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AMD XCKU15P-3FFVA1156E
- Part No.:
- XCKU15P-3FFVA1156E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU15P-3FFVA1156E.pdf
- Description:
- IC FPGA 516 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,087
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Product details
Overview
XCKU15P-3FFVA1156E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,024K logic cells, 5,520 DSP slices, and 72.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for high-bandwidth data acceleration in AI inference engines and 5G baseband processing.
For engineers reviewing the XCKU15P-3FFVA1156E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage support, thermal design power (TDP), and configuration interface compatibility with BPI or SPIx4.
Technical Context
The XCKU15P-3FFVA1156E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers (DDR4/LPDDR4), and integrated hard IP including PCIe Gen4 Root Port/Endpoint, 100G Ethernet MAC, and hardened AES-256 encryption. Its -3 speed grade guarantees operation up to 800 MHz on internal logic paths.
It supports multi-voltage I/O banks (1.2 V to 1.8 V), configurable differential standards (LVDS, MIPI D-PHY), and dual-boot configuration via Quad-SPI flash. The device uses AMD's 16 nm FinFET process and includes dedicated clock management tiles with MMCM and PLL blocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,024,000 - determines maximum combinational and sequential logic capacity for custom datapaths |
| DSP Slices | 5,520 - enables concurrent execution of 27×18-bit multiply-accumulate operations per slice |
| Block RAM | 72.5 Mb - provides on-chip memory for FIFOs, buffers, and lookup tables without external DRAM |
| GTY Transceivers | 64 lanes @ 25.8 Gb/s - supports 100G Ethernet, CPRI, and high-speed serial backplanes |
| I/O Pins | 652 user I/O - supports multiple high-speed interfaces with bank-wise voltage and standard assignment |
| Speed Grade | -3 - guarantees timing closure at highest performance tier for critical path timing analysis |
| Configuration Interface | BPI x16 / Quad-SPI - enables fast parallel or secure serial bitstream loading during boot |
Pinout & Package
The XCKU15P-3FFVA1156E is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) package with 35×35 mm body size and 0.8 mm ball pitch. Thermal and mechanical data comply with JEDEC MO-271AB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS-side peripherals |
| HP[0:63] | High-Performance I/O Bank | Supports 1.2–1.8 V signaling and LVDS/MIPI D-PHY for high-speed SerDes interfaces |
| HR[0:95] | High-Density I/O Bank | Provides flexible single-ended and differential I/O with programmable slew and drive strength |
| CLK_IN_0/1 | Dedicated Clock Input | Feeds MMCM/PLL clock management tiles; low-jitter input required for transceiver reference clocks |
| CONFIG_MODE[0:2] | Configuration Mode Select | Determines boot source (BPI, SPI, JTAG) and bus width during power-up initialization |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Endpoint/Root Port | Reduces RTL integration effort and ensures protocol compliance without soft-core overhead |
| Integrated 100G Ethernet MAC + RS-FEC | Enables line-rate packet processing for optical transport and data center interconnect |
| AES-256 Bitstream Encryption | Protects intellectual property against physical bitstream extraction and cloning attacks |
| UltraScale+ Memory Controller (DDR4/LPDDR4) | Delivers up to 25.6 GB/s memory bandwidth with sub-100 ns latency for AI accelerator memory subsystems |
| Partial Reconfiguration Support | Allows dynamic logic module swapping without full device reboot-critical for mission-critical runtime adaptation |
Applications
| AI Acceleration Engine | 5G Massive MIMO Baseband Unit |
|---|---|
Use Scenario: Real-time inference on vision transformer models using custom systolic arrays. IC Role / Device Role / Timing Role: Programmable logic fabric executes low-latency matrix multiplication; GTY transceivers feed data from high-speed ADCs and offload results to NVMe SSDs. Use Value: Achieves >128 TOPS/W efficiency with deterministic sub-microsecond latency for closed-loop control loops. | Use Scenario: Digital pre-distortion (DPD) and channel estimation in 256-antenna active antenna systems. IC Role / Device Role / Timing Role: Hosts real-time DPD coefficient update engine and FFT/IFFT pipelines; PCIe Gen4 x16 interfaces with host CPU for parameter updates. Use Value: Enables 400 MHz instantaneous bandwidth processing with <1.5 μs loop latency for adaptive RF calibration. |
| High-Frequency Trading Switch | Avionics Data Concentrator Unit |
Use Scenario: Ultra-low-latency order matching and market data filtering across 32 FPGA-accelerated trading nodes. IC Role / Device Role / Timing Role: Implements deterministic time-stamped packet parsing, rule-based filtering, and nanosecond-precision timestamp injection using integrated timestamping logic. Use Value: Delivers consistent 38 ns wire-to-wire latency with jitter <±500 ps across all 64 I/O channels. | Use Scenario: ARINC 664 Part 7 (AFDX) and MIL-STD-1553B protocol bridging in fly-by-wire flight control systems. IC Role / Device Role / Timing Role: Acts as deterministic protocol gateway with hardware-enforced traffic shaping, redundancy management, and end-to-end CRC validation. Use Value: Meets DO-254 DAL-A requirements with dual-lockstep configuration and ECC-protected configuration memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156I | Lower -2 speed grade; reduced max frequency (600 MHz vs. 800 MHz); higher operating temperature range (–40°C to +100°C) | Suitable for thermally constrained industrial enclosures where peak performance is secondary to extended temperature operation | Select when thermal margin exceeds timing margin and TDP budget allows for relaxed speed grade |
| XCKU19P-3FFVA1760E | Larger die with 1,325K logic cells, 6,840 DSP slices, and 1760-ball package; same -3 speed grade and GTY transceiver spec | Required for designs needing >1.1M LUTs or >64 GTY lanes; demands larger PCB area and enhanced thermal solution | Choose only when XCKU15P-3FFVA1156E resource utilization exceeds 90% in place-and-route |
Compared with XCKU15P-2FFVA1156I, the XCKU15P-3FFVA1156E delivers higher throughput at elevated junction temperatures; compared with XCKU19P-3FFVA1760E, it offers identical speed and transceiver capability in a smaller footprint and lower power envelope-ideal for space-constrained 5G and AI edge deployments.
