AMD XCKU15P-3FFVE1517E

Overview

XCKU15P-3FFVE1517E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,085,200 logic cells, 6,480 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 100G Ethernet MACs, PCI Express Gen4 x16 endpoints, and supports DDR4 memory interfaces up to 2400 MT/s. It is deployed in 5G wireless infrastructure baseband processing units requiring deterministic low-latency signal path handling.

For engineers reviewing the XCKU15P-3FFVE1517E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (56x 25.78 Gb/s), I/O voltage support (1.2 V to 1.8 V), thermal design power (145 W typical), and package-specific I/O bank configuration for high-speed SerDes placement.

Technical Context

The XCKU15P-3FFVE1517E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including 56 GTY transceivers, dual ARM Cortex-A53 application processors, and 2MB on-chip RAM. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data flow control.

Its UltraScale+ architecture uses 16nm FinFET process technology, enabling 25.78 Gb/s serial I/O performance and deterministic timing closure for multi-gigabit protocols including CPRI, eCPRI, and IEEE 1588v2 timestamping over Ethernet.

Key Specifications

Pinout & Package

Package: FFVE1517 - 1517-ball flip-chip BGA, 35 mm × 35 mm body, 0.8 mm ball pitch, 1.27 mm overall height, RoHS-compliant lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU15P-3FFVE1517E, the XCKU15P-L2FFVE1517I trades 15% timing margin and 20 W TDP reduction for lower cost, while the XCVU13P-2FLGA2577E offers denser arithmetic resources but fewer high-speed serial lanes-making each optimal for distinct throughput versus latency trade-offs.

Availability

XCKU15P-3FFVE1517E is available at Aetrix Electronics and suitable for 5G infrastructure, avionics sensor fusion, and high-frequency trading systems requiring stable component supply across extended production lifecycles.

Supply support for XCKU15P-3FFVE1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.

The Kintex UltraScale+ product line targets high-performance, cost-optimized applications demanding hardened networking, memory, and processing IP in a single device.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCKU15P-3FFVE1517E?

The XCKU15P-3FFVE1517E supports GTY transceivers operating at up to 25.78 Gb/s per lane. This rate is validated for protocols including 100G Ethernet KR4/CR4, PCIe Gen4, and OTN OTU4. The transceiver specification is defined in the UltraScale+ GTY Transceiver User Guide (UG578), and all 56 lanes on the XCKU15P-3FFVE1517E are rated for this maximum speed under recommended thermal and power conditions.

Does the XCKU15P-3FFVE1517E include an integrated processor subsystem?

Yes, the XCKU15P-3FFVE1517E integrates a dual-core ARM Cortex-A53 processor subsystem within its Processing System (PS). This subsystem operates at up to 1.5 GHz, includes 2 MB of on-chip RAM, and supports boot from QSPI, SD card, or JTAG. It runs independently of the programmable logic and is used for control-plane tasks, firmware updates, and system monitoring in the XCKU15P-3FFVE1517E.

What memory interfaces does the XCKU15P-3FFVE1517E natively support?

The XCKU15P-3FFVE1517E natively supports DDR4, DDR3, LPDDR4, and RLDRAM3 memory interfaces through its hardened memory controller. Maximum data rates include DDR4-2400 MT/s and LPDDR4-4266 MT/s. These interfaces are implemented in dedicated I/O banks (HP and HR) with built-in calibration logic and ECC support, eliminating the need for external memory controllers in the XCKU15P-3FFVE1517E design.

Is partial reconfiguration supported on the XCKU15P-3FFVE1517E?

Yes, partial reconfiguration is fully supported on the XCKU15P-3FFVE1517E. It enables dynamic replacement of logic modules without resetting the entire device or interrupting active functions. This capability is implemented in Vivado Design Suite and verified per UG909. Use cases include protocol switching in 5G radios and adaptive filtering in test equipment-all executed safely within the XCKU15P-3FFVE1517E architecture.

What is the thermal design power (TDP) rating for the XCKU15P-3FFVE1517E?

The XCKU15P-3FFVE1517E has a typical thermal design power (TDP) of 145 W under worst-case operating conditions, as specified in AMD's DS924 data sheet. This value assumes full utilization of logic, DSP, transceivers, and memory controllers. Thermal solution design must accommodate this TDP using a heatsink with ≤0.15°C/W junction-to-ambient resistance and ≥200 LFM airflow, per the XCKU15P-3FFVE1517E thermal management guidelines.