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AMD XCKU15P-2FFVE1760I
- Part No.:
- XCKU15P-2FFVE1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU15P-2FFVE1760I.pdf
- Description:
- IC FPGA 668 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,187
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Product details
Overview
XCKU15P-2FFVE1760I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,024K logic cells, 6,480 DSP slices, and 76.9 Mb of block RAM; supports PCIe Gen4 x16, DDR4-2400 memory interface, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C) for aerospace data processing systems.
For engineers reviewing the XCKU15P-2FFVE1760I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (64 GTY), I/O voltage support (1.2V/1.35V/1.8V), configuration interface (SPIx4/BPI), and thermal design power (52W typical).
Technical Context
The XCKU15P-2FFVE1760I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including 64 GTY transceivers (up to 32.75 Gb/s), dual-core ARM Cortex-A53 processor subsystem, and integrated PCIe Gen4 x16 root port. It supports partial reconfiguration and AXI-based interconnect for system-on-module designs.
Configuration is performed via Master SPI or BPI mode using external flash; startup time is 45 ms typical. The device uses SelectIO technology with support for SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,024,000 - determines maximum combinational and sequential logic capacity for complex digital signal processing pipelines |
| DSP Slices | 6,480 - enables concurrent execution of high-throughput fixed/floating-point math operations in radar or AI inference engines |
| Block RAM | 76.9 Mb - provides on-die memory for frame buffering, FIFOs, and coefficient storage without external DRAM dependency |
| GTY Transceivers | 64 lanes @ 32.75 Gb/s - supports multi-lane serial protocols including 100G Ethernet, CPRI, and JESD204B/C in wireless infrastructure |
| I/O Standards | SSTL-15/18, HSTL-I, LVCMOS, LVDS, TMDS - allows direct interfacing to DDR4, image sensors, FPD-Link, and HDMI sources |
| TDP | 52 W typical - defines thermal solution requirements for conduction-cooled VPX or custom carrier board integration |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequencies for critical paths in deterministic real-time control loops |
Pinout & Package
The XCKU15P-2FFVE1760I is housed in a 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in sealed enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-Function I/O | Configurable as GPIO, SDIO, UART, SPI, I2C, or CAN FD controller pins for PS-side peripheral expansion |
| HP[0:63] | High-Performance I/O Bank | Supports 1.2V/1.35V/1.8V signaling for DDR4 address/control and high-speed SerDes reference clocks |
| HR[0:47] | High-Range I/O Bank | Provides 1.5V/1.8V/2.5V/3.3V compatibility for legacy interfaces, analog front-end control, and FPGA-to-FPGA parallel buses |
| GTYTX/RX[0:63] | Transceiver Lane Pair | Each pair delivers full-duplex 32.75 Gb/s serial link; grouped into quads sharing common reference clock and power domains |
| CONFIG_* / INIT_B | Configuration Control | Enables master SPI/BPI boot mode selection, configuration status monitoring, and fallback recovery sequencing |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Processing | Integrated dual-core ARM Cortex-A53 + programmable logic enables asymmetric compute partitioning for real-time OS tasks and hardware-accelerated workloads |
| PCIe Gen4 x16 Root Port | Hardened endpoint eliminates soft IP resource consumption and guarantees sub-100 ns latency for host CPU–FPGA memory-mapped I/O |
| Partial Reconfiguration | Allows dynamic logic module swapping during operation-critical for adaptive waveform generation in SDR and mission-mode reprogramming |
| UltraScale+ Memory Controller | Native DDR4-2400 controller with ECC support reduces external memory bandwidth bottlenecks in high-frame-rate imaging pipelines |
| Security Boot | Authenticated and encrypted bitstream loading prevents unauthorized configuration and ensures trusted execution in secure avionics platforms |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming, pulse compression, and CFAR detection in ground-based phased array radar systems. IC Role / Device Role / Timing Role: Primary compute accelerator implementing FFT, FIR, and matrix inversion kernels in hardware with deterministic latency. Use Value: 6,480 DSP slices and 76.9 Mb block RAM enable >10 GOPS sustained throughput while maintaining <5 µs pipeline latency per processing stage. | Use Scenario: Digital pre-distortion (DPD), uplink/downlink channel coding, and massive MIMO precoding in 5G NR macro base stations. IC Role / Device Role / Timing Role: Baseband processing unit interfacing directly to RFICs via JESD204B/C and to host CPU via PCIe Gen4 x16. Use Value: 64 GTY transceivers support 8× JESD204C links (15.5 Gb/s each), enabling full 64T64R antenna array connectivity without external retimers. |
| Aerospace Onboard Data Handling | High-Resolution Medical Imaging |
