AMD XCKU15P-3FFVA1760E

Overview

XCKU15P-3FFVA1760E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,085,200 logic cells, 6,480 DSP slices, and 76.9 Mb of block RAM. It integrates hardened 25.78 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for high-bandwidth data acceleration in AI inference accelerators and 5G radio units.

For engineers reviewing the XCKU15P-3FFVA1760E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal performance under sustained 28W TDP, and configuration interface options (e.g., dual BPI, QSPI, JTAG).

Technical Context

The XCKU15P-3FFVA1760E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and multi-rate transceivers. It supports partial reconfiguration and dynamic function exchange for runtime adaptation.

Its FFVA1760 package provides 656 user I/Os across 24 selectable I/O banks, each configurable for LVDS, SSTL, HSTL, or MIPI signaling. The -3 speed grade guarantees timing closure at 25.78 Gb/s transceiver operation with ≤1.2 ns input jitter tolerance.

Key Specifications

Pinout & Package

The XCKU15P-3FFVA1760E is housed in a 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and integrated thermal lid for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU15P-3FFVA1760E, the -2 variant trades transceiver speed and logic density for lower cost and thermal load, while the XCKU19P-3FFVA2104E extends scalability at the expense of board area and power delivery complexity.

Availability

XCKU15P-3FFVA1760E is available at Aetrix Electronics and suitable for 5G infrastructure, AI acceleration, and high-frequency trading systems requiring stable component supply and long-term lifecycle assurance.

Supply support for XCKU15P-3FFVA1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies for data centers, client devices, and embedded systems.

The Kintex UltraScale+ family targets high-throughput, low-latency applications in wired/wireless infrastructure and compute acceleration, balancing performance, power efficiency, and I/O flexibility.

FAQ

What is the maximum supported transceiver data rate for XCKU15P-3FFVA1760E?

The XCKU15P-3FFVA1760E supports GTY transceivers operating at up to 25.78 Gb/s per lane, validated per UG578 v1.14. This rate is guaranteed for all 40 GTY lanes under -3 speed grade conditions with ≤1.2 ns input jitter and proper reference clock stability. XCKU15P-3FFVA1760E achieves this using adaptive equalization and continuous-time linear equalization (CTLE) circuitry integrated into each receiver.

Does XCKU15P-3FFVA1760E support PCIe Gen4 x16 root complex functionality?

Yes, XCKU15P-3FFVA1760E includes a hardened PCIe Gen4 x16 root complex controller compliant with PCI Express Base Specification Revision 4.0. It supports link training, error reporting, and Advanced Error Reporting (AER), and has been verified with Intel and AMD host platforms. XCKU15P-3FFVA1760E enables full-duplex 32 GB/s aggregate bandwidth with end-to-end transaction ordering guarantees.

What configuration modes are supported by XCKU15P-3FFVA1760E?

XCKU15P-3FFVA1760E supports multiple configuration modes including master BPI (x16), slave BPI (x16), QSPI x4, JTAG, and SelectMAP. Dual BPI mode allows redundant flash storage for fail-safe updates. Configuration occurs via dedicated CONFIG_IO pins mapped to Bank 65, with automatic fallback to secondary source if primary fails. XCKU15P-3FFVA1760E also supports encrypted bitstream loading using AES-GCM keys stored in eFUSE.

Can XCKU15P-3FFVA1760E implement partial reconfiguration in production systems?

Yes, XCKU15P-3FFVA1760E fully supports partial reconfiguration (PR) as defined in UG908. It allows dynamic swapping of logical partitions without resetting the entire device, validated for use cases like 5G NR/LTE mode switching and multi-standard radio frontends. XCKU15P-3FFVA1760E requires Vivado 2022.2 or later and adheres to strict placement constraints for PR boundaries to ensure timing integrity across reconfigurable regions.

What thermal management guidance applies to XCKU15P-3FFVA1760E in continuous operation?

XCKU15P-3FFVA1760E has a typical TDP of 28 W and requires active cooling with ≥35 CFM airflow over a 35 mm × 35 mm thermal lid. PCB layout must include ≥12 thermal vias under the package, filled with conductive epoxy, and connect to internal ground/power planes. Thermal simulation per UG578 confirms junction temperature remains below 100°C at 85°C ambient with proper heatsink mounting pressure (35–55 psi). XCKU15P-3FFVA1760E thermal pad is soldered directly to the PCB for optimal conduction.