satellite modem stacking. | Choose when additional logic resources or DSP capacity exceed XCKU15P-2FFVE1760E limits. |
Compared with XCKU15P-2FFVE1760E, the -1FFVE1760I trades transceiver performance for cost, while the XCKU19P-2FFVE1760E extends scalability within identical mechanical and thermal constraints-enabling design reuse across performance tiers without PCB revision.
Availability
XCKU15P-2FFVE1760E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-speed test equipment requiring stable component supply across extended production lifecycles.
Supply support for XCKU15P-2FFVE1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets.
The Kintex UltraScale+ family delivers optimized performance-per-watt for high-throughput, low-latency signal and packet processing in communications and defense systems.
FAQ
What is the maximum transceiver line rate supported by the XCKU15P-2FFVE1760E?
The XCKU15P-2FFVE1760E supports a maximum transceiver line rate of 25.78125 Gb/s per lane, compliant with IEEE 802.3bj KR4 and CEI-28G-VSR standards. This enables direct interface to 25G Ethernet, CPRI, and JESD204B subclass 1 devices without external retimers. The XCKU15P-2FFVE1760E achieves this using integrated PMA with adaptive equalization and low-jitter CDR.
Does the XCKU15P-2FFVE1760E support PCIe Gen4 x16 root complex functionality?
Yes, the XCKU15P-2FFVE1760E integrates hardened PCIe Gen4 root complex and endpoint blocks supporting x16 configurations with full AXI4 streaming interface. It delivers end-to-end latency below 95 ns and supports TLP routing, completion timeout, and advanced error reporting per PCI-SIG specification. The XCKU15P-2FFVE1760E requires no external PHY and operates at 16 GT/s per lane.
What configuration modes are supported by the XCKU15P-2FFVE1760E?
The XCKU15P-2FFVE1760E supports master SPI (x1/x2/x4), slave parallel (x8/x16), and JTAG configuration modes. Dual-boot capability allows fallback to secondary bitstream stored in QSPI flash upon CRC failure. Configuration is secured via AES-256 bitstream encryption and HMAC authentication. The XCKU15P-2FFVE1760E also supports partial reconfiguration through ICAP interface.
What I/O standards does the XCKU15P-2FFVE1760E support for DDR4 memory interfacing?
The XCKU15P-2FFVE1760E supports SSTL-12 and SSTL-15 I/O standards for DDR4 memory interfaces, with dedicated hard memory controller IP supporting dual-rank 72-bit wide DDR4-2400 with ECC. Each I/O bank can be independently powered at 1.2 V or 1.5 V, and VRP/VRN pins set termination reference voltages. The XCKU15P-2FFVE1760E meets JEDEC DDR4-2400 timing specifications under industrial temperature range.
Is the XCKU15P-2FFVE1760E pin-compatible with other Kintex UltraScale+ devices in the FFVE1760 package?
The XCKU15P-2FFVE1760E shares the FFVE1760 package footprint and ball map with XCKU19P-2FFVE1760E and XCKU115-2FFVE1760E, enabling mechanical and thermal design reuse. However, I/O bank assignments, transceiver locations, and configuration pin functions differ across variants. The XCKU15P-2FFVE1760E requires specific pin constraints and cannot be substituted without verifying I/O voltage, bank compatibility, and transceiver mapping in Vivado.
XCKU15P-2FFVE1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 668
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU15P-2FFVE1760E FAQ
1.How can I place an order for XCKU15P-2FFVE1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-2FFVE1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-2FFVE1760E reliable?
The price and inventory of XCKU15P-2FFVE1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-2FFVE1760E is usually 5 days.
3.What payment methods are accepted for XCKU15P-2FFVE1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-2FFVE1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-2FFVE1760E?
XCKU15P-2FFVE1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-2FFVE1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-2FFVE1760E?
For technical support, including XCKU15P-2FFVE1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-2FFVE1760E requirements.
6.How does Aetrix verify that XCKU15P-2FFVE1760E is sourced from the original manufacturer or authorized distributors?
All XCKU15P-2FFVE1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-2FFVE1760E meets industry standards.
7.What is the process for return or replacement of XCKU15P-2FFVE1760E?
All XCKU15P-2FFVE1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-2FFVE1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-2FFVE1760E part is unused and in its original packaging.
Return procedure for XCKU15P-2FFVE1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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