AMD XCKU15P-3FFVE1760E

Overview

XCKU15P-3FFVE1760E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,098K logic cells, 7,240 DSP slices, and 64.2 Mb of block RAM. It integrates hardened 25.78 Gb/s transceivers and supports PCI Express Gen4 x16, making it suitable for high-bandwidth data acceleration in AI inference accelerators.

For engineers reviewing the XCKU15P-3FFVE1760E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage support (1.2 V/1.35 V/1.8 V), and thermal design power (TDP) of 45 W under typical operation.

Technical Context

The XCKU15P-3FFVE1760E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers (DDR4/LPDDR4), and integrated 100G Ethernet MACs. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.

Its transceiver subsystem includes 64 GTY transceivers with PMA operating up to 25.78 Gb/s and PCS supporting multiple protocols including CPRI, JESD204B/C, and 100G KR4. The device uses a 16nm FinFET process and features dual-boot configuration capability via Quad-SPI or BPI.

Key Specifications

Pinout & Package

The XCKU15P-3FFVE1760E is housed in a 1760-pin FCBGA package (FFVE1760) with 0.8 mm pitch, designed for high-density interconnect and thermal dissipation in server-grade PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU15P-3FFVE1760E, the -2 speed grade offers lower power and cost at the expense of timing margin and transceiver headroom, while the XCKU19P variant expands compute capacity at higher thermal and layout cost-enabling trade-offs between density, bandwidth, and efficiency in FPGA-accelerated systems.

Availability

XCKU15P-3FFVE1760E is available at Aetrix Electronics and suitable for AI inference accelerators, 5G radio units, and high-frequency trading engines requiring stable component supply across long production cycles.

Supply support for XCKU15P-3FFVE1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and communications infrastructure.

The Kintex UltraScale+ family delivers optimized balance of logic, memory, and I/O for compute-intensive, low-latency applications including wireless infrastructure, test equipment, and edge AI platforms.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCKU15P-3FFVE1760E?

The XCKU15P-3FFVE1760E supports GTY transceivers operating up to 25.78 Gb/s per lane. This rate is validated for protocols including 100G Ethernet KR4, JESD204C, and CPRI over copper or optical interfaces. The -3 speed grade guarantees this performance across commercial temperature range with appropriate reference clock jitter specifications.

Does the XCKU15P-3FFVE1760E support DDR4 memory interfaces natively?

Yes, the XCKU15P-3FFVE1760E includes hardened UltraScale+ memory controllers that support DDR4-2400 (1200 MHz) with ECC and address/command parity. These controllers are implemented in dedicated silicon blocks outside the programmable logic fabric, ensuring deterministic timing and reduced resource consumption compared to soft IP implementations.

What configuration modes are supported by the XCKU15P-3FFVE1760E?

The XCKU15P-3FFVE1760E supports multiple configuration modes including Master SPI (Quad-SPI), Slave SelectMAP, and JTAG. It also enables dual-boot capability using two separate bitstreams stored in external flash, allowing field-upgradable firmware and fail-safe recovery without external intervention.

Is partial reconfiguration supported on the XCKU15P-3FFVE1760E?

Yes, the XCKU15P-3FFVE1760E fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logical regions during operation, enabling runtime adaptation in applications such as multi-standard wireless basebands or reconfigurable test instrumentation without full device reset.

What is the thermal design power (TDP) of the XCKU15P-3FFVE1760E under typical operation?

The XCKU15P-3FFVE1760E has a typical thermal design power (TDP) of 45 W, based on worst-case activity assumptions across logic, DSP, and transceiver usage. Actual power consumption varies with design utilization and I/O activity; AMD's XPE tool provides accurate estimation using user-specific netlist and timing constraints.