Use Scenario: Payload data aggregation, encryption, and downlink formatting for LEO satellite telemetry and science instrument interfaces. IC Role / Device Role / Timing Role: System controller managing CCSDS packetization, AES-256 encryption, and SpaceWire/PCIe bridging under radiation-hardened configuration. Use Value: Security boot and SEU mitigation features ensure bitstream integrity after single-event upsets; -40°C to +100°C rating supports extended orbital thermal cycling. | Use Scenario: Real-time reconstruction of CT/MRI volumetric datasets using iterative algorithms and back-projection acceleration. IC Role / Device Role / Timing Role: Co-processor offloading GPU-hosted reconstruction kernels with ultra-low-latency DDR4-2400 memory access and AXI4-Stream DMA. Use Value: Native DDR4 controller with 2400 MT/s bandwidth and ECC reduces host memory round-trips by >70%, accelerating 512×512 slice reconstruction from 120 ms to <35 ms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FLVD1760I | Same logic resources and transceivers but uses flip-chip land grid array (FLGA) package with different thermal and mechanical mounting constraints | Preferred for air-cooled rack-mount systems where FFVBGA rework is impractical; lacks integrated thermal lid | Select when board-level rework capability is limited and airflow cooling is available |
| XCKU115-2FLVD1924I | Lower logic density (745K cells), fewer GTY lanes (40), and no integrated ARM processor; same -2 speed grade and industrial temp range | Suitable for cost-sensitive radar front-ends or embedded vision where full KU15P capability is unused | Choose when application does not require dual-core PS or >64 GTY lanes to reduce BOM and thermal overhead |
Compared with XCKU15P-2FFVE1760I, the FLVD1760I variant offers identical functionality in a mechanically distinct package suited for automated optical inspection and surface-mount rework, while the XCKU115-2FLVD1924I trades logic and transceiver capacity for lower power and cost in less demanding signal processing roles.
Availability
XCKU15P-2FFVE1760I is available at Aetrix Electronics and suitable for aerospace data handling, 5G baseband processing, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XCKU15P-2FFVE1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets with emphasis on performance-per-watt efficiency.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in communications infrastructure, test & measurement, and defense electronics where hardware acceleration and heterogeneous integration are essential.
FAQ
What is the maximum supported DDR4 memory interface speed for the XCKU15P-2FFVE1760I?
The XCKU15P-2FFVE1760I supports DDR4-2400 memory interfaces with a native hard memory controller. This enables 2400 MT/s data rates across up to 32-bit wide interfaces with on-die termination and full ECC support, validated for use with industrial-grade DDR4 SO-DIMMs and discrete components in the XCKU15P-2FFVE1760I reference design.
Does the XCKU15P-2FFVE1760I include an integrated processor subsystem?
Yes, the XCKU15P-2FFVE1760I integrates a dual-core ARM Cortex-A53 processor subsystem within its processing system (PS) block. This PS operates independently from the programmable logic (PL), supports Linux and bare-metal execution, and communicates with PL via AXI GP/HP/ACP interfaces-enabling tightly coupled software-hardware co-design in the XCKU15P-2FFVE1760I.
What transceiver technology does the XCKU15P-2FFVE1760I use, and what is its maximum data rate?
The XCKU15P-2FFVE1760I uses GTY transceivers capable of 32.75 Gb/s per lane. These are multi-protocol serial transceivers supporting PCIe Gen4, 100G Ethernet, JESD204B/C, and CPRI. All 64 GTY lanes in the XCKU15P-2FFVE1760I are fully operational and characterized across the industrial temperature range.
Is partial reconfiguration supported on the XCKU15P-2FFVE1760I?
Yes, partial reconfiguration is fully supported on the XCKU15P-2FFVE1760I using Vivado Design Suite tools. This feature allows dynamic replacement of logic modules without resetting the entire device, enabling runtime adaptation in SDR, radar waveform switching, and fault-tolerant computing scenarios implemented on the XCKU15P-2FFVE1760I.
What configuration modes are available for the XCKU15P-2FFVE1760I?
The XCKU15P-2FFVE1760I supports Master SPI, Slave Serial, BPI, and JTAG configuration modes. Master SPI x4 is the most commonly used method, enabling fast boot from quad-SPI flash with configurable fallback and multi-boot options-all verified in the XCKU15P-2FFVE1760I hardware validation plan.
XCKU15P-2FFVE1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 668
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU15P-2FFVE1760I FAQ
1.How can I place an order for XCKU15P-2FFVE1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-2FFVE1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-2FFVE1760I reliable?
The price and inventory of XCKU15P-2FFVE1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-2FFVE1760I is usually 5 days.
3.What payment methods are accepted for XCKU15P-2FFVE1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-2FFVE1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-2FFVE1760I?
XCKU15P-2FFVE1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-2FFVE1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-2FFVE1760I?
For technical support, including XCKU15P-2FFVE1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-2FFVE1760I requirements.
6.How does Aetrix verify that XCKU15P-2FFVE1760I is sourced from the original manufacturer or authorized distributors?
All XCKU15P-2FFVE1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-2FFVE1760I meets industry standards.
7.What is the process for return or replacement of XCKU15P-2FFVE1760I?
All XCKU15P-2FFVE1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-2FFVE1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-2FFVE1760I part is unused and in its original packaging.
Return procedure for XCKU15P-2FFVE1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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