Availability
XCKU15P-3FFVA1156E is available at Aetrix Electronics and suitable for AI inference accelerators, 5G baseband units, and avionics data concentrators requiring stable component supply across multi-year production cycles.
Supply support for XCKU15P-3FFVA1156E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through its Adaptive SoC and FPGA product lines.
The Kintex UltraScale+ family targets high-throughput, low-latency applications demanding hardened connectivity, cryptographic security, and scalable logic resources-designed specifically for 5G infrastructure, AI acceleration, and safety-critical embedded systems.
FAQ
What is the maximum supported DDR4 memory data rate for the XCKU15P-3FFVA1156E?
The XCKU15P-3FFVA1156E supports DDR4 memory interfaces up to 2400 MT/s with the UltraScale+ memory controller. This rate is achievable with proper board-level signal integrity, termination, and timing closure using AMD Vivado tools. The controller includes built-in calibration logic and supports RDIMM/LRDIMM topologies. XCKU15P-3FFVA1156E implementation requires careful attention to address/command bus skew and write leveling sequences.
Does the XCKU15P-3FFVA1156E support partial reconfiguration?
Yes, the XCKU15P-3FFVA1156E fully supports partial reconfiguration as defined in AMD's UltraScale+ architecture. It allows dynamic replacement of logical modules while the rest of the design remains operational. This capability is enabled by dedicated configuration logic and frame-based bitstream addressing. XCKU15P-3FFVA1156E implementations require use of Vivado's PR flow and adherence to hierarchical design constraints.
What configuration modes does the XCKU15P-3FFVA1156E support?
The XCKU15P-3FFVA1156E supports BPI x8/x16, Quad-SPI x4, JTAG, and Master/Slave SelectMAP modes. Configuration mode is selected via CONFIG_MODE pins at power-up. Quad-SPI is commonly used for secure, compact boot storage; BPI x16 enables fastest parallel loading. XCKU15P-3FFVA1156E also supports dual-boot with fallback image stored in separate flash sectors.
Is the XCKU15P-3FFVA1156E qualified for automotive applications?
No, the XCKU15P-3FFVA1156E is not AEC-Q100 qualified and is not intended for automotive safety-critical applications. It belongs to AMD's commercial/industrial temperature grade (-40°C to +100°C for I-grade variants). For automotive use, AMD offers the Zynq UltraScale+ MPSoC family with ASIL-B certification. XCKU15P-3FFVA1156E is rated for industrial and aerospace environments but lacks automotive-specific qualification documentation.
How many GTY transceiver quads does the XCKU15P-3FFVA1156E contain?
The XCKU15P-3FFVA1156E contains 16 GTY transceiver quads, totaling 64 individual transceiver lanes. Each quad supports independent reference clocking and can be configured for protocols including PCIe Gen4, 100G Ethernet, and CPRI. XCKU15P-3FFVA1156E transceiver placement follows columnar distribution across the die to minimize routing congestion and maintain signal integrity.
XCKU15P-3FFVA1156E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 516
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU15P-3FFVA1156E FAQ
1.How can I place an order for XCKU15P-3FFVA1156E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-3FFVA1156E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-3FFVA1156E reliable?
The price and inventory of XCKU15P-3FFVA1156E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-3FFVA1156E is usually 5 days.
3.What payment methods are accepted for XCKU15P-3FFVA1156E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-3FFVA1156E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-3FFVA1156E?
XCKU15P-3FFVA1156E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-3FFVA1156E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-3FFVA1156E?
For technical support, including XCKU15P-3FFVA1156E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-3FFVA1156E requirements.
6.How does Aetrix verify that XCKU15P-3FFVA1156E is sourced from the original manufacturer or authorized distributors?
All XCKU15P-3FFVA1156E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-3FFVA1156E meets industry standards.
7.What is the process for return or replacement of XCKU15P-3FFVA1156E?
All XCKU15P-3FFVA1156E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-3FFVA1156E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-3FFVA1156E part is unused and in its original packaging.
Return procedure for XCKU15P-3FFVA1156E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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